公开(公告)号：US06386957B1

公开(公告)日：2002-05-14

申请号：US09581707

申请日：2000-06-16

申请人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

发明人： Hisashi Masumura ,  Kouichi Tanaka ,  Fumio Suzuki ,  Kouzi Morita ,  Kouichi Okamura ,  Naotaka Toyama

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B05D1/32 ,  B05D3/042 ,  B24B7/00 ,  B25B11/005 ,  H01L21/6838

摘要： By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

摘要翻译： 通过改善通过真空吸附保持工件的用于抛光的工件保持器的工件保持体的材料和用于涂覆保持件的工件保持表面的树脂膜的材料，并且开发用树脂涂覆表面的方法， 在树脂涂布过程中不会使树脂堵塞保持体的穿孔，提供了具有高精度的工件保持面的研磨用工件保持架及其制造方法。 根据本发明，提供了一种用于抛光的工件保持器，其具有设置有多个用于通过真空吸附保持工件的多孔的工件保持器本体，其中，保持器主体的保持表面涂覆有涂覆膜， 将热固性树脂固化在保持表面上并加热固化，并且对该涂膜的表面进行抛光及其制造方法。

公开(公告)号：US06422922B1

公开(公告)日：2002-07-23

申请号：US09647505

申请日：2000-09-29

申请人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura ,  Kouzi Morita ,  Naotaka Toyama

发明人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura ,  Kouzi Morita ,  Naotaka Toyama

IPC分类号： B24B100

CPC分类号： B24B37/30

摘要： A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

摘要翻译： 一种用于抛光的工件保持器，包括：工件保持器主体，其具有用于通过真空吸附保持工件的多个穿孔;以及保持器背板，其与保持器主体的背面紧密接触并具有用于真空的凹槽，其中， 背板由合成树脂构成，具有70以上且低于98的Asker C硬度，以及用于研磨工件的装置以及利用该工件抛光工件的方法。 通过改善用于通过真空抽吸保持工件的用于抛光的工件保持器的保持器背板的材料，以增强与保持体的密封性，从而显影不应该将保持器主体的变形转移到工件表面的保持器背板， 即使抛光剂浆料被引入和固化，也可提供具有高精度的工件保持表面的抛光用工件保持器，用于研磨工件的设备和抛光工件的方法。

公开(公告)号：US06332830B1

公开(公告)日：2001-12-25

申请号：US09509208

申请日：2000-03-24

申请人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura

发明人： Kouichi Okamura ,  Fumio Suzuki ,  Hisashi Masumura

IPC分类号： B24B100

CPC分类号： B24B37/11 ,  B24B41/047 ,  B24D9/08

摘要： A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).

摘要翻译： 一种用于使工件与抛光垫之间的接触压力在表面内基本均匀的抛光方法和抛光装置，以获得具有良好质量的工件。 转台（2）由转台接收构件（3b）的带槽表面支撑，开槽面在直线方向上设有槽（9b），工件（W）被压靠在抛光垫（8）上 ）在流动抛光浆料的同时粘附到转台（2），并且通过旋转工件（W）和转台（2）来进行抛光。

公开(公告)号：US06399498B1

公开(公告)日：2002-06-04

申请号：US09244697

申请日：1999-02-04

申请人： Hisashi Masumura ,  Fumio Suzuki ,  Kouichi Okamura

发明人： Hisashi Masumura ,  Fumio Suzuki ,  Kouichi Okamura

IPC分类号： H01L21302

CPC分类号： B24B37/015

摘要： There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 wherein temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.

