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公开(公告)号：US6063439A
公开(公告)日：2000-05-16
申请号：US90882
申请日：1998-06-05
申请人： Norio Semba , Junichi Kitano , Takayuki Katano
发明人： Norio Semba , Junichi Kitano , Takayuki Katano
IPC分类号： G03F7/16 , B01D53/14 , B05B15/12 , B05C11/08 , G03F7/30 , H01L21/00 , H01L21/027 , B05D3/12 , B05C11/02
CPC分类号： H01L21/67178 , B01D53/14 , B05B15/1262 , H01L21/67051 , B05B15/1248 , B05B15/1259 , B05C11/08 , Y02P70/36
摘要： A processing apparatus using solution comprises a rotary table which rotates while holding a substrate thereon, in the processing chamber provided in the casing, a supply mechanism for supplying a processing solution to a surface of the substrate held on the rotary table, and an impurity remover unit, provided outside the casing, wherein the impurity remover unit includes a cleaning unit for cleaning an object gas introduced from the inlet opening by brining it into contact with an impurity remover solution, and the gas-liquid separation mechanism for separating liquid from gas in an exhaust is provided in the exhaust system for exhausting the casing.
摘要翻译： 一种使用溶液的处理装置包括：旋转台，其在保持基板的同时保持基板，旋转台在设置在壳体中的处理室中;供给机构，用于将处理溶液供应到保持在旋转台上的基板的表面;以及杂质去除器 单元，其设置在所述壳体的外部，其中所述杂质去除器单元包括清洁单元，用于清洁从入口开口引入的物体气体与杂质去除剂溶液接触;以及气液分离机构，用于将液体与气体分离 在排气系统中设置排气以排出外壳。
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公开(公告)号：US5944894A
公开(公告)日：1999-08-31
申请号：US917734
申请日：1997-08-27
申请人： Junichi Kitano , Takayuki Katano , Keiko Kanzawa , Masami Akimoto , Norio Semba
发明人： Junichi Kitano , Takayuki Katano , Keiko Kanzawa , Masami Akimoto , Norio Semba
CPC分类号： F24F3/161 , H01L21/67017 , H01L21/67178
摘要： A substrate treatment system comprises process sections provided with at least either of liquid treatment group units and heat treatment group units, an upper space formed above the process sections in order to supply air to the process sections, a purification section for removing alkaline components from the air to be supplied to the upper spaces to purify the air, temperature/humidity controller communicating with the urification section and the upper spaces to control the temperature and humidity of the air passing through the purification sections, and fans for supplying air to the top spaces from the temperature/humidity controller, lowering the air from the upper spaces into the process sections, and supplying at least some of the air lowering through the process sections to the temperature/humidity controller.
摘要翻译： 基板处理系统包括设置有液体处理组单元和热处理组单元中的至少一个的处理部分，形成在处理部分上方的上部空间以向处理部分供应空气;净化部分，用于从 供给上部空间以净化空气的空气，与尿素部和上部空间连通的温度/湿度控制器，以控制通过净化部的空气的温度和湿度，以及用于向顶部空间供给空气的风扇 从温度/湿度控制器将空气从上部空间降低到处理区域中，并且将至少一些通过处理区域的空气的空气供应到温度/湿度控制器。
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公开(公告)号：US08053180B2
公开(公告)日：2011-11-08
申请号：US12609425
申请日：2009-10-30
申请人： Yuko Ono , Junichi Kitano
发明人： Yuko Ono , Junichi Kitano
IPC分类号： G03F7/26
CPC分类号： G03D5/00 , G03F7/3028 , G03F7/322 , Y10S134/902
摘要： In a developing method for performing developing treatment of a substrate by supplying a developing solution onto a resist film formed on a surface of the substrate, the present invention controls a zeta potential of the surface of the substrate at a predetermined potential in the same polarity as that of a zeta potential of insoluble substances floating in the developing solution, thereby preventing or reducing the adhesion of the insoluble substances to the resist film and the substrate. This remedies the occurrence of development defects. The adhesion of the insoluble substances to the resist film and the substrate can also be prevented or inhibited by supplying an acid liquid to a liquid on the substrate, or controlling a pH value of the liquid on the substrate to control an absolute value of the zeta potential of the insoluble substances.
