公开(公告)号：US20060272935A1

公开(公告)日：2006-12-07

申请号：US11146762

申请日：2005-06-06

申请人： Hien-Minh Le ,  Akihiro Hosokawa

发明人： Hien-Minh Le ,  Akihiro Hosokawa

IPC分类号： C23C14/32 ,  C23C14/00

CPC分类号： C23C14/35 ,  H01J37/3408

摘要： A sputter reactor configured for magnetron sputtering from a rectangular target onto a rectangular panel and including multiple magnetrons independently scannable across the back of the target. In one embodiment, the magnetrons scan only along paths parallel to one axis. A system controller may control actuators providing the mechanical movement and also control the amount of power delivered to the target in synchronism to the mechanical movement. The invention also includes scanning a magnetron in a rectangular path about the back of the rectangular target.

摘要翻译： 一种溅射反应器，其被配置用于从矩形靶材到矩形面板的磁控溅射，并且包括可以跨靶材背面独立扫描的多个磁控管。 在一个实施例中，磁控管仅沿着平行于一个轴的路径扫描。 系统控制器可以控制提供机械运动的致动器，并且还与机械运动同步地控制输送到目标的功率的量。 本发明还包括围绕矩形靶的背面以矩形路径扫描磁控管。

公开(公告)号：US07062161B2

公开(公告)日：2006-06-13

申请号：US10661240

申请日：2003-09-11

申请人： Tatsufumi Kusuda ,  Akihiro Hosokawa ,  Hiromi Murayama

发明人： Tatsufumi Kusuda ,  Akihiro Hosokawa ,  Hiromi Murayama

IPC分类号： F26B19/00

CPC分类号： H01L21/68735 ,  H01L21/68792

摘要： A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient α of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.

摘要翻译： 基座形成有具有锥形表面和接收表面的空腔。 锥形表面相对于接收表面的梯度α设定为至少5°且小于30°，使得由基座接收的半导体晶片可以通过锥形表面位于接收表面上，而半导体晶片 当晶片的表面由于手电筒照射而突然热膨胀时，也可以防止过度的应力，并且可以防止热处理中的裂纹。 因此，能够防止热处理中的基板破裂的热处理基座和热处理装置。

公开(公告)号：US06936797B2

公开(公告)日：2005-08-30

申请号：US10460292

申请日：2003-06-11

申请人： Akihiro Hosokawa

发明人： Akihiro Hosokawa

IPC分类号： H01L21/26 ,  G21K5/04 ,  H01L21/00 ,  H01L21/268 ,  F27B5/14

CPC分类号： H01L21/67115 ,  G21K5/04 ,  H01L21/2686

摘要： Each of a plurality of flash lamps forming a light source is a bar lamp having an elongated cylindrical shape. The ratio of the distance between the flash lamps and a semiconductor wafer to the distance between the flash lamps and a reflector is set to not more than 1.8 or at least 2.2. Consequently, illuminance is weakened on portions of the main surface of the semiconductor wafer located immediately under the flash lamps along the vertical direction and strengthened in portions located immediately under the clearances between adjacent ones of the flash lamps along the vertical direction, thereby reducing illuminance irregularity on the overall main surface of the semiconductor wafer and improving in-plane uniformity of temperature distribution on the semiconductor wafer. Thus, a thermal processing apparatus capable of improving in-plane uniformity of temperature distribution on a substrate is provided.

摘要翻译： 形成光源的多个闪光灯中的每一个都是具有细长圆柱形状的条形灯。 闪光灯与半导体晶片之间的距离与闪光灯与反射器之间的距离的比率设定为不大于1.8或至少2.2。 因此，沿着垂直方向位于闪光灯正下方的半导体晶片的主表面的部分上的照度被削弱，并且在垂直方向上位于相邻闪光灯之间的间隙正下方的部分被加强，由此减小照度不均匀 在半导体晶片的整个主表面上，提高半导体晶片上的温度分布的面内均匀性。 因此，提供能够提高基板上的温度分布的面内均匀性的热处理装置。

公开(公告)号：US06634686B2

公开(公告)日：2003-10-21

申请号：US09970546

申请日：2001-10-03

申请人： Akihiro Hosokawa

发明人： Akihiro Hosokawa

IPC分类号： B65G4907

CPC分类号： H01L21/68707 ,  Y10S294/902 ,  Y10S414/141

摘要： Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of metallic pads disposed thereon. A polymer pad is disposed on each metallic pad wherein a ratio of an exposed portion of an upper surface of the metallic pad to a top surface of the polymer pad is at least about 3.5 to 1. In another embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of polymer pads disposed thereon. Each polymer pad includes a fluoropolymer coating disposed on at least a top surface of the polymer pad. The metallic pad and/or the coating allows the polymer pad to be at least temporarily utilized in applications above its normal operating temperature.

