公开(公告)号：US20050084792A1

公开(公告)日：2005-04-21

申请号：US10973302

申请日：2004-10-27

申请人： Shigeru Yokoi ,  Kazumasa Wakiya

发明人： Shigeru Yokoi ,  Kazumasa Wakiya

IPC分类号： C23F11/00 ,  G03F7/42 ,  H01L21/027 ,  H01L21/304 ,  H01L21/311 ,  H01L21/3213 ,  G03C11/12

CPC分类号： G03F7/425 ,  G03F7/423 ,  G03F7/426 ,  H01L21/02071 ,  H01L21/31116

摘要： A photoresist stripping solution which comprises (a) a salt of hydrofluoric acid with a base free from metal ions, (b) a water-soluble organic solvent, (c) a mercapto group containing corrosion inhibitor, and (d) water, and a method of stripping photoresists with the use of the same are disclosed. In case of using ammonium fluoride as component (a), the photoresist stripping solution may further contain (e) a salt of hydrofluoric acid with a quaternary ammonium hydroxide, such as tetramethylammonium hydroxide, tetrapropylammonium hydroxide, etc., and/or an alkanolamine. The photoresist stripping solution of the present invention has an excellent effect of protecting both Al- and Cu-based metal wiring conductors from corrosion, of efficiently stripping photoresist films and post-ashing residues, and is free from the precipitation of the corrosion inhibitor.

摘要翻译： 一种光致抗蚀剂剥离溶液，其包含（a）不含金属离子的碱的氢氟酸盐，（b）水溶性有机溶剂，（c）含巯基的缓蚀剂，和（d）水，和 公开了使用其剥离光致抗蚀剂的方法。 在使用氟化铵作为组分（a）的情况下，光致抗蚀剂剥离溶液还可以含有（e）氢氟酸盐与季铵氢氧化物如四甲基氢氧化铵，四丙基氢氧化铵等和/或链烷醇胺。 本发明的光致抗蚀剂剥离溶液具有优异的保护Al和Cu基金属布线导体免受腐蚀，有效地剥离光致抗蚀剂膜和后灰化残留物的作用，并且没有腐蚀抑制剂的沉淀。

公开(公告)号：US06746963B2

公开(公告)日：2004-06-08

申请号：US10136744

申请日：2002-04-30

申请人： Yasushi Fujii ,  Hiroyuki Iida ,  Isao Sato ,  Kazumasa Wakiya ,  Shigeru Yokoi

发明人： Yasushi Fujii ,  Hiroyuki Iida ,  Isao Sato ,  Kazumasa Wakiya ,  Shigeru Yokoi

IPC分类号： H01L21302

CPC分类号： H01L21/31116 ,  H01L21/316 ,  H01L21/76802

摘要： A method for processing a coating film includes the steps of forming a silica group coating film having a low dielectric constant on a substrate, conducting an etching process to the silica group coating film through a photoresist pattern, and processing the silica group coating film with plasma induced from helium gas. With this, it is possible to prevent the silica group coating film from being damaged when a wet stripping process is conducted to remove the photoresist pattern as a subsequent process, and to maintain the low dielectric constant of the coating film.

摘要翻译： 一种涂膜的处理方法，其特征在于，在基板上形成介电常数低的二氧化硅系涂膜，通过光致抗蚀剂图案对二氧化硅基涂膜进行蚀刻处理，并对该二氧化硅基涂膜进行等离子体处理 由氦气引起。 由此，当进行湿剥离处理以除去作为后续工艺的光致抗蚀剂图案时，可以防止二氧化硅基涂膜损坏，并且保持涂膜的低介电常数。

公开(公告)号：US08192923B2

公开(公告)日：2012-06-05

申请号：US11898174

申请日：2007-09-10

申请人： Shigeru Yokoi ,  Kazumasa Wakiya

发明人： Shigeru Yokoi ,  Kazumasa Wakiya

IPC分类号： G03C11/12

CPC分类号： G03F7/425 ,  G03F7/423 ,  G03F7/426 ,  H01L21/02071 ,  H01L21/31116

摘要： A photoresist stripping solution which comprises (a) a salt of hydrofluoric acid with a base free from metal ions, (b) a water-soluble organic solvent, (c) a mercapto group containing corrosion inhibitor, and (d) water, and a method of stripping photoresists with the use of the same are disclosed. In case of using ammonium fluoride as component (a), the photoresist stripping solution may further contain (e) a salt of hydrofluoric acid with a quaternary ammonium hydroxide, such as tetramethylammonium hydroxide, tetrapropylammonium hydroxide, etc., and/or an alkanolamine. The photoresist stripping solution of the present invention has an excellent effect of protecting both Al- and Cu-based metal wiring conductors from corrosion, of efficiently stripping photoresist films and post-ashing residues, and is free from the precipitation of the corrosion inhibitor.