摘要翻译： 在通过将显影液供给到形成在基板的表面上的抗蚀剂膜上的基板进行显影处理的显影方法中，本发明将基板表面的ζ电位控制在与 不溶物质的ζ电位漂浮在显影液中，从而防止或降低不溶物质对抗蚀剂膜和基材的粘附。 这样可以弥补发展缺陷的发生。 还可以通过向基板上的液体供给酸性液体，或者控制基板上的液体的pH值来控制ζ的绝对值，从而可以防止或抑制不溶性物质与抗蚀剂膜和基材的粘附 潜在的不溶物质。
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34.发明授权公开(公告)号：US07977039B2
公开(公告)日：2011-07-12
申请号：US11515800
申请日：2006-09-06
申请人： Takeshi Shimoaoki , Junichi Kitano
发明人： Takeshi Shimoaoki , Junichi Kitano
IPC分类号： G03F7/30
CPC分类号： H01L21/67051 , G03F7/425 , H01L21/6715
摘要： In the present invention, in a rinse treatment method of cleaning a substrate after an exposed pattern thereon has been subjected to developing treatment, the following steps are performed such as supplying pure water onto the substrate to clean the substrate with the pure water; supplying a first rinse solution composed of a surfactant with a predetermined concentration onto the substrate to clean the substrate with the first rinse solution; and supplying a second rinse solution composed of a surfactant with a concentration lower than that of the first rinse solution onto the substrate to clean the substrate with the second rinse solution. According to the present invention, in the rinse treatment of the substrate after developing treatment, it is possible to dry the substrate without causing pattern collapse to restrain variation in pattern line width, and to reduce the remaining precipitation-based defects to increase the productivity.
摘要翻译： 在本发明中，在对曝光图案进行显影处理后的基板的清洗处理方法中，进行如下步骤，例如向基板供给纯水，用纯水清洗基板; 将由预定浓度的表面活性剂组成的第一冲洗溶液供应到所述基材上以用所述第一冲洗溶液清洗所述基材; 以及将由表面活性剂组成的浓度低于第一冲洗溶液的表面活性剂的第二冲洗溶液供应到基材上，以用第二冲洗溶液清洗基材。 根据本发明，在显影处理后的基板的漂洗处理中，可以在不引起图案塌陷的情况下干燥基板，抑制图案线宽度的变化，并且减少剩余的基于沉淀的缺陷以提高生产率。
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公开(公告)号：US07924396B2
公开(公告)日：2011-04-12
申请号：US11958798
申请日：2007-12-18
CPC分类号： G03F7/162 , G03F7/168 , G03F7/3021
摘要： A coating/developing apparatus includes a process section including processing units to perform a series of processes for resist coating and development; an interface section disposed between the process section and immersion light exposure apparatus; and a drying section disposed in the interface section to dry the substrate immediately after the immersion light exposure process. The drying section includes a process container configured to accommodate the substrate, a substrate support member configured to place the substrate thereon, a temperature-adjusted gas supply mechanism configured to supply a temperature-adjusted gas into the process container, and an exhaust mechanism configured to exhaust the process container. The drying section is arranged to dry the substrate by supplying the temperature-adjusted gas into the process container with the substrate placed on the substrate support member, while exhausting the process container.
