公开(公告)号：US08092281B2

公开(公告)日：2012-01-10

申请号：US12311690

申请日：2007-10-18

申请人： Hisashi Masumura ,  Koji Kitagawa ,  Kouji Morita ,  Hiromi Kishida ,  Satoru Arakawa

发明人： Hisashi Masumura ,  Koji Kitagawa ,  Kouji Morita ,  Hiromi Kishida ,  Satoru Arakawa

IPC分类号： B24B5/35

CPC分类号： B24B37/30

摘要： The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.

摘要翻译： 本发明是一种抛光头，其具有环形刚性环，橡胶膜以均匀的张力粘合到刚性环上，中间板与刚性环接合并与橡胶膜和刚性环一起形成空间部分， 以及环形模板，其与所述刚性环同心地设置在所述橡胶膜的下表面部分上的周边部分中，并且具有大于所述刚性环的内径的外径，其中所述空间部分的压力可以通过 压力调节机构，工件的背面被保持在橡胶膜的下表面部分上，并且工件的表面与附着在用于抛光的转台上的抛光垫滑动接触，并且内部 模板的直径小于刚性环的内径，刚性环与模板之间的内径差与内径与外径之间的差 模板的直径为26％以上且45％以下。 由此，可以提供能够稳定地获得恒定的平坦度的抛光头等。

公开(公告)号：US07695347B2

公开(公告)日：2010-04-13

申请号：US10493494

申请日：2002-10-25

申请人： Hisashi Masumura ,  Kazuya Tomii ,  Shigenao Ito ,  Kenichi Anzai ,  Kenichi Inoue

发明人： Hisashi Masumura ,  Kazuya Tomii ,  Shigenao Ito ,  Kenichi Anzai ,  Kenichi Inoue

IPC分类号： B24B7/19 ,  B24B7/30 ,  B24D11/00 ,  B32B3/06

CPC分类号： H01L21/02024 ,  B24B37/042 ,  B24B37/24 ,  Y10T428/249955

摘要： A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (μm)/compressibility (%)} is 3.8 or more.

摘要翻译： 提供了用于抛光晶片的方法，其有效地防止晶片的外周部分的下垂以及用于抛光晶片的抛光垫的抛光垫。 抛光晶片的方法包括以下步骤：将晶片的主表面与浸渍有树脂的无纺织物的抛光垫接触的晶片进行镜面抛光，其中抛光垫的表面粗糙度与 （表面粗糙度Ra（μm）/压缩率（％））为3.8以上。

公开(公告)号：US20080254720A1

公开(公告)日：2008-10-16

申请号：US11884833

申请日：2006-03-01

申请人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

发明人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

IPC分类号： B24B29/00 ,  B24B9/00 ,  H01L21/302

CPC分类号： B24B37/30

摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

摘要翻译： 本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和 连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。 在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。 结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。 因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。

公开(公告)号：US06769966B2

公开(公告)日：2004-08-03

申请号：US09979641

申请日：2001-11-26

申请人： Kouichi Okamura ,  Noboru Tamai ,  Kouzi Morita ,  Hisashi Masumura

发明人： Kouichi Okamura ,  Noboru Tamai ,  Kouzi Morita ,  Hisashi Masumura

IPC分类号： B24B722

CPC分类号： B24B37/30 ,  B24B49/14 ,  H01L21/6838

摘要： The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

摘要翻译： 本发明是一种用于抛光的工件保持器，其至少包括具有多个用于通过真空吸附保持工件的多孔的工件保持器主体和设置在主体的背面上的背板，该背板设置有温度控制装置或冷却装置 为持有人身体。 因此，提供了用于抛光的工件保持器，抛光装置和抛光方法，其可以通过抑制工件保持体的热变形和涂覆在工件保持表面上的树脂膜的变形而提供具有良好平坦度的工件，而不会降低 即使当研磨次数增加时，工件保持在工件的抛光中的工件的平坦度。

公开(公告)号：US06386957B1

公开(公告)日：2002-05-14

申请号：US09581707

申请日：2000-06-16

申请人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

发明人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B05D1/32 ,  B05D3/042 ,  B24B7/00 ,  B25B11/005 ,  H01L21/6838

