WAFER TEST CASSETTE SYSTEM
    31.
    发明申请
    WAFER TEST CASSETTE SYSTEM 有权
    WAFER测试CASSETTE系统

    公开(公告)号:US20110156735A1

    公开(公告)日:2011-06-30

    申请号:US12979200

    申请日:2010-12-27

    CPC classification number: G01R1/0491 G01R31/3025

    Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

    Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动,同时允许在垂直于接收表面的方向上的相对运动。

    TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES
    32.
    发明申请
    TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 有权
    用于测试电子设备的测试系统和方法

    公开(公告)号:US20110156734A1

    公开(公告)日:2011-06-30

    申请号:US12979159

    申请日:2010-12-27

    CPC classification number: G01R31/2891

    Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

    Abstract translation: 被测设备(DUT)可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置,DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中,其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件,使得DUT可以在对准器中对准,而在测试单元中测试已经与对准器中的载体对准的其它DUT。

    Mechanical decoupling of a probe card assembly to improve thermal response
    33.
    发明授权
    Mechanical decoupling of a probe card assembly to improve thermal response 有权
    探针卡组件的机械去耦以改善热响应

    公开(公告)号:US07960989B2

    公开(公告)日:2011-06-14

    申请号:US12478117

    申请日:2009-06-04

    CPC classification number: G01R31/2889

    Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

    Abstract translation: 加强结构,布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间,并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性,并且在大致平行于主表面的第二方向上是柔性的。

    Stiffener assembly for use with testing devices
    34.
    发明授权
    Stiffener assembly for use with testing devices 有权
    用于测试装置的加强装置

    公开(公告)号:US07956635B2

    公开(公告)日:2011-06-07

    申请号:US12345740

    申请日:2008-12-30

    CPC classification number: G01R1/07378

    Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

    Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中,用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构,其中对准机构将施加到内部构件的下表面的力传递到外部构件,并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

    Rotating contact element and methods of fabrication
    35.
    发明授权
    Rotating contact element and methods of fabrication 失效
    旋转接触元件和制造方法

    公开(公告)号:US07851794B2

    公开(公告)日:2010-12-14

    申请号:US11617394

    申请日:2006-12-28

    Applicant: Eric D. Hobbs

    Inventor: Eric D. Hobbs

    CPC classification number: G01R1/06716 G01R1/06733 Y10T29/49128

    Abstract: Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.

    Abstract translation: 本文提供旋转接触元件和制造方法。 在一个实施例中,旋转接触元件包括尖端,其具有被配置为接触待测试装置和相对的第二侧的第一侧; 以及多个变形构件,其从所述尖端的第二侧延伸并围绕其中心轴线布置,其中当所述多个变形构件压缩时,所述尖端基本上围绕所述中心轴线旋转。

    Component assembly and alignment
    36.
    发明授权
    Component assembly and alignment 失效
    组件组装和对齐

    公开(公告)号:US07808259B2

    公开(公告)日:2010-10-05

    申请号:US11861559

    申请日:2007-09-26

    Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

    Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构,使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件,其可以是探针卡组件的部件。

    MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE
    37.
    发明申请
    MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE 有权
    探索卡组件机械装置改善热响应

    公开(公告)号:US20100134127A1

    公开(公告)日:2010-06-03

    申请号:US12478117

    申请日:2009-06-04

    CPC classification number: G01R31/2889

    Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

    Abstract translation: 加强结构,布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间,并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性,并且在大致平行于主表面的第二方向上是柔性的。

    Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies
    38.
    发明授权
    Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies 有权
    用于调节机电组件的热诱导运动的装置和方法

    公开(公告)号:US07688063B2

    公开(公告)日:2010-03-30

    申请号:US12165325

    申请日:2008-06-30

    CPC classification number: G01R1/44 G01R1/07307 G01R31/2891

    Abstract: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

    Abstract translation: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括:补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构,并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    39.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US20100000080A1

    公开(公告)日:2010-01-07

    申请号:US12477748

    申请日:2009-06-03

    CPC classification number: G01R31/2874 G01R31/2863 G01R31/2889 Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。

    STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
    40.
    发明申请
    STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 有权
    强化装置与测试装置一起使用

    公开(公告)号:US20090108861A1

    公开(公告)日:2009-04-30

    申请号:US12345740

    申请日:2008-12-30

    CPC classification number: G01R1/07378

    Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

    Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中,用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构,其中对准机构将施加到内部构件的下表面的力传递到外部构件,并且在内部构件和内部构件之间提供主要的导电传热通道 外部成员。

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