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    Detecting defects on a wafer using defect-specific and multi-channel information
    31.
    发明授权
    Detecting defects on a wafer using defect-specific and multi-channel information 有权
    使用缺陷特定和多通道信息检测晶片上的缺陷

    公开(公告)号：US09092846B2

    公开(公告)日：2015-07-28

    申请号：US14169161

    申请日：2014-01-31

    Applicant: KLA-Tencor Corporation

    Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

    IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  H01L21/66

    CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

    Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

    Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。

    Repeater detection
    35.
    发明授权
    Repeater detection 有权

    公开(公告)号：US09766187B2

    公开(公告)日：2017-09-19

    申请号：US14838091

    申请日：2015-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

    IPC: G01N21/95 ,  G01N21/956 ,  G01N21/00

    CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

    Array mode repeater detection
    36.
    发明授权
    Array mode repeater detection 有权

    公开(公告)号：US09766186B2

    公开(公告)日：2017-09-19

    申请号：US14674856

    申请日：2015-03-31

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka

    IPC: G01N21/95 ,  G01N21/00 ,  G01N21/94

    CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N2201/061 ,  G01N2201/10

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

    Wafer Defect Discovery
    38.
    发明申请
    Wafer Defect Discovery 审中-公开
    晶圆缺陷发现

    公开(公告)号：US20170076911A1

    公开(公告)日：2017-03-16

    申请号：US15359589

    申请日：2016-11-22

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

    IPC: H01J37/28

    CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

    Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

    Repeater Detection
    39.
    发明申请
    Repeater Detection 有权
    中继器检测

    公开(公告)号：US20160061745A1

    公开(公告)日：2016-03-03

    申请号：US14838091

    申请日：2015-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system.The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 此外，该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像， 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。

    Detecting Defects on a Wafer Using Defect-Specific and Multi-Channel Information
    40.
    发明申请
    Detecting Defects on a Wafer Using Defect-Specific and Multi-Channel Information 有权
    使用缺陷特定和多通道信息检测晶片上的缺陷

    公开(公告)号：US20160027165A1

    公开(公告)日：2016-01-28

    申请号：US14811409

    申请日：2015-07-28

    Applicant: KLA-Tencor Corporation

    Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

    IPC: G06T7/00 ,  H01L21/66 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956

    CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

    Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

    Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。

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