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31.发明申请公开(公告)号：US20150134039A1
公开(公告)日：2015-05-14
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, JR.
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。
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32.发明授权Capacitor for an active implantable medical device (AIMD) for handling high RF power induced in an implanted lead from an external RF field 有权用于处理来自外部RF场的植入引线中感应的高RF功率的有源植入式医疗设备（AIMD）的电容器公开(公告)号：US08855768B1
公开(公告)日：2014-10-07
申请号：US14088849
申请日：2013-11-25
Applicant: Greatbatch Ltd.
Inventor： Robert Shawn Johnson , Dominick J. Frustaci , Warren S. Dabney , Robert A. Stevenson , Keith W. Seitz , Christine A. Frysz , Thomas Marzano , Richard L. Brendel , John E. Roberts , William Thiebolt , Christopher M. Williams , Jason Woods , Buehl E. Truex
CPC classification number: A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。
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33.发明申请CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权通过用于活性可植入医疗装置填充的氧化铝基底和铂填充物进行密封公开(公告)号：US20130184797A1
公开(公告)日：2013-07-18
申请号：US13743254
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC: A61N1/05
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
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34.发明公开公开(公告)号：US20240115867A1
公开(公告)日：2024-04-11
申请号：US18377030
申请日：2023-10-05
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Jason Woods
IPC: A61N1/375
CPC classification number: A61N1/3754
Abstract: The high-voltage and/or high-frequency pulse dielectric breakdown strength (DBS) of an implantable medical device is increased by strategically positioning insulation materials on or adjacent to the external surfaces of a filter capacitor. Dielectric breakdown strength is further increased by adding polymeric or ceramic nanoscale metal oxide insulative powders to the insulation materials.
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公开(公告)号：US11588171B2
公开(公告)日：2023-02-21
申请号：US16812492
申请日：2020-03-09
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Xiaohong Tang , Holly Noelle Moschiano , Biswa P. Das , Brian P. Hohl
IPC: H01M50/10 , H01M50/116 , H01M10/052 , H01M10/0562 , H01M4/131 , H01M4/66 , H01M50/186 , H01M50/191 , H01M50/124
Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LixPOyNz) is used to activate the electrode assembly.
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Patent Agency Ranking
公开(公告)号：US11527795B2
公开(公告)日：2022-12-13
申请号：US16788679
申请日：2020-02-12
Applicant: Greatbatch Ltd.
Inventor： Robert S. Rubino , Keith W. Seitz , Xiaohong Tang , Todd C. Sutay , Brian P. Hohl , Holly Noelle Moschiano , Biswa P. Das , Afsar Ali , Sourabh Biswas , Gary Freitag , David Dianetti , Ho-Chul Yun , Thomas Marzano
IPC: H01M50/10 , H01M50/116 , H01M50/147 , H01M50/155 , H01M50/169 , H01M50/186 , H01M50/191 , H01M50/543 , H01M4/131 , H01M10/0525
Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other. Then, a laser welds through one of the casing halves being a substantially transparent ceramic, for example sapphire, to braze the first and second ring-shaped metallizations to each other to thereby join the first and second casing halves together to form a casing housing the electrode assembly. A solid electrolyte (LixPOyNz) activates the electrode assembly.
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公开(公告)号：US11344734B2
公开(公告)日：2022-05-31
申请号：US16589752
申请日：2019-10-01
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Marc Gregory Martino
IPC: A61N1/375 , H01G4/40 , H01G4/005 , A61N1/08 , H01R43/00 , C22C29/12 , H02G3/22 , H01G4/30 , B23K35/30 , H01G2/10 , H01G4/35 , H01R13/52 , H01G4/236 , B23K35/32 , H01R4/02 , H01R13/719 , B23K35/02 , A61N1/05 , H01G4/12 , A61N1/372 , B22F7/08 , B22F1/10
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.
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公开(公告)号：US20210154483A1
公开(公告)日：2021-05-27
申请号：US17165500
申请日：2021-02-02
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P. Hohl , Marc Gregory Martino
Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.
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公开(公告)号：US10857368B2
公开(公告)日：2020-12-08
申请号：US15936495
申请日：2018-03-27
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Xiaohong Tang , William C. Thiebolt , Jonathan Calamel , Thomas Shi , Thomas Marzano
Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
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公开(公告)号：US10770698B1
公开(公告)日：2020-09-08
申请号：US16003868
申请日：2018-06-08
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Brian P. Hohl , Todd C. Sutay , Gary Freitag
Abstract: A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell has a casing of first and second ceramic substrates that are hermetically secured to each other to provide an internal space housing an electrode assembly. First and second conductive pathways extend through the ceramic substrates. The pathways have respective inner surfaces that are conductively connected to the respective anode and cathode current collectors and respective outer surfaces that provide for connection to a load. An electrolyte in the internal space of the housing activates the electrode assembly.
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