公开(公告)号：US20100221915A1

公开(公告)日：2010-09-02

申请号：US12776235

申请日：2010-05-07

Applicant: J.B. Price ,  Jed Keller ,  Laurence Dulmage ,  David Cheng

Inventor： J.B. Price ,  Jed Keller ,  Laurence Dulmage ,  David Cheng

IPC: H01L21/677 ,  H01L21/465

CPC classification number: H01L21/67178 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67742 ,  H01L21/67766 ,  Y10S414/139

Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

Abstract translation: 公开了一种用于半导体处理的方法和装置。 在一个实施例中，一种在群集工具内传送晶片的方法包括将晶片放置在真空封壳的第一段中，真空外壳附接到处理室和工厂接口。 使用垂直传送机构将晶片传送到真空外壳的第二部分，其中第二部分在第一部分之上或之下。

公开(公告)号：US07752233B2

公开(公告)日：2010-07-06

申请号：US11731008

申请日：2007-03-29

Applicant: Santosh Vempala ,  Grant Wang ,  Ravi Kannan ,  David Cheng

Inventor： Santosh Vempala ,  Grant Wang ,  Ravi Kannan ,  David Cheng

IPC: G06F17/30

CPC classification number: G06F17/3071 ,  G06F17/30625 ,  G06K9/6224

Abstract: Described are techniques for clustering a data set of objects. Divide phase processing is performed to partition the data set into two or more partitions forming a hierarchy of the objects. Merge phase processing may be performing using the hierarchy to determine one or more disjoint clusters of objects of the data set. Optional preprocessing may be performed to determine weights for one or more features of an object.

Abstract translation: 描述了用于聚类对象的数据集的技术。 执行分割相位处理以将数据集划分成形成对象的层次结构的两个或更多个分区。 可以使用层级来执行合并阶段处理以确定数据集的对象的一个​​或多个不相交的集群。 可以执行可选的预处理以确定对象的一个​​或多个特征的权重。

公开(公告)号：US07748944B2

公开(公告)日：2010-07-06

申请号：US11929357

申请日：2007-10-30

Applicant: JB Price ,  Jed Keller ,  Laurence Dulmage ,  David Cheng

Inventor： JB Price ,  Jed Keller ,  Laurence Dulmage ,  David Cheng

IPC: B65G49/07

CPC classification number: H01L21/67178 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67742 ,  H01L21/67766 ,  Y10S414/139

Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.

Abstract translation: 公开了一种用于半导体处理的方法和装置。 在一个实施例中，一种在群集工具内传送晶片的方法包括将晶片放置在真空封壳的第一段中，真空外壳附接到处理室和工厂接口。 使用垂直传送机构将晶片传送到真空外壳的第二部分，其中第二部分在第一部分之上或之下。

公开(公告)号：USD589411S1

公开(公告)日：2009-03-31

申请号：US29284658

申请日：2007-09-12

Applicant: Torr Brown ,  David Cheng ,  Chris Morse ,  Jae-won Sim

Designer： Torr Brown ,  David Cheng ,  Chris Morse ,  Jae-won Sim

公开(公告)号：US20070192810A1

公开(公告)日：2007-08-16

申请号：US11275626

申请日：2006-01-19

Applicant: Thaddeus Pritchett ,  Kenneth Reneris ,  Bernhard Kotzenberg ,  David Cheng

Inventor： Thaddeus Pritchett ,  Kenneth Reneris ,  Bernhard Kotzenberg ,  David Cheng

IPC: H04N5/445 ,  H04N7/173 ,  G06F3/00 ,  G06F13/00

CPC classification number: H04N5/913 ,  H04N5/4401 ,  H04N7/1675 ,  H04N21/4135 ,  H04N21/43615 ,  H04N21/4367 ,  H04N21/4408 ,  H04N21/4627 ,  H04N21/8355 ,  H04N2005/91328 ,  H04N2005/91364

Abstract: A tuning device uses a counter mode encryption cipher to encrypt counters associated with media content in order to protect the media content when it is sent to requesting device or controller. The encrypted counters are decrypted in order to consume the media content. The controller may send particular direction to the tuning device as to how the media content, encrypted counters, and other associated data are sent to the controller.

Abstract translation: 调谐设备使用计数器模式加密密码来加密与媒体内容相关联的计数器，以便在发送到请求设备或控制器时保护媒体内容。 加密的计数器被解密以便消耗媒体内容。 控制器可以向调谐设备发送关于如何将媒体内容，加密的计数器和其他相关联的数据发送到控制器的特定方向。

公开(公告)号：US20070093903A1

公开(公告)日：2007-04-26

申请号：US10569437

申请日：2004-10-05

Applicant: David Cheng

Inventor： David Cheng

IPC: A61F2/44 ,  A61B17/70

CPC classification number: A61F2/44 ,  A61B17/7059 ,  A61F2/441 ,  A61F2/442 ,  A61F2/4455 ,  A61F2/4611 ,  A61F2002/2817 ,  A61F2002/2835 ,  A61F2002/30383 ,  A61F2002/30507 ,  A61F2002/30517 ,  A61F2002/30586 ,  A61F2002/30599 ,  A61F2002/30785 ,  A61F2002/30892 ,  A61F2002/449 ,  A61F2220/0025 ,  A61F2250/0063

Abstract: Apparatuses and methods for single disc arthroplasty and multi-segmental spine replacement. The implant assembly includes a first cage (20) adapted to be rigidly attached to a first vertebra, a second cage (20) adapted to be rigidly attached to a second vertebrae, and a spinal disc replacement prosthesis (10) positioned between the first and second vertebrae. The spinal disc replacement prosthesis preferably includes a resilient body having two or more adjustable fluid-filled compartments.