摘要翻译： 一种光致抗蚀剂剥离溶液，其包含（a）不含金属离子的碱的氢氟酸盐，（b）水溶性有机溶剂，（c）含巯基的缓蚀剂，和（d）水，和 公开了使用其剥离光致抗蚀剂的方法。 在使用氟化铵作为组分（a）的情况下，光致抗蚀剂剥离溶液还可以含有（e）氢氟酸盐与季铵氢氧化物如四甲基氢氧化铵，四丙基氢氧化铵等和/或链烷醇胺。 本发明的光致抗蚀剂剥离溶液具有优异的保护Al和Cu基金属布线导体免受腐蚀，有效地剥离光致抗蚀剂膜和后灰化残留物的作用，并且没有腐蚀抑制剂的沉淀。

公开(公告)号：US08158568B2

公开(公告)日：2012-04-17

申请号：US12801452

申请日：2010-06-09

申请人： Shigeru Yokoi ,  Kazumasa Wakiya

发明人： Shigeru Yokoi ,  Kazumasa Wakiya

IPC分类号： C11D3/34 ,  C11D3/44 ,  C11D1/62

CPC分类号： H01L21/31144 ,  C11D7/32 ,  C11D11/0047 ,  H01L21/31138 ,  H01L21/76807

摘要： It is disclosed a cleaning liquid used in a process for forming a dual damascene structure comprising steps of etching a low dielectric layer (low-k layer) accumulated on a substrate having thereon a metallic layer to form a first etched-space; charging a sacrifice layer in the first etched-space; partially etching the low dielectric layer and the sacrifice layer to form a second etched-space connected to the first etched-space; and removing the sacrifice layer remaining in the first etched-space with the cleaning liquid, wherein the cleaning liquid comprises (a) 1-25 mass % of a quaternary ammonium hydroxide, such as TMAH and choline (b) 30-70 mass % of a water soluble organic solvent, and (c) 20-60 mass % of water. The cleaning liquid attains in a well balanced manner such effects that a sacrifice layer used for forming a dual damascene structure is excellently removed, and a low dielectric layer is not damaged upon formation of a metallic wiring on a substrate having a metallic layer (such as a Cu layer) and the low dielectric layer formed thereon.

摘要翻译： 公开了一种用于形成双镶嵌结构的方法中使用的清洗液，包括以下步骤：蚀刻积聚在其上具有金属层的基底上的低介电层（低k层），以形成第一蚀刻空间; 在第一蚀刻空间中填充牺牲层; 部分地蚀刻低介电层和牺牲层以形成连接到第一蚀刻空间的第二蚀刻空间; 并用清洗液除去残留在第一蚀刻空间中的牺牲层，其中清洗液包含（a）1-25质量％的季铵氢氧化物，如TMAH和胆碱（b），30-70质量％ 水溶性有机溶剂，（c）20〜60质量％的水。 清洗液以良好平衡的方式达到这样的效果，即用于形成双镶嵌结构的牺牲层被极好地去除，并且在具有金属层的基底上形成金属布线时，低介电层不被损坏（例如 Cu层）和形成在其上的低电介质层。

公开(公告)号：US20100051582A1

公开(公告)日：2010-03-04

申请号：US12591210

申请日：2009-11-12

申请人： Shigeru Yokoi ,  Kazumasa Wakiya

发明人： Shigeru Yokoi ,  Kazumasa Wakiya

IPC分类号： B44C1/22 ,  C11D7/32

CPC分类号： H01L21/31144 ,  C11D7/32 ,  C11D11/0047 ,  H01L21/31138 ,  H01L21/76807

摘要： It is disclosed a cleaning liquid used in a process for forming a dual damascene structure comprising steps of etching a low dielectric layer (low-k layer) accumulated on a substrate having thereon a metallic layer to form a first etched-space; charging a sacrifice layer in the first etched-space; partially etching the low dielectric layer and the sacrifice layer to form a second etched-space connected to the first etched-space; and removing the sacrifice layer remaining in the first etched-space with the cleaning liquid, wherein the cleaning liquid comprises (a) 1-25 mass % of a quaternary ammonium hydroxide, such as TMAH and choline, (b) 30-70 mass % of a water soluble organic solvent, and (c) 20-60 mass % of water. The cleaning liquid attains in a well balanced manner such effects that a sacrifice layer used for forming a dual damascene structure is excellently removed, and a low dielectric layer is not damaged upon formation of a metallic wiring on a substrate having a metallic layer (such as a Cu layer) and the low dielectric layer formed thereon.