摘要翻译： 公开了一种处理工件的方法，其包括通过使工件保持板4的工件保持表面4a与安装在抛光台1上的抛光垫2接触和摩擦来抛光工件保持板4的工件保持表面4a， 向其提供抛光剂5，通过真空保持将晶片W保持在所述工件保持表面4a上，并且与抛光垫2接触并摩擦晶片W以抛光工件以提供抛光剂5，其中抛光剂5的温度或 抛光转台1由温度控制器7,9控制，使得当抛光所述工件保持板4时所述工件保持表面4a的温度和当研磨晶片w时所述工件保持表面4a的温度被控制为相同 。 可以防止在研磨保持板并抛光晶片时由于热影响而导致的平坦度的降低，包括：研磨工件保持板的工件保持表面以符合抛光垫的变形形状，保持工件 工作保持面，并抛光工作。

公开(公告)号：US08268114B2

公开(公告)日：2012-09-18

申请号：US10490480

申请日：2002-09-27

申请人： Hisashi Masumura ,  Fumio Suzuki ,  Kouji Kitagawa

发明人： Hisashi Masumura ,  Fumio Suzuki ,  Kouji Kitagawa

IPC分类号： H01L21/68 ,  H01L21/304 ,  B24B37/04

CPC分类号： B24B37/30

摘要： A workpiece holder for polishing includes a workpiece holder body having multiple perforated holes to hold a workpiece by vacuum suction. A holding surface of the workpiece holder body may be coated with resin. A coefficient of thermal expansion of the resin coating on the holding surface may be 1×10−5/K or less. The resin coating on the holding surface may be epoxy resin filled with silica particles.

摘要翻译： 用于抛光的工件保持器包括具有多个穿孔的工件保持器主体，以通过真空抽吸来保持工件。 工件保持体的保持面可以涂布树脂。 保持表面上的树脂涂层的热膨胀系数可以为1×10-5 / K以下。 保持表面上的树脂涂层可以是填充有二氧化硅颗粒的环氧树脂。

公开(公告)号：US5584746A

公开(公告)日：1996-12-17

申请号：US283152

申请日：1994-08-03

申请人： Kouichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

发明人： Kouichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

IPC分类号： B24B37/30 ,  B24B1/00 ,  B24B29/00

CPC分类号： B24B37/30

摘要： A method of polishing semiconductor wafers and apparatus therefore are described. According to the present invention, a semiconductor wafer mounted on the lower side of a wafer mounting plate may be polished on a polishing pad by the front referenced polishing technique due to a flexibility of the wafer mounting plate to make the same to conform in detail with the backside contour of the wafer under polishing pressure and a selected flexibility differential between a wafer holding region and the outer moving region of the wafer mounting plate. An apparatus includes the wafer mounting plate that also works as a vacuum chuck plate is constructed out of a flexible thin disc of hard plastics, a central round region is used for a wafer holding region facing the backside of the wafer and the outside annular region is more flexible to work as a moving region, a pan-shaped rubber sheet is secured to a ring projection, the wafer mounting disc is adhered to the inner periphery of the rubber sheet at and along the periphery thereof to generate a sealed space, passes for vacuum communication and for a compressed air supply are formed through a rotary shaft, and vacuum chuck holes are communicated with the vacuum pass and the compressed air pass is in communication with a sealed space in the wafer holder.

摘要翻译： 因此，对半导体晶片及其装置进行研磨的方法进行了说明。 根据本发明，安装在晶片安装板的下侧的半导体晶片可以通过前置抛光技术在抛光垫上抛光，这是由于晶片安装板的灵活性使其与 抛光压力下的晶片的背面轮廓和晶片保持区域与晶片安装板的外部移动区域之间的选定的柔性差异。 一种装置，包括晶片安装板，其作为真空吸盘板，由硬塑料的柔性薄盘构成，中心圆形区域用于面向晶片背面的晶片保持区域，外部环形区域为 更灵活地作为移动区域工作，将盘形橡胶片固定到环形突起，晶片安装盘在其周围并沿其周边粘附到橡胶片的内周，以产生密封空间，通过 通过旋转轴形成真空连通和压缩空气供给，并且真空吸盘孔与真空通道连通，压缩空气通道与晶片保持器中的密封空间连通。

