摘要:
In a processing system, an integrated function controller (IFC) for one or more memory devices, including a NAND flash memory device, provides direct memory access (DMA) functionality for writing data to and reading data from the NAND flash memory device, thereby reducing the level of CPU intervention required to support such operations. In one implementation, the CPU stores in system memory a descriptor-based DMA operation sequence of NAND flash operations and then triggers the IFC to implement the descriptor sequence. The IFC sequentially fetches and implements individual stored descriptors without interrupting the CPU or requiring any real-time CPU intervention using, for example, a “repeat while busy” polling descriptor type. The IFC frees up the CPU to perform other system-level operations, thereby increasing the efficiency of the processing system.
摘要:
A system provides synchronous read data sampling between a memory and a memory controller, which includes an asynchronous FIFO buffer and which outputs a clock and other control signals. An outbound control signal (e.g., read_enable) is used to time-stamp the beginning of a read access using a clock edge counter. The incoming read data is qualified based on the time-stamped value of the read_enable signal plus typical access latency by counting FIFO pops. The system performs correct data sampling irrespective of propagation delays between the controller and memory. The system may be implemented in a System on a Chip (SOC) device having a synchronous communication system.
摘要:
A system for repairing a component is provided. The system includes an electrochemical machining unit and a tool delivery apparatus. The electrochemical machining unit includes an electrode, a power supply configured to energize the electrode and the component, and a machining solution source configured to pass a machining solution between the component and the electrode. The tool delivery apparatus includes a number of linkage elements pivotally connected and configured to carry the electrode. The tool delivery apparatus further includes an actuation element configured to actuate the linkage elements to move the electrode. A tool delivery apparatus and a method for repairing a component disposed within a case are also presented.
摘要:
An acoustic transducer and method of making the acoustic transducer is disclosed. A transducer element for converting a signal between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal is provided. A backing to the transducer is additively fabricated to a side of the transducer element. The backing includes an electrically conductive path therein for conducting the electrical signal.
摘要:
A composite ceramic transducer structure for use in the construction of an ultrasound probe includes a substrate and a plurality of piezoelectric transducer posts. The plurality of piezoelectric transducer posts are controllably formed on the substrate in a plurality of spatial positions located on an X-Y plane of the substrate. The plurality of piezoelectric posts includes a plurality of shapes defined in an X-Y-Z plane of the substrate, wherein the plurality of piezoelectric transducer posts are configured to facilitate minimizing shear waves within the ultrasound probe.
摘要:
A synchronous data processing system includes a memory module to store data and a memory controller coupled to the memory module. The memory controller includes a clock inverter to receive an input clock signal and to transmit an inverted clock signal to the memory module. The inverted clock signal incurs a first propagation delay prior to reaching the memory module as a memory clock signal. A write data buffer is coupled to the memory module. The write data buffer transmits data to the memory module in response to the input clock signal. An asynchronous first-in-first-out (ASYNC FIFO) buffer is coupled to the memory module. The ASYNC FIFO buffer reads data from the memory module in response to a feedback signal generated by feeding back the memory clock signal to the ASYNC FIFO buffer.
摘要:
A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and the first and second sets of bit lines in operations to erase, program, inhibit, or read the logic state stored by the memory transistor in one or more of the memory cells.
摘要:
A flash memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a floating gate memory transistor having a source region and a drain region, and a coupling capacitor electrically connected to the memory transistor. A plurality of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the drain region of the memory transistor in each of the memory cells in a respective column. A plurality of high voltage access transistors are each electrically connected to a bit line in the first set of bit lines. A second set of bit lines are each electrically connected to the source region of the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and the first and second sets of bit lines in operations to erase, program, inhibit, or read the logic state stored by the memory transistor in one or more of the memory cells.
摘要:
An inspection method is provided and includes acquiring at least one inspection data set. Each inspection data set comprises inspection data for a component. The inspection method further includes mapping the inspection data set onto a three-dimensional (3D) model of the component, to generate a 3D inspection model for the component, and validating the inspection data against the 3D model of the component using at least one validation criterion. A multi-modality inspection method is also provided and includes acquiring multiple inspection data sets corresponding to multiple inspection modalities for a component and fusing the inspection data sets to form a fused data set. The multi-modality inspection method further includes mapping the fused data set onto a 3D model of the component to generate a 3D multi-modality inspection model for the component.