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31.
公开(公告)号:US12200853B2
公开(公告)日:2025-01-14
申请号:US17849841
申请日:2022-06-27
Applicant: KYOCERA AVX Components Corporation
Inventor: Cory Nelson , Jeff Borgman , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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公开(公告)号:US12131848B2
公开(公告)日:2024-10-29
申请号:US17582631
申请日:2022-01-24
Applicant: KYOCERA AVX Components Corporation
Inventor: Palaniappan Ravindranathan , Marianne Berolini , Michael W. Kirk
Abstract: A varistor can include a monolithic body including a plurality of dielectric layers stacked in a Z-direction that is perpendicular to a longitudinal direction. The monolithic body can have a first end and a second end that is spaced apart from the first end in the longitudinal direction. A first external terminal can be disposed along the first end. A second external terminal can be disposed along the second end. A first plurality of electrodes can be connected with the first external terminal and can extend from the first end towards the second end of the monolithic body. A second plurality of electrodes can be connected with the second external terminal and can extend from the second end towards the first end of the monolithic body. At least one of the first external terminal or the second external terminal can include a conductive polymeric composition.
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公开(公告)号:US20240292540A1
公开(公告)日:2024-08-29
申请号:US18582750
申请日:2024-02-21
Applicant: KYOCERA AVX Components Corporation
Inventor: Ronald Demcko , Cory Nelson , Marianne Berolini
CPC classification number: H05K1/18 , H05K1/0203 , H05K2201/066 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10189 , H05K2201/10393 , H05K2201/10522 , H05K2201/1053
Abstract: The present disclosure provides multicomponent connector assemblies and methods of forming such assemblies. For example, a multicomponent connector assembly includes a multicomponent connector having first and support members and also includes a plurality of components disposed between the first and second support members. At least one of the plurality of components may be a heat sink component configured to conduct heat from a first area to a second area. Additionally, or alternatively, the plurality of components may include a capacitor, a resistor, a varistor, an inductor, or the like. In at least some connectors, a plurality of slots are defined, and at least one component is disposed between the first and support members in a respective one slot of the plurality of slots.
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公开(公告)号:US12033801B2
公开(公告)日:2024-07-09
申请号:US17567936
申请日:2022-01-04
Applicant: KYOCERA AVX Components Corporation
Inventor: Marianne Berolini , Jeffrey A Horn
Abstract: A broadband multilayer ceramic capacitor may include a first external terminal and a second external terminal. A bottom portion of the first external terminal may be spaced apart from a bottom portion of the second external terminal by a bottom external terminal spacing distance. A first active electrode layer may include a first active electrode connected with the first external terminal and a second active electrode connected with the second external terminal and co-planar with the first electrode. A second active electrode layer may include a third active electrode connected to the first external terminal and a fourth active electrode connected to the second external terminal and co-planar with the fourth electrode. The first active electrode may overlap the fourth active electrode in the longitudinal direction. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be greater than about 4.
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公开(公告)号:US20240136448A1
公开(公告)日:2024-04-25
申请号:US18489042
申请日:2023-10-17
Applicant: KYOCERA AVX Components Corporation
Inventor: Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
IPC: H01L29/94
CPC classification number: H01L29/94
Abstract: A metal-oxide-semiconductor (MOS) capacitor can include a substrate comprising a semiconductor material, an oxide layer formed over a first surface of the substrate, a resistive layer formed over at least a portion of the oxide layer, and a conductive layer formed over at least a portion of the resistive layer. As such, the MOS capacitor can include a resistor and a capacitor formed in series with one another.
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公开(公告)号:US20240136123A1
公开(公告)日:2024-04-25
申请号:US18489039
申请日:2023-10-17
Applicant: KYOCERA AVX Components Corporation
Inventor: Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
CPC classification number: H01G4/33 , H01G4/1254 , H01G4/252 , H05K1/162 , H05K2201/09554
Abstract: A single layer capacitor can include a substrate having a first surface and a second surface opposite the first surface. A resistive layer can be formed over at least a portion of the first surface of the substrate. A first conductive layer can be formed over at least a portion of the resistive layer. A second conductive layer can be formed over at least a portion of the second surface of the substrate. As such, the single layer capacitor can include a resistor and a capacitor formed in series with one another.
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公开(公告)号:US20240032185A1
公开(公告)日:2024-01-25
申请号:US18350782
申请日:2023-07-12
Applicant: KYOCERA AVX Components Corporation
Inventor: Cory Nelson , Marianne Berolini , Ronald Demcko
IPC: H05K1/02
CPC classification number: H05K1/021 , H05K2201/10757 , H05K2201/10537 , H05K2201/066
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.
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公开(公告)号:US11837405B2
公开(公告)日:2023-12-05
申请号:US17537827
申请日:2021-11-30
Applicant: KYOCERA AVX Components Corporation
Inventor: Marianne Berolini , Cory Nelson , Seth Fuller , Alma Iris Cordova
CPC classification number: H01G4/008 , H01G4/1227 , H01G4/248 , H01G4/30
Abstract: The present invention is directed to a multilayer ceramic capacitor. The multilayer ceramic capacitor has a first end and a second end that is spaced apart from the first end in a longitudinal direction that is perpendicular to a lateral direction wherein the lateral direction and longitudinal direction are each perpendicular to a Z-direction. The multilayer ceramic capacitor comprises a monolithic body comprising a plurality of dielectric layers and a plurality of electrode layers parallel with the lateral direction. At least one electrode layer includes a first electrode comprising a connecting portion and a central portion extending from the connecting portion in the longitudinal direction wherein the central portion includes a Z-directional edge and the connecting portion includes an edge extending in both the longitudinal direction and the Z-direction and wherein the Z-directional edge of the central portion forms a first angle of from greater than 90° to less than 180° with the edge of the connecting portion. A first external termination disposed along the first end and a second external termination disposed along the second end.
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公开(公告)号:US11830676B2
公开(公告)日:2023-11-28
申请号:US17567930
申请日:2022-01-04
Applicant: KYOCERA AVX Components Corporation
Inventor: Marianne Berolini , Jeffrey A Horn
CPC classification number: H01G4/012
Abstract: A broadband multilayer ceramic capacitor can include at least one active electrode layer including a first active electrode and a second active electrode. The first active electrode can have a central portion extending away from a base portion in a longitudinal direction. The second active electrode can include at least one arm extending away from a base portion towards the first end and overlapping the central portion of the first active electrode. A first shield electrode in a shield electrode region can have a central portion extending from a base portion. A second shield electrode can include an arm overlapping the central portion of the first shield electrode in the longitudinal direction. The shield electrode region can be spaced apart from the active electrode region by a shield-to-active distance that is greater than an active electrode spacing distance between respective active electrodes of the plurality of active electrodes.
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公开(公告)号:US20220115182A1
公开(公告)日:2022-04-14
申请号:US17557114
申请日:2021-12-21
Applicant: KYOCERA AVX Components Corporation
Inventor: Marianne Berolini , Jeffrey A. Horn , Richad C. VanAlstine
Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.
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