公开(公告)号：US08002511B2

公开(公告)日：2011-08-23

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G49/07

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US07972468B2

公开(公告)日：2011-07-05

申请号：US11889615

申请日：2007-08-15

申请人： Yuji Kamikawa ,  Masahiro Noda

发明人： Yuji Kamikawa ,  Masahiro Noda

IPC分类号： H01L21/306 ,  C23C16/00

CPC分类号： H01L21/67775 ,  Y10S156/916 ,  Y10S414/135

摘要： A semiconductor device fabricating system 1 includes a casing 10, processing units 12, 13 and 14, for carrying out semiconductor device fabricating processes, disposed inside the casing, and platforms 15, 16 and 17 set outside the casing. The platforms are foldable. Spaces required by the platforms can be reduced and the footprint of the semiconductor device fabricating system can be reduced by folding the platforms.

摘要翻译： 半导体器件制造系统1包括壳体10，用于执行设置在壳体内的半导体器件制造工艺的处理单元12,13和14以及设置在壳体外部的平台15,16和17。 平台是可折叠的。 可以减少平台所需的空间，并且可以通过折叠平台来减少半导体装置制造系统的占地面积。

公开(公告)号：US20080041525A1

公开(公告)日：2008-02-21

申请号：US11889615

申请日：2007-08-15

申请人： Yuji Kamikawa ,  Masahiro Noda

发明人： Yuji Kamikawa ,  Masahiro Noda

IPC分类号： H01L21/306

CPC分类号： H01L21/67775 ,  Y10S156/916 ,  Y10S414/135

摘要： A semiconductor device fabricating system 1 includes a casing 10, processing units 12, 13 and 14, for carrying out semiconductor device fabricating processes, disposed inside the casing, and platforms 15, 16 and 17 set outside the casing. The platforms are foldable. Spaces required by the platforms can be reduced and the footprint of the semiconductor device fabricating system can be reduced by folding the platforms.

摘要翻译： 半导体器件制造系统1包括壳体10，用于执行设置在壳体内的半导体器件制造工艺的处理单元12,13和14以及设置在壳体外部的平台15,16和17。 平台是可折叠的。 可以减少平台所需的空间，并且可以通过折叠平台来减少半导体装置制造系统的占地面积。

公开(公告)号：US20050103364A1

公开(公告)日：2005-05-19

申请号：US10851335

申请日：2004-05-24

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： H01L21/304 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  B08B3/00

CPC分类号： H01L21/67781 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/67303 ,  H01L21/67313 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67754 ,  H01L21/67757 ,  Y10S134/902

摘要： A liquid processing apparatus has a substrate rotating device including a holder for holding a substrate and a motor, a chamber for applying the liquid processing to the substrate, a posture changing mechanism for changing the posture of the substrate rotating device at outside of the chamber such that a state of the substrate held by the holder changes between vertical and horizontal, and a position adjusting mechanism for relatively adjusting the positions of the chamber and the substrate rotating device together with the posture changing mechanism such that the holder is housed in the chamber. The substrate is taken out from the container and held by the holder in a horizontal state. After the posture of the holder was changed to vertical, a process liquid is supplied to the substrate of vertical state.

摘要翻译： 液体处理装置具有基板旋转装置，该基板旋转装置包括用于保持基板的保持器和马达，用于向基板施加液体处理的腔室，用于改变在室外的基板旋转装置的姿势的姿势改变机构， 由保持器保持的基板的状态在垂直和水平之间变化;以及位置调整机构，用于相应地调节室和基板旋转装置的位置以及姿势改变机构，使得保持器容纳在室中。 将基板从容器中取出并保持在水平状态。 在保持器的姿势变为垂直状态之后，将处理液体供给垂直状态的基板。

公开(公告)号：US20050051195A1

公开(公告)日：2005-03-10

申请号：US10901405

申请日：2004-07-29

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： H01L21/304 ,  H01L21/677 ,  B08B9/20

CPC分类号： H01L21/67778 ,  H01L21/67766 ,  H01L21/67781

摘要： A substrate processing system includes a substrate transfer unit having a plural-wafer conveyer that transfers plural wafers collectively and a single wafer conveyer that transfers a single wafer at a time. The single-wafer conveyer is accessible to the plural-wafer conveyer to deliver and remove a wafer to and from the plural-wafer conveyer.

