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公开(公告)号:US09805846B2
公开(公告)日:2017-10-31
申请号:US14365968
申请日:2012-10-02
Applicant: EPCOS AG
Inventor: Thomas Feichtinger , Jörg Lauenstein
IPC: H01G4/232 , H01C7/00 , H01G4/30 , H01C1/142 , H01C7/18 , H01F27/06 , H01G4/012 , H01L29/861 , H01L41/047
CPC classification number: H01C7/008 , H01C1/142 , H01C7/18 , H01F27/06 , H01F2027/065 , H01G4/012 , H01G4/232 , H01G4/30 , H01L29/861 , H01L41/0472
Abstract: An electrical component includes a main body, a metallic contact structure, which is in direct contact with the main body, and an electrically insulating passivation layer provided with an opening. The metallic contact structure is connected to an external contact-making element through the opening. Furthermore, the external contact-making element is covered and enclosed by a flexible metal composite layer. A method for producing an electrical component is also specified.
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公开(公告)号:US09449958B2
公开(公告)日:2016-09-20
申请号:US14403143
申请日:2013-04-17
Applicant: EPCOS AG
Inventor: Thomas Feichtinger , Oliver Dernovsek , Klaus-Dieter Aichholzer , Sebastian Brunner
CPC classification number: H01L27/0248 , H01L25/167 , H01L33/48 , H01L33/486 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.
Abstract translation: 一种发光二极管器件包括具有至少一个空腔的载体,发光二极管芯片以至少部分地凹入至少一个空腔中的方式布置,并且ESD保护元件由部分区域 的承运人。 此外,发光二极管装置包括具有至少一个空腔的载体,布置在载体上的发光二极管芯片以及至少部分地凹入至少一个空腔中的电气部件。 此外,发光二极管装置包括由载体的部分区域形成的ESD保护元件。
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