摘要翻译： 通常，提供了一种用于衬底传送机器人的端部执行器组件。 在一个实施例中，用于衬底传送机器人的端部执行器组件包括具有设置在其上的多个金属垫的末端执行器。 聚合物垫设置在每个金属垫上，其中金属垫的上表面的暴露部分与聚合物垫的顶表面的比率至少为约3.5:1。在另一个实施方案中， 基片传送机器人包括端部执行器，其上设置有多个聚合物垫。 每个聚合物垫包括设置在聚合物垫的至少顶表面上的含氟聚合物涂层。 金属垫和/或涂层允许聚合物垫至少临时用于高于其正常工作温度的应用中。

公开(公告)号：US06267851B1

公开(公告)日：2001-07-31

申请号：US09429762

申请日：1999-10-28

申请人： Akihiro Hosokawa

发明人： Akihiro Hosokawa

IPC分类号： C23C1435

CPC分类号： H01J37/3447 ,  C23C14/352 ,  H01J37/3405 ,  H01J37/3408

摘要： A sputter deposition apparatus and method having a sputtering target that is tilted and a shield that intercepts particles that may fall from the target so that the particles do not deposit on the workpiece. The invention permits the workpiece to be oriented horizontally. More specifically, the sputtering target is mounted higher than the workpiece position and is oriented at an angle of 30 to 60 degrees relative to the vertical axis. The shield occupies an area such that any vertical line extending vertically downward from the front surface of the target to a point on the workpiece intersects the shield above said point.

摘要翻译： 溅射沉积装置和方法，其具有倾斜的溅射靶和拦截可能从靶上掉落的颗粒的屏蔽物，使得颗粒不沉积在工件上。 本发明允许工件水平取向。 更具体地，溅射靶被安装成高于工件位置，并且相对于垂直轴线以30至60度的角度定向。 屏蔽件占据一个区域，使得从目标的前表面垂直向下延伸到工件上的点的任何垂直线与所述点上方的屏蔽件相交。

公开(公告)号：US06257045B1

公开(公告)日：2001-07-10

申请号：US09392110

申请日：1999-09-08

申请人： Akihiro Hosokawa ,  Richard Ernest Demaray ,  Makoto Inagawa ,  Ravi Mullapudi ,  Harlan L. Halsey ,  Michael T. Starr

发明人： Akihiro Hosokawa ,  Richard Ernest Demaray ,  Makoto Inagawa ,  Ravi Mullapudi ,  Harlan L. Halsey ,  Michael T. Starr

IPC分类号： G01J100

CPC分类号： G05B19/41815 ,  G05B19/401 ,  G05B19/402 ,  Y02P90/08

摘要： Automated systems and methods for processing substrates are described. An automated processing system includes: a vacuum chamber; a substrate support located inside the vacuum chamber and constructed and arranged to support a substrate during processing; and a substrate alignment detector constructed and arranged to detect if the substrate is misaligned as the substrate is transferred into the vacuum chamber based upon a change in a physical condition inside the system. The substrate alignment detector may include a vibration detector coupled to the substrate support. A substrate may be transferred into the vacuum chamber. The position of the substrate may be recorded as it is being transferred into the vacuum chamber. Misalignment of the substrate with respect to the substrate support may be detected. The substrate may be processed. The processed substrate may be unloaded from the vacuum chamber. The position of the processed substrate may be recorded as it is being unloaded from the vacuum chamber. Any substrate misalignment may be compensated for based upon the difference in the recorded substrate positions.

