METHODS AND APPARATUS TO IMPLEMENT A NEURAL NETWORK

    公开(公告)号:US20210150323A1

    公开(公告)日:2021-05-20

    申请号:US17133181

    申请日:2020-12-23

    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to implement a neural network. An apparatus to implement a neural network, the apparatus comprising memory formed on a substrate, neural network inference logic formed on the same substrate as the memory, the neural network inference logic to load a plurality of neural network parameters in a multiply-accumulate register, and perform a sample-multiply-add operation on the neural network parameter values and input data to generate a neural network inference result, and a memory controller to transfer the neural network inference result to at least one of a host memory external to the substrate or a host processor external to the substrate.

    Locating radio transmission source by scene reconstruction

    公开(公告)号:US10976407B2

    公开(公告)日:2021-04-13

    申请号:US16586560

    申请日:2019-09-27

    Abstract: Systems and techniques for locating a radio transmission source by scene reconstruction are described herein. A multipath radio signal—comprised of two or more multipath components—may be received at an antenna array. A collection of angle-of-arrival (AoA) values may be created from the multipath components. Thus, each AoA in the collection corresponds to one of the multipath components. An optical image of the environment may be obtained and possible reflective surfaces for the multipath components identified in the optical image. A set of paths may be created in a model of the environment by backtracking from the antenna array along the AoAs in the collection of AoA values. Here, the backtracking simulates reflections of the ray off of the surfaces identified in the optical image. A transmitter of the multipath radio signal may then be located via the set of paths.

    Surface reconstruction for interactive augmented reality

    公开(公告)号:US10657711B2

    公开(公告)日:2020-05-19

    申请号:US16210818

    申请日:2018-12-05

    Abstract: An embodiment of a semiconductor package apparatus may include technology to perform depth sensor fusion to determine depth information for a surface, smooth the depth information for the surface and preserve edge information for the surface based on adaptive smoothing with self-tuning band-width estimation, iteratively remove holes from the surface based on conditional iterative manifold interpolation, reduce one or more of a file size and an on-memory storage size of data corresponding to the surface based on triangular edge contraction, and construct at least a portion of a 3D model based on data corresponding to a visible portion of the surface. Other embodiments are disclosed and claimed.

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