摘要翻译： 一种涂布/显影装置，包括：处理部，包括进行抗蚀剂涂布和显影的一系列处理的处理单元; 布置在处理部分和浸没曝光装置之间的界面部分; 以及设置在界面部分中的干燥部分，以在浸没曝光处理之后立即干燥基板。 所述干燥部包括被配置为容纳所述基板的处理容器，被配置为将所述基板放置在其上的基板支撑部件，配置成将经温度调节的气体供给到所述处理容器中的温度调节气体供给机构，以及配置为 排出过程容器。 干燥部被布置成通过将衬底放置在基板支撑构件上的温度调节气体供给到处理容器中，同时排出处理容器来干燥基板。
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36.发明申请公开(公告)号：US20100073647A1
公开(公告)日：2010-03-25
申请号：US12515368
申请日：2007-11-19
申请人： Hideharu Kyouda , Junichi Kitano , Taro Yamamoto
发明人： Hideharu Kyouda , Junichi Kitano , Taro Yamamoto
CPC分类号： G03F7/70958 , G03F7/70341 , G03F7/70991 , H01L21/6715
摘要： A coating film forming apparatus for immersion light exposure, for forming a coating film including a resist film or a resist film and an additional film on a substrate to be fed to an immersion light exposure apparatus configured to perform a light exposure process through a liquid, includes: one or more coating units configured to apply the resist film or the resist film and the additional film onto the substrate; one or more thermally processing units configured to perform a thermal process necessary for forming the coating film on the substrate; a checking unit configured to check a state of the coating film at an edge portion of the substrate before the immersion light exposure; and a control section configured to use a check result obtained by the checking unit to make a judgment of whether or not the state of the coating film at the edge portion of the substrate is within an acceptable range, and to permit transfer of the substrate to the light exposure apparatus when the state of the coating film is within the acceptable range.
摘要翻译： 一种用于浸没曝光的涂膜形成装置，用于在被配置为通过液体进行曝光处理的浸没曝光装置的基板上形成包括抗蚀剂膜或抗蚀剂膜和附加膜的涂膜， 包括：被配置为将抗蚀剂膜或抗蚀剂膜和附加膜施加到基底上的一个或多个涂层单元; 一个或多个热处理单元，被配置为执行在基板上形成涂膜所需的热处理; 检查单元，被配置为在浸没曝光之前检查在所述基板的边缘部分处的所述涂膜的状态; 以及控制部，被配置为使用由所述检查单元获得的检查结果来判断在所述基板的边缘部分处的所述涂膜的状态是否在可接受的范围内，并且允许将所述基板转印到 当涂膜的状态在可接受的范围内时的曝光装置。
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公开(公告)号：US07486377B2
公开(公告)日：2009-02-03
申请号：US10578611
申请日：2004-11-26
申请人： Junichi Kitano , Osamu Miyahara , Shinya Wakamizu
发明人： Junichi Kitano , Osamu Miyahara , Shinya Wakamizu
CPC分类号： G03F7/40
摘要： A developing method is used for subjecting a light-exposed resist film disposed on a wafer W to a developing process by a developing solution and a rinsing process by a rinsing liquid. In a state where the resist film on the wafer W is wet with the developing solution or rinsing liquid before a drying process is performed on the wafer W, a chemical liquid (curing chemical liquid), which contains a resist curing aid contributory to curing of a resist film remaining on the wafer W, is supplied onto a surface of the wafer W. Then, ultraviolet rays are radiated onto a surface of the wafer to cure a resist film remaining on the wafer W by a synergistic effect of the resist curing aid and the ultraviolet rays thus radiated, so as to prevent pattern fall.