公开(公告)号：US06205870B1

公开(公告)日：2001-03-27

申请号：US08949207

申请日：1997-10-10

申请人： Akihiro Hosokawa ,  Richard Ernest Demaray ,  Makoto Inagawa ,  Ravi Mullapudi ,  Harlan L. Halsey ,  Michael T. Starr

发明人： Akihiro Hosokawa ,  Richard Ernest Demaray ,  Makoto Inagawa ,  Ravi Mullapudi ,  Harlan L. Halsey ,  Michael T. Starr

IPC分类号： G01N1900

CPC分类号： G05B19/41815 ,  G05B19/401 ,  G05B19/402 ,  Y02P90/08

摘要： Automated systems and methods for processing substrates are described. An automated processing system includes: a vacuum chamber; a substrate support located inside the vacuum chamber and constructed and arranged to support a substrate during processing; and a substrate alignment detector constructed and arranged to detect if the substrate is misaligned as the substrate is transferred into the vacuum chamber based upon a change in a physical condition inside the system. The substrate alignment detector may include a vibration detector coupled to the substrate support. A substrate may be transferred into the vacuum chamber. The position of the substrate may be recorded as it is being transferred into the vacuum chamber. Misalignment of the substrate with respect to the substrate support may be detected. The substrate may be processed. The processed substrate may be unloaded from the vacuum chamber. The position of the processed substrate may be recorded as it is being unloaded from the vacuum chamber. Any substrate misalignment may be compensated for based upon the difference in the recorded substrate positions.

摘要翻译： 描述了用于处理衬底的自动化系统和方法。 一种自动化处理系统包括：真空室; 位于真空室内的衬底支撑件，并被构造和布置成在加工过程中支撑衬底; 以及基板对准检测器，其构造和布置成基于系统内部的物理状态的变化来检测基板是否不对准，因为基板被转移到真空室中。 衬底对准检测器可以包括耦合到衬底支撑件的振动检测器。 衬底可以被转移到真空室中。 衬底的位置可以在被转移到真空室中时记录。 可以检测衬底相对于衬底支撑件的不对准。 可以处理衬底。 经处理的基板可以从真空室中卸载。 被处理基板的位置可以从真空室中卸载来记录。 可以基于记录的基板位置的差异来补偿任何基板未对准。

公开(公告)号：US5303514A

公开(公告)日：1994-04-19

申请号：US099393

申请日：1993-07-30

申请人： Hirotsugu Oishibashi ,  Soji Fujimori ,  Muneyuki Ohara ,  Haruo Yokoyama ,  Akihiro Hosokawa ,  Kosuke Nagai ,  Hideshi Miyazaki

发明人： Hirotsugu Oishibashi ,  Soji Fujimori ,  Muneyuki Ohara ,  Haruo Yokoyama ,  Akihiro Hosokawa ,  Kosuke Nagai ,  Hideshi Miyazaki

IPC分类号： E01B31/17 ,  B24B23/00 ,  B24B19/00

CPC分类号： E01B31/175

摘要： A rail grinding apparatus for railroad rails has a grinding belt wrapped around motor-driven pulleys which are rotatably mounted on a frame. The frame is supported on the surface of a rail by rollers which bear the weight of the grinding apparatus. A noise guard surrounds the grinding belt to reduce noise.

摘要翻译： 用于铁路轨道的轨道研磨装置具有缠绕在电动滑轮上的研磨带，该皮带轮可旋转地安装在框架上。 框架通过承载研磨装置重量的滚子支撑在轨道表面上。 噪音防护罩围绕研磨带以减少噪音。

公开(公告)号：US20120175250A1

公开(公告)日：2012-07-12

申请号：US13420996

申请日：2012-03-15

申请人： Yoshiaki Tanase ,  Makoto Inagawa ,  Akihiro Hosokawa

发明人： Yoshiaki Tanase ,  Makoto Inagawa ,  Akihiro Hosokawa

IPC分类号： C23C14/34 ,  B23P11/00

CPC分类号： C23C14/3407 ,  H01J37/3408 ,  H01J37/3497 ,  Y10T29/49826

摘要： A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.

摘要翻译： 特别适用于具有密封于主处理室的目标组件和容纳移动磁控管的真空抽吸室的大型面板等离子体溅射反应器的溅射靶组件。 目标瓦片被粘合到的目标组件包括具有平行于主面钻出的平行冷却孔的整体板。 孔的端部可以是密封的，并且垂直延伸的槽在每侧上布置成两个交错的组，并且被成对地加工成在背板的相对侧上的相应的一对冷却孔。 四个歧管管被密封到四组槽，并提供反向流动的冷却剂路径。

公开(公告)号：US07976635B2

公开(公告)日：2011-07-12

申请号：US12691612

申请日：2010-01-21

申请人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

发明人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

IPC分类号： H01L21/677 ,  H01L23/34 ,  F25D23/12

CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。