摘要:
An air bag jacket includes a first portion corresponding to a breast and an upper back portion of a user in a wearing state and a second portion corresponding to a belly and a waist of the user in a wearing state. A recessed portion is cut upwardly from a skirt is formed in the second portion at a position corresponding to either a right or left side of the user. An inflator is arranged on the inside of the recessed portion.
摘要:
A novel interconnection structure which is excellent in adhesion and is capable of realizing low resistance and low contact resistance is provided. An interconnection structure including an interconnection film and a semiconductor layer of a thin film transistor above a substrate in this order from the side of a substrate, wherein the semiconductor layer is composed of an oxide semiconductor, is provided.
摘要:
The embodiments herein relate to devices, implementations, and techniques for health monitoring, specifically cardiac arrest monitoring systems. A paramedical equipment locator may receive a periodically sent message configured to identify a location information corresponding to a paramedical equipment and determine whether to select the paramedical equipment based at least in part on the location information.
摘要:
A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
摘要:
In a cap (10) for a squeeze container to discharge content liquid from a top discharge opening (13) with squeeze deformation of a barrel section (12b) of a container body (12) to be used as being attached to a mouth neck section (12a) of the container body (12) made of plastic as being squeeze-deformable, at least a part of a liquid flow path from the mouth neck section (12a) of the container body (12) to the discharge opening (13) is formed as a helical flow path (15). The helical flow path (15) includes a bottom face section (15a) which is formed to have declination toward the barrel section (12b) of the container body (12) in an erected state of the squeeze container (11). The helical flow path (15) is formed by a helical tube (14) which is arranged inside the cap (10) for a squeeze container, for example.
摘要:
Disclosed is an interconnection structure which, in a display device such as an organic EL display and a liquid crystal display, is capable of stably connecting a semiconductor layer directly to an Al-base film constituting, for example, a source electrode or a drain electrode; and which hardly causes galvanic corrosion between the semiconductor layer and the Al-base film in an electrolyte solution to be used in a wet process and is able to suppress stripping of the Al-base film. It is an interconnection structure including a semiconductor layer of a thin-film transistor and an Al alloy film connected directly to the semiconductor layer above a substrate in this order from the side of the substrate, wherein the semiconductor layer is composed of an oxide semiconductor, and the Al alloy film contains at least one of Ni and Co.
摘要:
A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.
摘要:
An image forming method of the present invention including applying a pretreatment liquid to a recording medium, and discharging an inkjet recording ink dropwise according to an image signal to form an image on the recording medium on which the pretreatment liquid has been applied, wherein the recording medium is regular paper which has no coat layer, the pretreatment liquid contains a cationic polymer compound, a surfactant A, water and a water-soluble organic acid, and the inkjet recording ink contains a water-dispersible colorant, a water-soluble organic solvent, a surfactant B, a penetrating agent and water, and wherein the pretreatment liquid has a static surface tension of 20 mN/m to 30 mN/m.
摘要:
In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
摘要:
An ink-jet recording ink including a colorant dispersible in water, a water-soluble organic solvent used as a wetting agent, a surfactant, a penetrant, a water-dispersible resin, and water, wherein when 2.5 g of the ink is weighed, placed in a glass Petri dish having a diameter of 33 mm and stored for 24 hr at a temperature of 50° C.±0.5° C. and a humidity of 12%±5%, the evaporation rate of a solvent (water+water-soluble organic solvent) in the ink is 50% by weight or more, and an ink residue has a viscosity of 20,000 mPa-S or greater, and wherein by storing the ink residue for 6 hr at a temperature of 23° C.±0.5° C. and a high humidity of 95%±3% to allow it to absorb moisture, the amount of moisture contained in the ink residue becomes 30% by weight to 40% by weight, in which case the ink residue has a viscosity of less than 500 mPa s.