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公开(公告)号：US10264674B2
公开(公告)日：2019-04-16
申请号：US16133736
申请日：2018-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito Yonemori , Hirokazu Yazaki
Abstract: A passive element array includes an element body that includes laminated base material layers, passive elements at different positions in the element body when viewed from a lamination direction of the base material layers, input/output terminals at a first main surface of the element body and connected to one end of each of the passive elements, input/output terminals at a second main surface of the element body and connected to the other end of each of the passive elements, a first ground terminal between the first input/output terminal and the input/output terminal at the first main surface, and a second ground terminal between the input/output terminal and the input/output terminal at the second main surface.
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32.发明申请公开(公告)号：US20180226935A1
公开(公告)日：2018-08-09
申请号：US15944938
申请日：2018-04-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Toshiyuki Nakaiso
IPC: H03H1/00 , H01G4/40 , H01F27/28 , H01G4/33 , H01G4/12 , H01G4/228 , H01G4/224 , H03H7/01 , H01F27/29 , H01F27/40
CPC classification number: H03H1/00 , H01F17/0013 , H01F27/2804 , H01F27/292 , H01F27/40 , H01F2017/0026 , H01G4/1227 , H01G4/224 , H01G4/228 , H01G4/33 , H01G4/40 , H01L23/49822 , H01L27/016 , H01L28/10 , H01L28/40 , H03H7/0115 , H03H2001/0057 , H03H2001/0085 , H05K1/111 , H05K1/181 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006
Abstract: An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.
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公开(公告)号：US12136011B2
公开(公告)日：2024-11-05
申请号：US18193774
申请日：2023-03-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ryohei Omori , Noboru Kato , Hirokazu Yazaki , Mikiko Saito
IPC: G06K19/077 , G06K19/07
Abstract: A container including an RFID module is provided that includes a base, a metal film, and a slit. The base has an insulating property. The metal film is on a first main surface of the base. The slit separates the metal film into a first metal region and a second metal region. The RFID module includes an RFIC element, a filter circuit configured to transmit a current due to an electromagnetic wave at a natural resonance frequency being a communication frequency to the RFIC element, and first and second electrodes to be connected to the filter circuit. The first electrode of the RFID module and the first metal region of the metal film are electrically connected to each other. The second electrode of the RFID module and the second metal region of the metal film are electrically connected to each other.
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公开(公告)号：US12026571B2
公开(公告)日：2024-07-02
申请号：US17660078
申请日：2022-04-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
IPC: G06K19/077 , G06K19/07 , H01Q1/22
CPC classification number: G06K19/07745 , G06K19/0702 , H01Q1/2283
Abstract: An RFIC module is provided that includes a substrate, an RFIC mounted on the substrate and performing passive communication, and an impedance matching circuit formed on the substrate and performing impedance matching between the RFIC and an antenna. Further, the RFIC module includes a chip capacitor as an imparting circuit other than the RFIC on the substrate.
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公开(公告)号：US11699057B2
公开(公告)日：2023-07-11
申请号：US17083713
申请日：2020-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Noriyuki Ueki
CPC classification number: G06K19/0723 , H01Q1/2283 , H01Q7/00
Abstract: An RFID tag is provided that has reduced size while a decrease in communication distance is prevented. The RFID tag includes an inductor element having a coiled antenna built in a substrate and an RFIC element mounted on a mounting surface of the substrate and electrically connected to the coiled antenna. The coiled antenna is disposed such that a winding axis becomes parallel to or inclined with respect to the mounting surface of the substrate. The area of the RFIC element viewed in a direction orthogonal to the mounting surface of the substrate is larger than opening area of the coiled antenna viewed in winding axis direction of the coiled antenna. The RFIC element is disposed without overlapping at least a portion of opening region of the coiled antenna when viewed in winding axis direction of the coiled antenna.
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Patent Agency Ranking
公开(公告)号：US11640860B2
公开(公告)日：2023-05-02
申请号：US17881703
申请日：2022-08-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito Yonemori , Hirokazu Yazaki , Takanori Tsuchiya
IPC: H01B7/08 , H01L23/495 , H05K1/02 , H01R12/52 , H01R12/57 , H01R12/62 , H05K1/14 , H05K1/18 , H05K3/36
Abstract: A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.
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公开(公告)号：US11450451B2
公开(公告)日：2022-09-20
申请号：US16513839
申请日：2019-07-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito Yonemori , Hirokazu Yazaki , Takanori Tsuchiya
IPC: H01B7/08 , H01L23/495 , H05K1/02
Abstract: A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.
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公开(公告)号：US11165341B2
公开(公告)日：2021-11-02
申请号：US16446695
申请日：2019-06-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Takanori Tsuchiya
IPC: H02M1/44 , H01F27/40 , H01G4/40 , H02M3/155 , H02M3/04 , H01L23/64 , H01G4/38 , H01F17/00 , H01L23/66
Abstract: A noise reduction circuit is connected between at least one line of an input line and an output line of a DC-DC converter, a ground, and a ground terminal of a switching control IC included in the DC-DC converter. The noise reduction circuit includes a first capacitor connected between the at least one line and the ground terminal, a second capacitor connected between the at least one line and the ground, and an inductor connected between the ground terminal and the ground.
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公开(公告)号：US10970610B2
公开(公告)日：2021-04-06
申请号：US17021376
申请日：2020-09-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noriyuki Ueki , Hirokazu Yazaki , Yoshihiro Aoyama
Abstract: In an impedance matching circuit, first to fourth inductors are formed by a conductor pattern of a coil shape, and a fifth inductor is formed by a conductor pattern of an unwound shape. The first inductor and the third inductor are respectively formed in different layers of a substrate and are arranged in such a relationship as to have coil openings overlapping each other. Moreover, the second inductor and the fourth inductor are respectively formed in different layers of the substrate and are arranged in such a relationship as to have coil openings overlapping each other. Two coils interposing the mounting position of the RFIC are in a 180° rotational symmetry relationship.
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公开(公告)号：US20210081739A1
公开(公告)日：2021-03-18
申请号：US17109241
申请日：2020-12-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Noriyuki Ueki , Noboru Kato
IPC: G06K19/077 , H01Q7/00 , H01Q1/38
Abstract: An article is provided with a wireless communication device that is constructed to be attached to the article without using an adhesive. The article with the wireless communication device includes a wireless IC chip, a power feeding circuit board including a terminal electrode to which the wireless IC chip is connected, an article, and a conductive thread for attaching the power feeding circuit board to the article. The conductive thread contacts the terminal electrode and functions as a radiator while the power feeding circuit board is attached to the article.
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