摘要： By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

摘要翻译： 通过改善通过真空吸附保持工件的用于抛光的工件保持器的工件保持体的材料和用于涂覆保持件的工件保持表面的树脂膜的材料，并且开发用树脂涂覆表面的方法， 在树脂涂布过程中不会使树脂堵塞保持体的穿孔，提供了具有高精度的工件保持面的研磨用工件保持架及其制造方法。 根据本发明，提供了一种用于抛光的工件保持器，其具有设置有多个用于通过真空吸附保持工件的多孔的工件保持器本体，其中，保持器主体的保持表面涂覆有涂覆膜， 将热固性树脂固化在保持表面上并加热固化，并且对该涂膜的表面进行抛光及其制造方法。

公开(公告)号：US06306021B1

公开(公告)日：2001-10-23

申请号：US09237881

申请日：1999-01-27

申请人： Hisashi Masumura ,  Makoto Kobayashi ,  Teruaki Fukami ,  Tsutomu Takaku ,  Mamoru Okada

发明人： Hisashi Masumura ,  Makoto Kobayashi ,  Teruaki Fukami ,  Tsutomu Takaku ,  Mamoru Okada

IPC分类号： B24B500

CPC分类号： B24B37/22 ,  B24B37/24

摘要： There is disclosed a polishing pad for mirror-polishing a semiconductor wafer, especially in a finish polishing process, by use of a polishing machine which includes a turn table on which a polishing pad is attached, a unit for feeding a polishing agent onto a surface of the polishing pad, and a mechanism for pressing a semiconductor wafer onto the surface of the polishing pad. The polishing pad includes a top layer formed of a porous soft material, a bottom layer formed of a rubber elastomer, and an intermediate layer formed of a hard plastic sheet. The hard plastic sheet is disposed between the top layer and the bottom layer and is bonded to the bottom layer. In the polishing pad, undulation produced in the bottom layer due to a horizontal force generated during polishing is prevented from being transferred to the top layer of the polishing pad, and unevenness in polishing stock removal stemming from warpage or undulation of a wafer itself can be mitigated.

摘要翻译： 公开了一种用于对半导体晶片进行镜面抛光的抛光垫，特别是在精抛光工艺中，通过使用抛光机，该抛光机包括其上安装有抛光垫的转台，用于将抛光剂供给到表面上的单元 的抛光垫，以及用于将半导体晶片压到抛光垫的表面上的机构。 抛光垫包括由多孔软质材料形成的顶层，由橡胶弹性体形成的底层和由硬塑料片形成的中间层。 硬塑料片设置在顶层和底层之间并结合到底层。 在抛光垫中，由于抛光期间产生的水平力，底层产生的波动被转移到抛光垫的顶层，并且由晶片本身的翘曲或起伏引起的抛光原料去除的不均匀性可以是 缓解

公开(公告)号：US6135854A

公开(公告)日：2000-10-24

申请号：US233852

申请日：1999-01-19

申请人： Hisashi Masumura ,  Kiyoshi Suzuki ,  Noboru Tamai ,  Syunichi Ogasawara

发明人： Hisashi Masumura ,  Kiyoshi Suzuki ,  Noboru Tamai ,  Syunichi Ogasawara

IPC分类号： B24B37/04 ,  B24B41/06 ,  B24B47/22 ,  B24B7/22

CPC分类号： B24B49/12 ,  B24B37/08 ,  B24B37/345

摘要： An automatic workpiece transport apparatus for a double-side polishing machine is disclosed. A carrier is positioned at a predetermined position by a positioning unit, and an image of the top surface of the carrier is captured by use of a visual sensor. A computer performs image processing to obtain the center coordinates of the wafers or the workpiece holders while reference marks or the like provided on the carrier are used as references. The transport robot is moved and controlled based on the thus-detected coordinate data in order to load the wafers into the workpiece holders or to unload the wafers from the workpiece holders. Further, two visual sensors are provided at the tip end of the arm of the transport robot. These visual sensors send to the computer an image of the peripheral portion of the held wafer. Thus, the computer performs fine adjustment in positioning the wafer and the workpiece. The automatic workpiece transport apparatus can reliably load and unload semiconductor wafers to and from the carrier that holds semiconductor substrates.