摘要翻译： 公开了一种用于形成双镶嵌结构的方法中使用的清洗液，包括以下步骤：蚀刻积聚在其上具有金属层的基底上的低介电层（低k层），以形成第一蚀刻空间; 在第一蚀刻空间中填充牺牲层; 部分地蚀刻低介电层和牺牲层以形成连接到第一蚀刻空间的第二蚀刻空间; 并用清洗液去除残留在第一蚀刻空间中的牺牲层，其中清洗液包含（a）1-25质量％的季铵氢氧化物，如TMAH和胆碱，（b）30-70质量％ 的水溶性有机溶剂，（c）20〜60质量％的水。 清洗液以良好平衡的方式达到这样的效果，即用于形成双镶嵌结构的牺牲层被极好地去除，并且在具有金属层的基底上形成金属布线时，低介电层不被损坏（例如 Cu层）和形成在其上的低电介质层。

公开(公告)号：US20070298619A1

公开(公告)日：2007-12-27

申请号：US11889394

申请日：2007-08-13

申请人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Takayuki Haraguchi

发明人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Takayuki Haraguchi

IPC分类号： H01L21/302

CPC分类号： G03F7/425

摘要： Disclosed is a method for stripping a photoresist comprising: (I) providing a photoresist pattern on a substrate where the substrate has at least a copper (Cu) wiring and a low-dielectric layer thereon, and selectively etching the low-dielectric layer by using the photoresist pattern as a mask; (II) contacting the substrate after the step (I), with ozone water and/or aqueous hydrogen peroxide; and (III) contacting the substrate after the step (II), with a photoresist stripping solution that contains at least a quaternary ammonium hydroxide. The present invention provides a method for stripping a photoresist that enables to strip effectively photoresist films and etching residues after etching step even in a process not including an O2 plasma ashing treatment in micropatterning of a substrate having at least Cu wiring and a low-dielectric layer thereon, as in a dual damascene forming process, and, in addition, the method of the invention does not have any negative influence on the dielectric constant of the low-dielectric layer, and ensures an excellent anti-corrosivity.

摘要翻译： 公开了一种剥离光致抗蚀剂的方法，包括：（I）在衬底上提供光致抗蚀剂图案，其中衬底至少具有铜（Cu）布线和其上的低电介质层，并且通过使用选择性地蚀刻低电介质层 光刻胶图案作为掩模; （II）在步骤（I）之后与臭氧水和/或过氧化氢水溶液接触; 和（III）在步骤（II）之后使基底与至少含有氢氧化季铵的光致抗蚀剂剥离溶液接触。 本发明提供了一种剥离光致抗蚀剂的方法，其即使在不包括O 2等离子体灰浆化处理的工艺中也能有效剥离光致抗蚀剂膜和蚀刻残留物，其中至少具有至少 Cu布线和其中的低介电层，如在双镶嵌形成工艺中，此外，本发明的方法对低电介质层的介电常数没有任何负面影响，并且确保了优异的抗 - 腐蚀性

公开(公告)号：US20070105035A1

公开(公告)日：2007-05-10

申请号：US11645172

申请日：2006-12-26

申请人： Shigeru Yokoi ,  Takayuki Haraguchi ,  Kazumasa Wakiya ,  Akira Kumazawa

发明人： Shigeru Yokoi ,  Takayuki Haraguchi ,  Kazumasa Wakiya ,  Akira Kumazawa

IPC分类号： G03C11/12

CPC分类号： G03F7/423

摘要： Disclosed is a photoresist stripping solution comprising: (a) a salt of hydrofluoric acid with a base free from metallic ions; and (b) a water-soluble organic solvent, wherein the content of the component (a) is 0.001 to 0.1 mass % based on the total mass of the photoresist stripping solution. Also disclosed is a method of treating a substrate, which comprises: forming a photoresist film on a substrate; subjecting it to light exposure and then to development; etching thereof with a photoresist pattern as a mask pattern; ashing the mask; and bringing the photoresist stripping solution into contact with the substrate.

