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    Nuclear radiation particle power converter
    31.
    发明授权
    Nuclear radiation particle power converter 有权

    公开(公告)号：US10811157B2

    公开(公告)日：2020-10-20

    申请号：US16155145

    申请日：2018-10-09

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Anna J. Malin ,  Paul F. Gerrish ,  Bruce C. Fleischhauer ,  Larry E. Tyler

    IPC: G21H1/02 ,  G21C19/07 ,  G21H1/04 ,  G21H1/06

    Abstract: Various embodiments of a nuclear radiation particle power converter and method of forming such power converter are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first and second electrodes and electrically coupled to the first electrode, and a charge carrier separator disposed on at least a portion of a surface of the three-dimensional current collector. The power converter can also include a hole conductor layer disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material disposed such that at least one nuclear radiation particle emitted by the nuclear radiation-emitting material is incident upon the charge carrier separator.

    NUCLEAR RADIATION PARTICLE POWER CONVERTER
    34.
    发明申请
    NUCLEAR RADIATION PARTICLE POWER CONVERTER 审中-公开
    核辐射粒子功率转换器

    公开(公告)号：US20150279491A1

    公开(公告)日：2015-10-01

    申请号：US14666890

    申请日：2015-03-24

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Anna J. Malin ,  Paul F. Gerrish ,  Bruce C. Fleischhauer ,  Larry E. Tyler

    IPC: G21H1/02

    CPC classification number: G21H1/02 ,  G21C19/07 ,  G21H1/04 ,  G21H1/06 ,  Y10T29/49117

    Abstract: Various embodiments of a nuclear radiation particle power converter and method of forming such power converter are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first and second electrodes and electrically coupled to the first electrode, and a charge carrier separator disposed on at least a portion of a surface of the three-dimensional current collector. The power converter can also include a hole conductor layer disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material disposed such that at least one nuclear radiation particle emitted by the nuclear radiation-emitting material is incident upon the charge carrier separator.

    Abstract translation: 公开了核辐射粒子功率转换器的各种实施例和形成这种功率转换器的方法。 在一个或多个实施例中，功率转换器可以包括第一和第二电极，设置在第一和第二电极之间并且电耦合到第一电极的三维集电器，以及设置在第一和第二电极的至少一部分上的电荷载体分离器 表面的三维集电器。 功率转换器还可以包括设置在电荷载体分离器的至少一部分上并电耦合到第二电极的空穴导体层，以及核辐射发射材料，其被设置为使得由核辐射源发射的至少一个核辐射颗粒， 发射材料入射到电荷载体分离器上。

    Electronic package and device including same
    36.
    发明授权
    Electronic package and device including same 有权

    公开(公告)号：US12082354B2

    公开(公告)日：2024-09-03

    申请号：US17574362

    申请日：2022-01-12

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Andrew J. Ries ,  Pankti N. Shah ,  Jason D. Hamack

    IPC: H05K5/00 ,  A61N1/378 ,  H02J50/10 ,  H05K1/18

    CPC classification number: H05K5/0095 ,  A61N1/3787 ,  H02J50/10 ,  H05K1/181 ,  H05K5/0052 ,  H05K2201/10015

    Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

    Methods for forming hermetically-sealed packages including feedthrough assemblies
    37.
    发明授权
    Methods for forming hermetically-sealed packages including feedthrough assemblies 有权

    公开(公告)号：US11950387B2

    公开(公告)日：2024-04-02

    申请号：US17074171

    申请日：2020-10-19

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben

    IPC: H05K5/06 ,  A61N1/375 ,  H05K3/38 ,  H05K7/06

    CPC classification number: H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K5/06 ,  H05K7/06 ,  H05K2203/107

    Abstract: Methods of forming hermetically-sealed packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    NOISE REDUCTION FOR SENSOR APPARATUS
    38.
    发明公开
    NOISE REDUCTION FOR SENSOR APPARATUS 审中-公开

    公开(公告)号：US20230314340A1

    公开(公告)日：2023-10-05

    申请号：US17707241

    申请日：2022-03-29

    Applicant: Medtronic, Inc.

    Inventor： Luling Wang ,  Anna M. Belle ,  Mohsen Askarinya ,  David A. Ruben ,  Omid Mahdavi ,  David A. Anderson ,  Shawn C. Kelley

    IPC: G01N21/93 ,  A61B5/1495 ,  A61B5/145

    CPC classification number: G01N21/93 ,  A61B5/14865 ,  A61B5/14532 ,  A61B5/1495

    Abstract: An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of biotransducers and a controller. The plurality of biotransducers are configured to provide a baseline signal, one or more analyte signals, and at least one error condition signal. The plurality of biotransducers at least one reference biotransducer, one or more working biotransducers, and at least one working as reference biotransducer. The controller is operatively coupled to the plurality of biotransducers and is configured to receive the baseline signal, the one or more analyte signals, and the error correction signal. The controller is further configured to determine and/or output one or more adjusted analyte levels using the baseline signal, the one or more analyte signals, and the error correction signal.

    SEALED PACKAGE AND METHOD OF FORMING SAME
    39.
    发明申请
    SEALED PACKAGE AND METHOD OF FORMING SAME 有权

    公开(公告)号：US20220378371A1

    公开(公告)日：2022-12-01

    申请号：US17884909

    申请日：2022-08-10

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Craig L. Schmidt

    IPC: A61B5/00 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06 ,  A61B5/0245

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

    PRESSURE SENSOR ASSEMBLY
    40.
    发明申请
    PRESSURE SENSOR ASSEMBLY 有权

    公开(公告)号：US20220244123A1

    公开(公告)日：2022-08-04

    申请号：US17571825

    申请日：2022-01-10

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Andrew J. Ries ,  Chetan Patel

    IPC: G01L9/00 ,  B23K26/20 ,  H01L23/522 ,  H05K5/06 ,  H01L23/00

    Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

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