摘要:
An electronic assembly having a first layer and a second layer is disclosed. The first layer has a first interface surface and a plurality of cavities formed in the first interface surface. The second layer has a second interface surface and a plurality of projections disposed at the second interface surface, where the plurality of projections are aligned with and disposed at the plurality of cavities. An electrically conductive connecting material is disposed at the plurality of cavities such that the connecting material connects the plurality of projections to the respective plurality of cavities.
摘要:
Systems and methods are provided for managing power consumption of a medical imaging detector by the use of triggering signals, environmental condition data, and/or determination of a variable time interval triggering event that is unique for each power consumption state. Systems and methods are provided for managing power and temperature of a device, after receiving a request for a function to be performed by the device determining an “on” trigger component, an “off” trigger component, associated circuits for performing the received function, providing power to the associated circuits upon the occurrence of the “on” trigger component, and removing power to the associated circuits upon the occurrence of the “off” trigger component. Further, an instruction is described for determining and displaying a variable time interval that is indicative of a time to change from one state to a desired state.
摘要:
An improved design for a solid state X-ray detector that decreases the amount of moisture diffusion that occurs through seals used to attach a cover to a glass substrate panel, thereby protecting the scintillator from moisture damage. In one embodiment, a second hermetic or semi-hermetic seal is introduced between the scintillator and the outside environment to increase the path moisture must travel to reach the scintillator. In another embodiment, a metal frame, preferably a Kovar® frame, is hermetically or semi-hermetically sealed to the cover and glass substrate panel, thereby decreasing the amount of moisture diffusion through the semi-hermetic seal as compared to the prior art.
摘要:
The present invention, in one form, is a flexible interconnect circuit for altering the resolution of an imaging system. In one embodiment, by combining a plurality of detector array signal lines within the interconnect circuit, the imaging system resolution is altered. Each interconnect circuit includes a plurality of contacts at a first end and a second end and a plurality of conductors extending therebetween electrically connected to at least one contact at each end. By altering the number of contacts which are connected together, the resolution of the imaging system is altered.
摘要:
An imager array includes a substrate with a plurality of superimposed layers of electrically conductive and active components. Sets of scan and data lines are electrically insulated from one another and also from a common electrode and active array components by dielectric material. Protection of the active components against static charge potential includes resistive means between the common electrode and a ground ring conductor around the array elements and in particular a thin film transistor circuit with a parallel pair of opposite polarity diode connected field effect transistors to safely drain the static charge during subsequent fabrication, test and standby period of the imager, while remaining in circuit during imager operation. Further electrostatic charge protection is provided to the array by an protective apparatus adapted to support the radiation imager while electrically contacting its ground ring to facilitate handling and processing while protecting against electrostatic charge damage during fabrication and testing, and enabling the positioning and bonding of the flexible external connections to the contact pads of the imager. Provision is made to enable heat and pressure for thermode bonding through the fixture to the contact pads while the imager is secured within the fixture.
摘要:
Interconnect carriers for coupling integrated circuit chips to major substrates and methods for making the same are disclosed. The interconnect carrier comprises a relatively thin resilient supporting layer, a plurality of electrically conductive vias formed through the surfaces of the supporting layer, and an outer frame disposed around the periphery of the supporting layer. The supporting layer preferably comprises an electrically insulating material. The flexibility of the supporting layer enables the layer to more readily conform to the warpages of the IC chip and supporting substrate, while the outer frame provides mechanical support and prevents the supporting layer from folding, twisting, and/or stretching. The thickness of the supporting layer may be substantially reduced over that of prior art interposers to enable methods for constructing smaller diameter vias.
摘要:
A charging station for a portable X-ray detector is described. In one embodiment, the charging station includes one or more biasing members that act to guide and align a portable detector when inserted into the charging station. In certain embodiments, a physical, pin-type connector for connecting to an inserted portable detector is present, while in other embodiments no pin-type connector is present.
摘要:
A portable radiation detector is described having various shock isolation features. In one embodiment, shock isolation may be provided by providing a non-rigid mounting for a support layer within the portable detector to an enclosure of the portable detector. In other embodiments, an elastomeric strip is provided about all or part of an edge of the enclosure. In other embodiments, a removable elastomeric cover is provided for the portable detector.
摘要:
In one embodiment, a portable X-ray detector assembly is provided comprising a detector array and a housing for the detector array. The housing is provided as a multi-layer structure in which at least one layer improves or increases the structural integrity of other layers of the housing. In certain embodiments, the structural integrity layer also acts to reduce or eliminate electromagnetic interference that might otherwise affect the detector or other electronics in the vicinity of the detector.
摘要:
An imaging system is provided having an EMI shield configured to shield one or more imaging components. The EMI shield includes a first material having a first plurality of conductive elements integrally formed within a first nonconductive material and also includes a generally nonconductive exterior. A method is provided for shielding EMI in an imaging system. The method includes providing an EMI shielding enclosure that includes a first material having a first plurality of conductive elements disposed in a first non-conductive material, and a second material having a second plurality of conductive elements disposed in a second non-conductive material, wherein the first plurality of conductive elements engages the second plurality of conductive elements to form a conduction path. Another method for shielding EMI in an imaging system is provided, that includes providing an EMI shielding enclosure having a first material that has a non-conductive surface and a second EMI shielding material disposed on the non-conductive surface of the first material.