摘要翻译： 公开了一种光致抗蚀剂剥离溶液，其包含：（a）氢氟酸与不含金属离子的碱的盐; 和（b）水溶性有机溶剂，其中组分（a）的含量相对于光致抗蚀剂剥离溶液的总质量为0.001〜0.1质量％。 还公开了一种处理衬底的方法，其包括：在衬底上形成光致抗蚀剂膜; 使其曝光，然后进行开发; 用光刻胶图案作为掩模图案进行蚀刻; 灰化面具; 并使光致抗蚀剂剥离溶液与基材接触。

公开(公告)号：US20070027052A1

公开(公告)日：2007-02-01

申请号：US11546440

申请日：2006-10-12

申请人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Koji Saito

发明人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Koji Saito

IPC分类号： C11D7/32

CPC分类号： C11D11/0047 ,  C11D1/62 ,  C11D7/3209 ,  C11D7/3281 ,  C11D7/34 ,  G03F7/425 ,  G03F7/426

摘要： It is disclosed a cleaning liquid for stripping and disssolving a photoresist pattern having a film thickness of 10-150 μm, which contains (a) 0.5-15 mass % of a quaternary ammonium hydroxide, such as tetrapropylammonium hydroxide and tetrabutylammonium hydroxide, (b) 65-97 mass % of a water-soluble organic solvent, such as dimethylsulfoxide or a mixed solvent thereof with N-methyl-2-pyrrolidone, sulforane, etc., and (c) 0.5-30 mass % of water, and a method for treating a substrate therewith.

摘要翻译： 公开了一种用于剥离和去溶解膜厚度为10-150μm的光致抗蚀剂图案的清洗液，其含有（a）0.5-15质量％的季铵氢氧化物，例如四丙基氢氧化铵和四丁基氢氧化铵，（b） 65-97质量％的水溶性有机溶剂，例如二甲基亚砜或其与N-甲基-2-吡咯烷酮，sulforane等的混合溶剂，和（c）0.5-30质量％的水，以及 用于处理基材。

公开(公告)号：US20060035176A1

公开(公告)日：2006-02-16

申请号：US11246297

申请日：2005-10-11

申请人： Shigeru Yokoi ,  Kazumasa Wakiya

发明人： Shigeru Yokoi ,  Kazumasa Wakiya

IPC分类号： G03F7/32

CPC分类号： G03F7/422 ,  C11D7/265 ,  C11D7/3218 ,  C11D7/34 ,  C11D11/0047 ,  G03F7/425

摘要： A photoresist stripping solution comprising (a) a carboxyl group-containing acidic compound, (b) at least one basic compound (for example, monoethanolamine, tetraalkylammonium) selected from among alkanolamines and specific quaternary ammonium hydroxides, (c) a sulfur-containing corrosion inhibitor and (d) water, and having a pH value of 3.5-5.5; and a method of stripping photoresists using the same are disclosed. The present invention provides a photoresist stripping solution which is excellent in the effect of protecting metal wirings (in particular, Cu wirings) from corrosion, never damages interlevel films, such as low dielectric layers or organic SOG layers, and shows excellent strippability of photoresist films and post-ashing residues.

公开(公告)号：US20050019688A1

公开(公告)日：2005-01-27

申请号：US10925978

申请日：2004-08-26

申请人： Kazumasa Wakiya ,  Shigeru Yokoi

发明人： Kazumasa Wakiya ,  Shigeru Yokoi

IPC分类号： C11D1/62 ,  C11D7/32 ,  C11D11/00 ,  G03F7/42 ,  G03C11/12

CPC分类号： H01L21/02068 ,  C11D1/62 ,  C11D7/32 ,  C11D11/0047 ,  G03F7/425 ,  G03F7/426

摘要： A photoresist stripping solution comprising (a) a specified quaternary ammonium hydroxide, such as tetrabutylammonium hydroxide, tetrapropylammonium hydroxide, methyltributylammonium hydroxide or methyltripropylammonium hydroxide, (b) a water-soluble amine, (c) water, (d) a corrosion inhibitor and (e) a water-soluble organic solvent, the compounding ratio of component (a) to component (b) being in the range of from 1:3 to 1:10 by mass, as well as a method of stripping photoresists using the solution. The stripping solution of the invention assures effective protection of Al, Cu and other wiring metal conductors against corroding as well as efficient stripping of the photoresist film, post-ashing residues such as modified photoresist film and metal depositions. It also assures efficient stripping of Si-based residues and effective protection of the substrate (particularly the reverse side of a Si substrate) from corroding.

摘要翻译： 光致抗蚀剂剥离溶液，其包含（a）特定的季铵氢氧化物，例如四丁基氢氧化铵，氢氧化四丙基铵，氢氧化甲基三丁基铵或甲基三氢丙基氢氧化铵，（b）水溶性胺，（c）水，（d）腐蚀抑制剂和（ e）水溶性有机溶剂，组分（a）与组分（b）的混合比例在1:3至1:10的范围内，以及使用溶液剥离光致抗蚀剂的方法。 本发明的剥离溶液确保有效保护Al，Cu和其它布线金属导体免受腐蚀以及光致抗蚀剂膜的有效剥离，后灰化残留物如修饰的光致抗蚀剂膜和金属沉积。 它还确保有效剥离Si基残留物并有效保护基材（特别是Si基板的反面）免受腐蚀。