Abstract translation: 单椎间盘关节置换术和多节段脊柱置换的装置和方法。 所述植入物组件包括适于刚性连接到第一椎骨的第一保持架（20），适于刚性地连接到第二椎骨的第二保持架（20），以及定位在所述第一和第二椎骨之间的脊椎椎间盘置换假体 第二椎骨 脊椎椎间盘置换假体优选地包括具有两个或更多个可调节流体填充的隔室的弹性体。

公开(公告)号：US06653853B1

公开(公告)日：2003-11-25

申请号：US10066391

申请日：2002-02-01

Applicant: David Cheng

Inventor： David Cheng

IPC: G01R1073

CPC classification number: G01R31/2887

Abstract: A multiple test probe system is disclosed. The multiple test probe system includes a support and a mount pivotally coupled to the support. The mount is capable of pivoting to a number of testing positions. A number of probe assemblies are coupled to the mount and associated with a corresponding number of testing positions. The probe assemblies include a number of electrical contacts coupled to a number of wires in a probe bus regardless of a testing position of the mount. The multiple test probe system further includes an indexing device coupled to the mount to cause the mount to move between the testing positions, whereby the indexing device is a multiple linear actuator assembly.

Abstract translation: 公开了一种多重测试探针系统。 多个测试探针系统包括支撑件和枢转地联接到支撑件的安装件。 该安装座能够枢转到多个测试位置。 多个探针组件耦合到安装件并与相应数量的测试位置相关联。 探针组件包括耦合到探针总线中的多个电线的多个电触头，而与安装座的测试位置无关。 多重测试探针系统还包括联接到安装件的分度装置，以使安装件在测试位置之间移动，由此分度装置是多线性致动器组件。

公开(公告)号：US06454519B1

公开(公告)日：2002-09-24

申请号：US08813480

申请日：1997-03-07

Applicant: Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

Inventor： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC: B65G4905

CPC classification number: H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US06366103B1

公开(公告)日：2002-04-02

申请号：US09348751

申请日：1999-07-06

Applicant: David Cheng

Inventor： David Cheng

IPC: G01R1073

CPC classification number: G01R31/2887

Abstract: A multiple test probe system is disclosed. The multiple test probe system includes a support and a mount pivotally coupled to the support. The mount is capable of pivoting to a number of testing positions. A number of probe assemblies are coupled to the mount and associated with a corresponding number of testing positions. The probe assemblies include a number of electrical contacts coupled to a number of wires in a probe bus regardless of a testing position of the mount. The multiple test probe system further includes an actuator coupled to the mount to cause the mount to move between the testing positions.

Abstract translation: 公开了一种多重测试探针系统。 多个测试探针系统包括支撑件和枢转地联接到支撑件的安装件。 该安装座能够枢转到多个测试位置。 多个探针组件耦合到安装件并与相应数量的测试位置相关联。 探针组件包括耦合到探针总线中的多个电线的多个电触头，而与安装座的测试位置无关。 多个测试探针系统还包括联接到安装件的致动器，以使安装件在测试位置之间移动。

公开(公告)号：US6154041A

公开(公告)日：2000-11-28

申请号：US258066

申请日：1999-02-26

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B7/06 ,  G01R27/02 ,  G01R31/26 ,  G01R31/02

CPC classification number: G01R27/02 ,  G01B7/06 ,  G01R31/2648

Abstract: A method and apparatus for measuring sheet resistance and thickness of thin films and substrates. A four-point probe assembly engages the surface of a film on a substrate, and the thickness of the substrate is determined from the point of contact between the probes and film. A measuring apparatus then outputs a voltage waveform which applies a voltage to probes of the probe assembly. An inverter inverts the voltage and provides the inverted voltage on another probe of the probe assembly, thus inducing a current in these probes of the four point probe and through the surface of the film. Two other probes measure a voltage in the film created by the current. The voltages on the current probes provide a voltage close to zero at the other probes, thus allowing these other probes to measure voltages with greater precision. The current created by the voltage waveform and the voltage created across the inner probes are measured for each voltage level of the waveform. A sheet resistance of the film is determined by calculating the slope of a least square fit line of the measured current and voltage. The sheet resistance is proportional to the slope of the least square line. The thickness of the film is calculated by dividing the film resistivity by the calculated sheet resistance.

Abstract translation: 一种用于测量薄膜和薄膜的薄层电阻和厚度的方法和装置。 四点探头组件接合衬底上的膜的表面，并且从探针和膜之间的接触点确定衬底的厚度。 然后，测量装置输出对探针组件的探头施加电压的电压波形。 逆变器反转电压并在探针组件的另一个探针上提供反相电压，从而在四点探针的这些探针中并通过膜的表面引起电流。 另外两个探头测量由电流产生的电影中的电压。 电流探头上的电压在其他探头上提供接近零的电压，从而允许其他探头以更高的精度测量电压。 针对波形的每个电压电平测量由电压波形产生的电流和内部探针产生的电压。 通过计算测量的电流和电压的最小二乘拟合线的斜率来确定膜的薄层电阻。 薄层电阻与最小二乘线的斜率成比例。 通过将膜电阻率除以计算的薄层电阻来计算膜的厚度。