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公开(公告)号:US20210048587A1
公开(公告)日:2021-02-18
申请号:US16993587
申请日:2020-08-14
Applicant: FINISAR CORPORATION
Inventor: Gilles P. Denoyer , Daniel Mahgerefteh , Vipul Bhatt , Shiyun Lin , Brian Kim
IPC: G02B6/42 , H01L23/498 , H01L23/00
Abstract: In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.
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公开(公告)号:US10797801B2
公开(公告)日:2020-10-06
申请号:US16157946
申请日:2018-10-11
Applicant: Finisar Corporation
Inventor: Gilles P. Denoyer , Dennis Pu , Homero Guimaraes , Faraz Monifi , Bryan Park , Daniel Mahgerefteh
Abstract: An optical receiver with improved dynamic range may include at least one directional coupler having at least one input configured to couple to an optical fiber. The optical receiver may include a first signal path including a first photodetector coupled to an output of the at least one directional coupler, a first transimpedance amplifier (TIA) including an input coupled to the first photodetector, and an adder coupled to an output of the first TIA. The optical receiver may include a second signal path including a second photodetector coupled to an output of the at least one directional coupler, a second TIA including an input coupled to the second photodetector, and the adder coupled to an output of the second TIA. Further, the optical receiver may include an optical power sensing circuit coupled to at least one of the first TIA, the second TIA, and the adder.
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公开(公告)号:US10663680B2
公开(公告)日:2020-05-26
申请号:US16438414
申请日:2019-06-11
Applicant: Finisar Corporation
Inventor: Daniel Mahgerefteh , Jin-Hyoung Lee , Shiyun Lin
Abstract: An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.
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公开(公告)号:US10594402B2
公开(公告)日:2020-03-17
申请号:US15369770
申请日:2016-12-05
Applicant: FINISAR CORPORATION
Inventor: Frank J. Flens , Daniel Mahgerefteh , The' Linh Nguyen , Jimmy Alan Tatum
Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.
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公开(公告)号:US20190302364A1
公开(公告)日:2019-10-03
申请号:US16379660
申请日:2019-04-09
Applicant: FINISAR CORPORATION
Inventor: Daniel Mahgerefteh , Jared Mikkelsen
Abstract: An integrated optical component includes at least one input waveguide, at least one output waveguide; a first slab waveguide having a first refractive index, n1. The first slab waveguide may be disposed between at least one of the input waveguides and at least one of the output waveguides. The integrated optical component may further include a second slab waveguide having a second refractive index, n2. The integrated optical component may also include a third cladding slab having a third refractive index, n3. The third cladding slab may be disposed between the first slab and the second slab. The thickness of the second slab waveguide and the thickness of the third slab waveguide are adjustable to reduce a birefringence of the integrated optical component.
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公开(公告)号:US20190243066A1
公开(公告)日:2019-08-08
申请号:US16386171
申请日:2019-04-16
Applicant: FINISAR CORPORATION
Inventor: Daniel Mahgerefteh , Bryan Park , Jianxiao Chen , Xiaojie Xu , Gilles P. Denoyer , Bernd Huebner
CPC classification number: G02B6/1228 , G02B6/1221 , G02B6/1223 , G02B6/124 , G02B6/125 , G02B6/126 , G02B6/136 , G02B6/2726 , G02B6/2773 , G02B6/305 , G02B6/4208 , G02B6/4215 , G02B2006/12038 , G02B2006/12061 , G02B2006/12069 , G02B2006/12097 , G02B2006/12121 , G02B2006/12123 , G02B2006/12147 , G02B2006/12157 , G02B2006/12164
Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.
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公开(公告)号:US20190221994A1
公开(公告)日:2019-07-18
申请号:US16365624
申请日:2019-03-26
Applicant: FINISAR CORPORATION
Inventor: Daniel Mahgerefteh , Jianxiao Chen , Bernd Huebner , Xiaojie Xu , Yasuhiro Matsui , David Adams , The' Linh Nguyen
IPC: H01S5/026 , H01S5/00 , G02B6/12 , H01S5/187 , G02B6/124 , G02B6/122 , H01S5/10 , H01S5/22 , H01S5/30
Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.
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公开(公告)号:US10243322B2
公开(公告)日:2019-03-26
申请号:US15384270
申请日:2016-12-19
Applicant: Finisar Corporation
Inventor: Daniel Mahgerefteh , Jianxiao Chen , Bernd Huebner , Xiaojie Xu , Yasuhiro Matsui , David Adams , The' Linh Nguyen
IPC: G02B6/12 , H01S5/026 , H01S5/187 , G02B6/124 , H01S5/00 , H01S5/22 , H01S5/30 , G02B6/122 , H01S5/10 , G02B6/27 , H01S5/022 , H01S5/12 , H01S5/125 , H01S5/20
Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.
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公开(公告)号:US10001599B2
公开(公告)日:2018-06-19
申请号:US14938807
申请日:2015-11-11
Applicant: FINISAR CORPORATION
Inventor: Bryan Park , Daniel Mahgerefteh
IPC: G02B6/00 , G02B6/122 , G02B6/136 , G02B6/124 , G02B6/126 , G02B6/27 , G02B6/125 , G02B6/30 , G02B6/12 , G02B6/42
CPC classification number: G02B6/1228 , G02B6/1221 , G02B6/1223 , G02B6/124 , G02B6/125 , G02B6/126 , G02B6/136 , G02B6/2726 , G02B6/2773 , G02B6/305 , G02B6/4208 , G02B6/4215 , G02B2006/12038 , G02B2006/12061 , G02B2006/12069 , G02B2006/12097 , G02B2006/12121 , G02B2006/12123 , G02B2006/12147 , G02B2006/12157 , G02B2006/12164
Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.
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公开(公告)号:US20170363808A1
公开(公告)日:2017-12-21
申请号:US15692793
申请日:2017-08-31
Applicant: FINISAR CORPORATION
Inventor: Daniel Mahgerefteh , Bryan Park , Jianxiao Chen , Xiaojie Xu , Gilles P. Denoyer , Bernd Huebner
IPC: G02B6/122 , G02B6/125 , G02B6/126 , G02B6/27 , G02B6/124 , G02B6/136 , G02B6/30 , G02B6/12 , G02B6/42
CPC classification number: G02B6/1228 , G02B6/1221 , G02B6/1223 , G02B6/124 , G02B6/125 , G02B6/126 , G02B6/136 , G02B6/2726 , G02B6/2773 , G02B6/305 , G02B6/4208 , G02B6/4215 , G02B2006/12038 , G02B2006/12061 , G02B2006/12069 , G02B2006/12097 , G02B2006/12121 , G02B2006/12123 , G02B2006/12147 , G02B2006/12157 , G02B2006/12164
Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.
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