摘要:
A projection exposure mask acceptance decision system includes assurance object measuring unit to measure quality assurance objects relating to projection exposure mask, first exposure characteristic deterioration quantity calculating unit to calculate first exposure characteristic deterioration quantity caused by deviations in average values of the quality assurance objects measured by the measuring unit, second exposure characteristic deterioration quantity calculating unit to calculate second exposure characteristic deterioration quantity caused by dispersion in the quality assurance objects measured by the measuring unit, sum calculating unit to calculate simple sum of the first and second quantity, root sum square calculating unit to calculate root sum square of the first and second quantity, entire exposure characteristic deterioration quantity calculating unit to calculate entire exposure characteristic deterioration quantity as an interior division value of the simple sum and root sum square, and judgment unit to judge whether the entire exposure characteristic deterioration quantity is acceptable value.
摘要:
An exposure system includes a simulator speculating first and second calculated doses to project first and second reference marks onto first and second resist films, respectively, an exposure tool projecting the first reference mark onto the first resist film at test doses to form test resist patterns, a choose module choosing an optimum pattern among the test resist patterns and choosing a first optimum dose used for the optimum pattern, and a dose calculator calculating a second optimum dose for the second reference mark by correcting the first optimum dose based on the first and the second calculated doses.
摘要:
There is here disclosed a method for inspecting an exposure apparatus, comprising illuminating a mask, in which a mask-pattern including at least a set of a first mask-pattern and a second mask-pattern mutually different in shape is formed, from a direction in which a point located off an optical axis of an exposure apparatus is a center of illumination, and exposing and projecting an image of the mask-pattern toward an image-receiving element, and measuring a mutual relative distance between images of the first and second mask-patterns exposed and projected on the image-receiving element, thereby inspecting a state of an optical system of the exposure apparatus.
摘要:
A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
摘要:
There are provided a circuit designing method using a half-tone phase shift mask for forming a circuit pattern on a semiconductor substrate, and a computer-readable medium having recorded a program for causing a computer to execute the circuit designing method. The circuit designing method comprises the steps of: calculating a first lithography process tolerance, which is an index satisfying a range of a dimensional fluctuation allowed when a basic pattern representative of the circuit pattern is formed on the semiconductor substrate, and calculating a second lithography process tolerance, which is an index capable of avoiding the formation of a side lobe capable of being produced on the semiconductor substrate when the basic pattern is formed on the semiconductor substrate using the half-tone phase shift mask, respectively, using an optical simulation; calculating a common lithography process tolerance comprising an overlapping region of the first lithography process tolerance and the second lithography process tolerance; preparing an inhibiting rule for excluding a circuit pattern including the basic pattern, which is below a reference value previously set on the basis of the common lithography process tolerance, from an object to be designed; and designing a circuit using the inhibiting rule.
摘要:
A process tolerance calculating method which, in order to obtain a process tolerance in a process for forming a pattern on an object, to be processed, with the use of a projection light exposure apparatus, calculates a process tolerance for finding a relation of a light exposure amount and focal point position corresponding to a finished pattern of an allowable dimension value, comprising the steps of: (1) measuring a variation in dimension of a to-be-formed pattern in terms of its length by varying a light exposure amount and focal point position by the projecting light exposure apparatus; (2) finding a dependence of the measured pattern dimension upon the light exposure amount, at each varying focal position through a curve approximation; (3) finding a dependence of the pattern dimension which is found through the curve approximation upon the focal point position at each varying light exposure amount; (4) finding a light exposure amount corresponding to a finished pattern of an allowable dimension value, at each focal point position, from a result obtained at the step (3); and (5) finding a dependence of the light exposure amount upon the focal point position corresponding to the pattern of an allowable dimension value from a result obtained from the step (4).
摘要:
According to a sub-resolution assist feature arranging method in embodiments, it is selected which of a rule base and a model base is set for which pattern region on pattern data corresponding to a main pattern as a type of the method of arranging the sub-resolution assist feature for improving resolution of the main pattern formed on a substrate. Then, the sub-resolution assist feature by the rule base is arranged in a pattern region set as the rule base and the sub-resolution assist feature by the model base is arranged in a pattern region set as the model base.
摘要:
A method of simulating an optical intensity distribution on a substrate when a mask pattern formed on the mask is transferred to the substrate through a projection optical system by irradiating an illumination light obliquely on a mask surface of the mask, which comprises setting a phase difference between a zero-order diffraction light and a first-order diffraction light determined according to at least one of a distance between the zero-order diffraction light and the first-order diffraction light on a pupil of the projection optical system, thickness of a light-shielding portion formed on the mask, angle defined by an optical axis direction of the illumination light and an incident direction on the mask, and a difference between a size of the mask pattern and a half cycle of the mask pattern, and carrying out a simulation of the optical intensity distribution on the substrate according to the set phase difference.
摘要:
A lithography process window analyzing method for setting a process window based on ranges of exposure amounts and focus positions, and giving evaluation of reliability of the set process window, includes setting, based on a plurality of process conditions including exposure amounts and focus positions in the performed exposure processing, analysis reliability M for process conditions including an arbitrary exposure amount and an arbitrary focus position; calculating reliability R of the process window based on the analysis reliability M concerning the process conditions included in the process window; and comparing a magnitude relation between the reliability R and a predetermined threshold and determining presence or absence of reliability of the process window according to a result of the comparison.
摘要:
According to an aspect of the invention, there is provided a mask data correction method used when forming a photomask used in a photolithography process, comprising correcting mask data on the basis of simulation performed by using information including nonuniformity of an illumination luminance distribution in an exposure apparatus which uses the photomask formed by using the mask data obtained by the correction result.