摘要翻译： 公开了一种用于双面抛光机的自动工件输送装置。 载体通过定位单元定位在预定位置，并且通过使用视觉传感器捕获载体的顶表面的图像。 计算机执行图像处理以获得晶片或工件保持器的中心坐标，而使用设置在载体上的参考标记等作为参考。 基于由此检测的坐标数据来移动和控制传送机器人，以便将晶​​片加载到工件保持器中或者从工件保持器卸载晶片。 此外，在运输机器人的臂的末端设置有两个视觉传感器。 这些视觉传感器向计算机发送保持的晶片的周边部分的图像。 因此，计算机在定位晶片和工件时进行微调。 自动工件传送装置可以可靠地将半导体晶片装载到保持半导体衬底的载体上和从载体卸载半导体晶片。

公开(公告)号：US06120353A

公开(公告)日：2000-09-19

申请号：US248993

申请日：1999-02-12

申请人： Kiyoshi Suzuki ,  Hisashi Masumura ,  Teruaki Fukami

发明人： Kiyoshi Suzuki ,  Hisashi Masumura ,  Teruaki Fukami

IPC分类号： B24B37/24 ,  B24D11/00 ,  B24D13/12 ,  B24D13/14 ,  B24B1/00

CPC分类号： B24B37/24

摘要： In a polishing method for a semiconductor wafer in which polishing slurry is interposed between the semiconductor wafer and a polishing pad and the semiconductor wafer is mirror-polished by a polishing step for planarization, when polishing is conducted using a suede-like foam urethane resin polishing pad having physical properties of low compressibility lower than 9 % and high pore density equal to or higher than about 150 pores/cm.sup.2 as the polishing pad used in the polishing step, a mirror silicon wafer with good surface roughness of 50 bits in haze can be manufactured.

摘要翻译： 在将半导体晶片插入在半导体晶片和研磨垫之间的半导体晶片的研磨方法中，通过用于平坦化的研磨工序对半导体晶片进行镜面抛光，在使用麂皮状泡沫聚氨酯树脂研磨 作为抛光步骤中使用的抛光垫，其具有低压缩率低于9％和高孔密度等于或高于约150孔/ cm 2的物理性能的垫可以是具有50位雾度的良好表面粗糙度的镜面硅晶片 制造。

公开(公告)号：US20140113531A1

公开(公告)日：2014-04-24

申请号：US14123629

申请日：2012-05-31

申请人： Hisashi Masumura

发明人： Hisashi Masumura

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  B24B37/30

摘要： A polishing head comprising an annular rigid ring; a rubber film attached to the rigid ring by using uniform tensile force; a back plate that is connected to the rigid ring and forms a space portion with the rubber film and the rigid ring; and an annular template that is provided at a peripheral portion of a lower surface portion of the rubber film concentrically with the rigid ring and configured to hold an edge portion of a workpiece, the polishing head holding a back surface of the workpiece on the lower surface portion of the rubber film and sliding a front surface of the workpiece on a polishing pad attached to a turn table to perform polishing. The polishing head and the polishing apparatus can be used for final polishing and uniformly polish the entire front surface regardless of the thickness of the template.

摘要翻译： 一种抛光头，包括环形刚性环; 通过使用均匀的拉力附着在刚性环上的橡胶膜; 背板，其连接到刚性环并与橡胶膜和刚性环形成空间部分; 以及环形模板，其设置在所述橡胶膜的下表面部分的周边部分，与所述刚性环同心并且构造成保持工件的边缘部分，所述抛光头将工件的后表面保持在下表面 橡胶膜的一部分，并将工件的前表面滑动到安装在转台上的抛光垫上，以进行抛光。 研磨头和抛光装置可以用于最终抛光，并且均匀地抛光整个前表面，而与模板的厚度无关。

公开(公告)号：US08636561B2

公开(公告)日：2014-01-28

申请号：US13056249

申请日：2009-08-07

申请人： Hisashi Masumura ,  Hiromasa Hashimoto ,  Kouji Morita ,  Hiromi Kishida ,  Satoru Arakawa

发明人： Hisashi Masumura ,  Hiromasa Hashimoto ,  Kouji Morita ,  Hiromi Kishida ,  Satoru Arakawa

IPC分类号： B24B37/04 ,  H01L21/304

CPC分类号： B24B37/30

摘要： A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

摘要翻译： 抛光工件的抛光头，抛光工件的表面和设置有抛光头的抛光装置，特别是用于将工件保持在橡胶膜上的抛光头和设置有抛光头的抛光装置。 抛光头和抛光装置具有抛光头，该抛光头可以在研磨前基于工件的形状调节抛光轮廓并且可以稳定地获得良好的平坦度。