摘要翻译： 基板处理系统包括具有多个晶片传送器的基板传送单元，该多个晶片传送器一体地传送多个晶片，以及一次传送单个晶片的单个晶片传送器。 单晶片输送机可接触多晶圆输送机，以将晶片输送到多晶圆输送机和从多晶圆输送机移出晶片。

公开(公告)号：US06792958B2

公开(公告)日：2004-09-21

申请号：US10024175

申请日：2001-12-21

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B1500

CPC分类号： H01L21/67017 ,  H01L21/67028 ,  Y10S134/902

摘要： There is provided a system in which transportation, assembly and maintenance can be easily carried out. The system comprises: a case carrying unit for carrying in/out a case accommodating therein the substrate; a liquid-processing unit and the processing liquid being supplied to process the substrate with the processing liquid; a substrate conveying unit for conveying the substrate between the case carrying unit and the liquid-processing unit; a processing liquid storing unit for storing, feeding and recovering the processing liquid which is supplied to the liquid-processing unit; and a plurality of frames each supporting one or more of the case carrying unit, the liquid-processing unit, the substrate conveying unit and the processing liquid storing unit, wherein the at least two of the plurality of frames are capable of being connected to and separated from each other.

摘要翻译： 提供了可以容易地进行运输，组装和维护的系统。 所述系统包括：盒体承载单元，用于将容纳在其中的基板的壳体进出; 液体处理单元和处理液被供应以用处理液处理基板; 基板输送单元，用于在所述壳体承载单元和所述液体处理单元之间输送所述基板; 处理液体存储单元，用于存储，供给和回收供给到所述液体处理单元的处理液体; 以及多个框架，每个框架支撑所述壳体承载单元，所述液体处理单元，所述基板输送单元和所述处理液体存储单元中的一个或多个的一个或多个，其中所述多个框架中的所述至少两个能够连接到 彼此分离。

公开(公告)号：US06746543B2

公开(公告)日：2004-06-08

申请号：US10013550

申请日：2001-12-13

申请人： Yuji Kamikawa ,  Satoshi Nakashima ,  Kinya Ueno

发明人： Yuji Kamikawa ,  Satoshi Nakashima ,  Kinya Ueno

IPC分类号： B08B300

CPC分类号： H01L21/67057 ,  B08B3/08 ,  H01L21/67051 ,  Y10S134/902

摘要： A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

摘要翻译： 提供一种用于清洁物体的清洁装置和清洁方法。 在清洁装置中，干燥室42和清洗槽41分别上下分离。 因此，干燥室42中的空间可以通过旋转门59a和滑动门72与清洁浴41的空间绝缘。在清洁方法中，清洁浴41中的清洁过程在通过 旋转门59a。 另一方面，干燥室42中的干燥过程在通过滑动门72密封和封闭的同时完成。因此，在干燥过程中不可能使化合物受到化学品的不良影响 治疗。

公开(公告)号：US06592678B1

公开(公告)日：2003-07-15

申请号：US09689408

申请日：2000-10-12

申请人： Yuji Kamikawa ,  Naoki Shindo ,  Shigenori Kitahara ,  Miyako Yamasaka

发明人： Yuji Kamikawa ,  Naoki Shindo ,  Shigenori Kitahara ,  Miyako Yamasaka

IPC分类号： B08B304

CPC分类号： H01L21/02052 ,  B08B3/08 ,  B24B37/013 ,  H01L21/67057 ,  H01L22/26 ,  Y10S134/902

摘要： A cleaning equipment generally comprises: a cleaning bath 30 for storing therein a cleaning solution to allow a semiconductor wafer W to be dipped in the cleaning solution to clean the surface of the wafer W; a cleaning solution supply pipe 33 for connecting the cleaning bath 30 to a pure water supply source 31; a chemical storing container 34 for storing therein a chemical; a chemical supply pipe 36 for connecting the cleaning solution supply pipe 33 to the chemical storing container 34 via an injection shut-off valve 35; and a diaphragm pump 37 for injecting a predetermined amount of chemical from the chemical storing container 34 into pure water flowing through the cleaning solution supply pipe 33. The temperature of the cleaning solution in the cleaning bath 30 is detected by, e.g., a temperature sensor 44. On the basis of a detection signal outputted from the temperature sensor 44, the amount of the chemical injected by the diaphragm pump 37 is controlled so that the concentration of the chemical is a predetermined concentration. Thus, a predetermined amount of chemical can be injected so as to clean the wafer W with a predetermined concentration of chemical.

摘要翻译： 清洁设备通常包括：清洗槽3​​0，用于在其中存储清洁溶液以允许将半导体晶片W浸入清洁溶液中以清洁晶片W的表面; 用于将清洗槽30连接到纯水供给源31的清洗液供给管33; 用于在其中存储化学品的化学品储存容器34; 用于经由注入截止阀35将清洗液供给管33与药剂收容容器34连接的化学品供给管36; 以及用于将预定量的化学品从化学物质储存容器34注入到通过清洁溶液供应管33的纯水的隔膜泵37.清洗槽30中的清洁溶液的温度例如由温度传感器 基于从温度传感器44输出的检测信号，控制由隔膜泵37喷射的化学物质的量，使得化学品的浓度为预定浓度。 因此，可以注入预定量的化学品以便以预定浓度的化学品清洁晶片W.