摘要翻译： 使用显影方法对设置在晶片W上的曝光抗蚀剂膜进行显影液的显影处理和通过漂洗液的漂洗处理。 在对晶片W进行干燥处理之前，晶片W上的抗蚀剂膜与显影液或漂洗液体湿润的状态下，含有抗蚀剂固化助剂的化学液（固化化学液） 保留在晶片W上的抗蚀剂膜被提供到晶片W的表面上。然后，通过抗蚀剂固化助剂的协同效应将紫外线辐射到晶片的表面上以固化残留在晶片W上的抗蚀剂膜 并且因此辐射紫外线，以防止图案下降。
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38.发明申请SUBSTRATE TREATMENT METHOD, COATING TREATMENT APPARATUS, AND SUBSTRATE TREATMENT SYSTEM 有权基板处理方法，涂层处理装置和基板处理系统公开(公告)号：US20080176003A1
公开(公告)日：2008-07-24
申请号：US12016436
申请日：2008-01-18
CPC分类号： H01L21/67225 , H01L21/67051 , H01L21/6715 , Y10S414/136 , Y10S414/141
摘要： In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.
摘要翻译： 在涂布处理装置中，在第一处理室中，由转印臂保持的基板的前表面和后表面通过转动机构反转，并且涂布溶液从涂布喷嘴施加到基板的后表面。 将基板转移到第二处理室中，其中通过加热单元将后表面上的涂布溶液加热固化，从而在基板的后表面上形成涂膜。 在曝光处理之前，通过涂布处理装置形成涂膜，由此基板的后表面可以平坦地进行曝光处理。
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公开(公告)号：US20080124489A1
公开(公告)日：2008-05-29
申请号：US11944557
申请日：2007-11-23
申请人： Taro Yamamoto , Yasushi Takiguchi , Akihiro Fujimoto , Hideharu Kyouda , Junichi Kitano , Osamu Miyahara , Kenji Tsutsumi
发明人： Taro Yamamoto , Yasushi Takiguchi , Akihiro Fujimoto , Hideharu Kyouda , Junichi Kitano , Osamu Miyahara , Kenji Tsutsumi
CPC分类号： H01L21/6715 , H01L21/67178 , H01L21/67276
摘要： A coating film forming apparatus includes a process section including one or more coating units and one or more thermally processing units; a pre-coating cleaning unit configured to perform cleaning on a back surface and an edge portion of a substrate; and a pre-coating check unit configured to check a state of a back surface and an edge portion of the substrate. A control section is configured to realize a sequence of cleaning the substrate by the pre-coating cleaning unit, checking the substrate by the pre-coating check unit, making a judgment based on a check result thus obtained of whether or not a state of particles on a back surface and an edge portion of the substrate is within an acceptable range, and permitting transfer of the substrate into the process section where the state of particles is within the acceptable range.
摘要翻译： 涂膜形成装置包括具有一个或多个涂布单元和一个或多个热处理单元的处理部分; 构造成在基板的背面和边缘部分上进行清洗的预涂层清洁单元; 以及配置为检查基板的背面和边缘部分的状态的预涂层检查单元。 控制部被配置为通过预涂清洁单元实现清洁基板的顺序，通过预涂单元检查基板，基于由此获得的检查结果判断颗粒的状态 在基板的后表面和边缘部分处于可接受的范围内，并且允许将基板转移到颗粒状态在可接受范围内的处理部分中。
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公开(公告)号：US20050266359A1
公开(公告)日：2005-12-01
申请号：US11181770
申请日：2005-07-15
申请人： Yuko Ono , Junichi Kitano
发明人： Yuko Ono , Junichi Kitano
IPC分类号： G03F7/30
CPC分类号： G03D5/00 , G03F7/3028 , G03F7/322 , Y10S134/902
摘要： In a developing method for performing developing treatment of a substrate by supplying a developing solution onto a resist film formed on a surface of the substrate, the present invention controls a zeta potential of the surface of the substrate at a predetermined potential in the same polarity as that of a zeta potential of insoluble substances floating in the developing solution, thereby preventing or reducing the adhesion of the insoluble substances to the resist film and the substrate. This remedies the occurrence of development defects. The adhesion of the insoluble substances to the resist film and the substrate can also be prevented or inhibited by supplying an acid liquid to a liquid on the substrate, or controlling a pH value of the liquid on the substrate to control an absolute value of the zeta potential of the insoluble substances.
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