公开(公告)号：US5564965A

公开(公告)日：1996-10-15

申请号：US355212

申请日：1994-12-09

申请人： Kouichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

发明人： Kouichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

IPC分类号： B24B37/22 ,  B24D13/14 ,  B24B5/00

CPC分类号： B24B37/22

摘要： A polishing apparatus is provided which can effect surface-based polishing of a wafer without causing the wafer to produce an undulation or peripheral protrusion. A sheetlike polishing member 5 constructed by superposing a foam sheet 2 containing minute closed cells in a web of chloroprene rubber and a velour type non-woven fabric (polishing cloth 3) is attached fast to the surface of a polishing table 1. The polishing member is capable of polishing a given wafer while maintaining the uniformity of thickness of the wafer or an oxide film formed on the surface of the wafer because, during the application of pressure by a pressing member 14, the polishing pressure is uniformly distributed throughout the entire rear surface of the wafer and the polishing member is bent in conformity with the global rises and falls in the wafer surface.

摘要翻译： 提供一种抛光装置，其可以实现晶片的基于表面的抛光，而不会导致晶片产生起伏或周边突起。 通过将包含微小闭孔的发泡片2叠加在氯丁橡胶和丝绒型无纺布（抛光布3）的网中而构成的片状抛光构件5快速地附着在抛光台1的表面上。抛光构件 能够在保持晶片的厚度均匀性或形成在晶片表面上的氧化物膜的同时抛光给定晶片，因为在通过按压部件14施加压力期间，抛光压力均匀地分布在整个后部 晶片的表面和抛光构件与晶片表面的全局上升和下降一致地弯曲。

公开(公告)号：US5525607A

公开(公告)日：1996-06-11

申请号：US63684

申请日：1993-05-20

申请人： Fumio Suzuki ,  Junichi Shimada ,  Akio Ishii ,  Tetsuji Ohno ,  Akira Karasawa ,  Kazuhiro Kubo ,  Hiromi Nonaka ,  Fumio Suzuki ,  Junichi Shimada ,  Akio Ishii ,  Tetsuji Ohno ,  Akira Karasawa ,  Kazuhiro Kubo ,  Hiromi Nonaka

发明人： Fumio Suzuki ,  Junichi Shimada ,  Akio Ishii ,  Tetsuji Ohno ,  Akira Karasawa ,  Kazuhiro Kubo ,  Hiromi Nonaka ,  Fumio Suzuki ,  Junichi Shimada ,  Akio Ishii ,  Tetsuji Ohno ,  Akira Karasawa ,  Kazuhiro Kubo ,  Hiromi Nonaka

IPC分类号： C07D473/06 ,  C07D473/08 ,  C07D473/20 ,  C07D473/22 ,  A61K31/52 ,  C07D473/00

CPC分类号： C07D473/06 ,  C07D473/08 ,  C07D473/20 ,  C07D473/22

摘要： Novel xanthine compounds represented by the following formula: ##STR1## wherein each of R.sup.1, R.sup.2 and R.sup.3 independently represents hydrogen or lower alkyl;each of X.sup.1 and X.sup.2 independently represents oxygen or sulfur; and Q represents: ##STR2## The compounds are useful as a diuretic, a renal-protecting agent and bronchodilator.

摘要翻译： 由下式表示的新型黄嘌呤化合物：其中R 1，R 2和R 3各自独立地表示氢或低级烷基; X1和X2各自独立地表示氧或硫; Q表示：该化合物可用作利尿剂，肾保护剂和支气管扩张剂。

