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公开(公告)号：US10109487B2
公开(公告)日：2018-10-23
申请号：US15514182
申请日：2016-02-16
摘要： A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
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公开(公告)号：US10083933B2
公开(公告)日：2018-09-25
申请号：US14976484
申请日：2015-12-21
IPC分类号： H01L23/00 , H01L21/18 , H01L21/20 , H01L21/762 , H01L21/70
CPC分类号： H01L24/83 , H01L21/187 , H01L21/2007 , H01L21/70 , H01L21/76251 , H01L24/80 , H01L2224/80907 , H01L2224/83009 , H01L2224/83894 , H01L2224/83907 , H01L2924/01001 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106
摘要： A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
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公开(公告)号：US20180040495A1
公开(公告)日：2018-02-08
申请号：US15551733
申请日：2015-04-10
IPC分类号： H01L21/673 , H01L21/68 , H01L23/00 , H01L21/67
CPC分类号： H01L21/67346 , H01L21/67092 , H01L21/67109 , H01L21/68 , H01L24/80
摘要： A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.
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公开(公告)号：US12131907B2
公开(公告)日：2024-10-29
申请号：US16080156
申请日：2016-03-22
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
CPC分类号： H01L21/2007 , H01L21/67092 , H01L21/67288 , H01L21/6838 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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公开(公告)号：US20240213025A1
公开(公告)日：2024-06-27
申请号：US18597134
申请日：2024-03-06
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
CPC分类号： H01L21/2007 , H01L21/67092 , H01L21/67288 , H01L21/6838 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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公开(公告)号：US20230369095A1
公开(公告)日：2023-11-16
申请号：US18031084
申请日：2021-02-01
发明人： Dominik Zinner , Thomas Plach
IPC分类号： H01L21/687 , H01L21/67 , H01L21/18
CPC分类号： H01L21/6875 , H01L21/67092 , H01L21/185
摘要： The present invention relates to a substrate holder, a bonding device, a method for producing a substrate holder and a method for bonding.
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公开(公告)号：US11697281B2
公开(公告)日：2023-07-11
申请号：US17341509
申请日：2021-06-08
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B81C1/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
CPC分类号： B32B38/1833 , B32B37/003 , B32B37/0076 , B81C1/00357 , H01L21/187 , B29C65/002 , B29C65/7802 , B29C66/452 , B29C66/73141 , B32B37/10 , B32B37/18 , B32B38/1866 , B32B2457/14 , B81C2201/019 , H01L21/67092 , H01L21/683 , Y10T156/17
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11527410B2
公开(公告)日：2022-12-13
申请号：US17567942
申请日：2022-01-04
摘要： A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
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公开(公告)号：US20220102146A1
公开(公告)日：2022-03-31
申请号：US17550008
申请日：2021-12-14
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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公开(公告)号：US11020951B2
公开(公告)日：2021-06-01
申请号：US16357746
申请日：2019-03-19
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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