公开(公告)号：US06394110B2

公开(公告)日：2002-05-28

申请号：US09912964

申请日：2001-07-25

申请人： Yuji Kamikawa ,  Shigenori Kitahara ,  Kinya Ueno

发明人： Yuji Kamikawa ,  Shigenori Kitahara ,  Kinya Ueno

IPC分类号： B08B704

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： A substrate processing apparatus (1) for processing wafers (W) has a first processing chamber (2) capable of containing the wafers (W) and a second processing chamber (4) capable of containing the wafers (W). The second processing chamber (4) is formed below and near the first processing chamber (2) and is capable of communicating with the first processing chamber (2). A wafer guide (6) carries the wafers (W) vertically between the first and second processing chambers (2, 4). A shutter (7) is opened to allow the first and second processing chambers (2, 4) to communicate with each other and is closed to isolate the same from each other. A steam supply system (8) including steam supply port, an ozone gas supply system (9) including ozone gas supply port and an IPA supply system (10) including IPA supply port are combined with the first processing chamber (2). A pure water supply system (11) including pure water supply port and a draining unit (12) including a drain pipe-line (141) through which pure water is drained are combined with the second processing chamber (4).

摘要翻译： 用于处理晶片（W）的衬底处理设备（1）具有能够容纳晶片（W）的第一处理室（2）和能够容纳晶片（W）的第二处理室（4）。 第二处理室（4）形成在第一处理室（2）下方和附近，并且能够与第一处理室（2）连通。 晶片引导件（6）在第一和第二处理室（2,4）之间垂直地承载晶片（W）。 打开快门（7）以允许第一和第二处理室（2,4）彼此连通并且关闭以将它们彼此隔离。 包括蒸汽供应口的蒸汽供应系统（8），包括臭氧气体供应口的臭氧气体供应系统（9）和包括IPA供应口的IPA供应系统（10）与第一处理室（2）组合。 包括纯水供应口和排水单元（12）的纯水供应系统（11）和排水管（141），排水管（141）通过排水管排出第二处理室（4）。

公开(公告)号：US06375758B2

公开(公告)日：2002-04-23

申请号：US09097097

申请日：1998-06-12

申请人： Satoshi Nakashima ,  Yuji Kamikawa ,  Kazuyuki Honda

发明人： Satoshi Nakashima ,  Yuji Kamikawa ,  Kazuyuki Honda

IPC分类号： B08B300

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： A cleaning and drying apparatus includes a cleaning bath 22 for collecting cleaning liquid and also discharging the liquid, a drying chamber 23 arranged above the cleaning bath 22 and a wafer boat 24 for conveying semiconductor wafers W between the cleaning bath 22 and the drying chamber 23. Dry gas nozzles 37 for ejecting dry gas are provided in the drying chamber 23. A shutter 36 is arranged between the cleaning bath 22 and the drying chamber 23, for insulating the cleaning bath 22 from the drying chamber 23. A central processing unit 60 controls respective operations of the dry gas nozzles 37 and a driving unit 52 for the shutter 36. With the arrangement, after the wafers W have been cleaned in the cleaning bath 22, the cleaning liquid is discharged through a bottom of the bath 22, while the dry gas is supplied from the dry gas nozzles 37 to contact with surfaces of the wafers W and the cleaning liquid in a first drying process. Next, a second drying process is carried out due to condensation of the cleaning liquid on the wafers and the dry gas. In this way, the improvement in drying efficiency and the reduction of consumed dry gas can be accomplished.

摘要翻译： 清洗干燥装置包括清洗液22，用于收集清洗液并排出液体，设置在清洗槽22上方的干燥室23和用于在清洗槽22和干燥室23之间输送半导体晶片W的晶片舟24 用于喷射干燥气体的干燥气体喷嘴37设置在干燥室23中。在清洗槽22和干燥室23之间设置闸板36，以将清洗槽22与干燥室23隔离。中央处理单元60 控制干气喷嘴37的各个操作和用于闸板36的驱动单元52.通过这种布置，在清洗槽22中清洁晶片W之后，清洗液通过槽22的底部排出，同时 在干燥气体喷嘴37中，干燥气体在第一干燥过程中与晶片W和清洗液体的表面接触。 接下来，由于清洁液体在晶片和干燥气体上的冷凝而进行第二干燥处理。 这样可以实现干燥效率的提高和干燥气体的消耗减少。