公开(公告)号：US08310753B2

公开(公告)日：2012-11-13

申请号：US12632007

申请日：2009-12-07

申请人： Fumio Suzuki ,  Naoshi Aikawa ,  Kotaro Yamaguchi

发明人： Fumio Suzuki ,  Naoshi Aikawa ,  Kotaro Yamaguchi

IPC分类号： G02B21/00 ,  G02B27/14

CPC分类号： G02B21/0036 ,  G02B21/0072 ,  G02B21/0076 ,  G02B26/105 ,  G02B27/0031

摘要： A confocal scanning microscope including: an objective system (second objective lens 23 and objective lens 24) illuminating a sample SA with illumination light; a scanning mechanism 31 scanning the sample SA to obtain an intensity signal; and a scanning optical system 32 provided between the scanning mechanism and the objective system. The scanning optical system composed of, in order from the scanning mechanism side, a first positive lens group G1, a second negative lens group G2, and a third positive lens group G3. The third lens group has two chromatic aberration correction portions each formed by a positive lens and a negative lens or negative lens and positive lens. Glass materials are selected such that one performs chromatization and the other performs achromatization, thereby providing a confocal scanning microscope capable of correcting lateral chromatic aberration generated in the objective system in the specific wavelength region by the scanning optical system.

摘要翻译： 一种共焦扫描显微镜，包括：用照明光照射样品SA的物镜系统（第二物镜23和物镜24） 扫描机构31扫描样本SA以获得强度信号; 以及设置在扫描机构和物镜系统之间的扫描光学系统32。 扫描光学系统按照扫描机构侧的顺序由第一正透镜组G1，第二负透镜组G2和第三正透镜组G3构成。 第三透镜组具有由正透镜和负透镜或负透镜和正透镜形成的两个色像差校正部。 选择玻璃材料，使得一个进行着色，另一个进行消色化，从而提供能够通过扫描光学系统校正在特定波长区域中的物镜系统中产生的横向色差的共焦扫描显微镜。

公开(公告)号：US20110182371A1

公开(公告)日：2011-07-28

申请号：US12737629

申请日：2009-07-30

申请人： Fumio Suzuki ,  Shoji Hatano ,  Noritoshi Hino ,  Masahito Taneda ,  Yoshimisa Kimura ,  Koichi Moriya

发明人： Fumio Suzuki ,  Shoji Hatano ,  Noritoshi Hino ,  Masahito Taneda ,  Yoshimisa Kimura ,  Koichi Moriya

IPC分类号： H04L27/00

CPC分类号： H04W56/00 ,  H04L7/10 ,  H04W52/0229 ,  Y02D70/00

摘要： Provided are a radio communication system, a receiver, and a transmitter, which are capable of reducing an operation time period of a reception circuit of the receiver and achieving reduction in power consumption even if there is a clock error between the transmitter and the receiver. In a case of a conventional method illustrated in FIG. 1(A), the receiver is operated earlier by a time period (Tm), to thereby achieve synchronization before the clock error of the receiver exceeds the time period (Tm). This requires an extended reception time period for achieving clock synchronization, which therefore prevents the receiver from reducing its power consumption. In view of this, according to the present invention, as illustrated in FIG. 1(B), a synchronization signal is continuously transmitted from the transmitter a plurality of times in a short period of time, and the receiver receives only one of the continuously-transmitted synchronization signals. With this, the receiver can achieve synchronization of a reference clock by starting a reception operation earlier only by a time period (Tm′) (Tm′≦Tm).

摘要翻译： 提供一种无线电通信系统，接收机和发射机，其能够减少接收机的接收电路的操作时间段，并且即使在发射机和接收机之间存在时钟误差也能实现功率消耗的降低。 在图1所示的常规方法的情况下， 如图1（A）所示，接收机较早地运行时间（Tm），从而在接收机的时钟误差超过时间段（Tm）之前实现同步。 这需要用于实现时钟同步的扩展接收时间段，从而防止接收机降低其功耗。 鉴于此，根据本发明，如图1所示， 如图1（B）所示，在短时间内多次从发送器连续发送同步信号，接收机仅接收连续发送的同步信号之一。 由此，接收器可以通过仅通过时间段（Tm'）（Tm'＆nlE; Tm）开始接收操作来实现参考时钟的同步。