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公开(公告)号：US10333194B2
公开(公告)日：2019-06-25
申请号：US15464399
申请日：2017-03-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsumi Taniguchi , Kuniaki Yosui
Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.
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公开(公告)号：US10269469B2
公开(公告)日：2019-04-23
申请号：US15465633
申请日：2017-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Shingo Ito , Shuichi Kezuka , Takahiro Baba
Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
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公开(公告)号：US10237978B2
公开(公告)日：2019-03-19
申请号：US14856895
申请日：2015-09-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component (12) in a resin multilayer substrate (11) formed by laminating and pressing thermoplastic resin sheets (111a to 111d) so as to crimp them to each other. With the fabricating method according to the present disclosure, a metal pattern (13) is provided on a component mounting surface of the thermoplastic resin sheet (111a). Further, the component (12) is inserted in the area sandwiched by the metal pattern (13). Out of widths relating to the area sandwiched by the metal pattern (13), the width in the component mounting surface side is assumed to be a width W2, and the width in the component-insertion side is assumed to be a width W3, the width W2 being equal to or larger than a width W1 of the component but less than the width W3.
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公开(公告)号：US10157705B2
公开(公告)日：2018-12-18
申请号：US15200797
申请日：2016-07-01
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Hiromu Fukushima , Masaki Kitajima , Kuniaki Yosui
Abstract: The electric circuit includes a first inductor and a third inductor that, when viewed in plan view from a first direction, wind around a first axis extending in the first direction, and a second inductor that, when viewed in plan view from the first direction, winds around a second axis extending in the first direction. A second region where the second inductor is provided overlaps, in the first direction, with a first region where the first inductor is provided or a third region where the third inductor is provided. When a common mode signal is inputted to the first inductor to third inductor, the orientation of a magnetic field produced in the first axis by the first inductor and the third inductor is opposite from the orientation of a magnetic field produced in the second axis by the second inductor.
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公开(公告)号：US10104766B2
公开(公告)日：2018-10-16
申请号：US15652282
申请日：2017-07-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
IPC: H05K7/10 , H05K7/12 , H05K1/02 , H05K1/03 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/30 , H05K3/40 , H05K3/46 , H05K3/02
Abstract: A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1 ≥L2).
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Patent Agency Ranking
36.发明授权公开(公告)号：US10103092B2
公开(公告)日：2018-10-16
申请号：US15673451
申请日：2017-08-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Keisuke Ikeno , Yuki Ito
Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
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公开(公告)号：US10091886B2
公开(公告)日：2018-10-02
申请号：US15298366
申请日：2016-10-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke Nishino , Kuniaki Yosui
IPC: H05K1/18 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/46 , H03H7/01 , H03H1/00
Abstract: In an LC composite component, a chip capacitor is built in a multilayer substrate including base material layers made of a thermoplastic resin. The number of the base material layers in a portion overlapping the component as seen from a lamination direction is equal to the number of the base material layers in a portion around the component as seen from the lamination direction. Wiring patterns that adjust the thickness of the multilayer substrate are provided around the chip capacitor as seen from the lamination direction, and on principal surfaces of the base material layers, so as to surround the chip capacitor.
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公开(公告)号：US09960471B2
公开(公告)日：2018-05-01
申请号：US15361604
申请日：2016-11-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro Baba , Satoshi Sasaki , Kuniaki Yosui
Abstract: In a transmission line, first and second signal conductors are located inside a dielectric base body. The first and second signal conductors are located between first and second ground conductors in a thickness direction of the dielectric base body. A main conductor portion of the second ground conductor is located between the first and second signal conductors in a width direction of the dielectric base body. First and second auxiliary conductor portions of the second ground conductor respectively extend from the main conductor portion to first-signal-conductor-side and second-signal-conductor-side lateral surfaces of the dielectric base body. A first lateral-surface conductor connects the first auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor. A second lateral-surface conductor connects the second auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor.
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公开(公告)号：US09935601B2
公开(公告)日：2018-04-03
申请号：US14844440
申请日：2015-09-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Wataru Tamura , Kuniaki Yosui , Jun Sasaki , Noboru Kato
CPC classification number: H03H7/0161 , H01F17/0013 , H01F38/14 , H01F2017/0026 , H01F2038/146 , H03H5/12 , H03H7/0115 , H03H7/1766 , H03H2001/0085 , H03H2007/013
Abstract: An LC parallel resonant element includes a first planar or substantially planar conductor on a first base material layer and second and third planar or substantially planar conductors on second and third base material layers. The first and third planar or substantially planar conductors extend over nearly the entire surfaces of the first and third base material layers. The second planar or substantially planar conductor extends over nearly the entire length of the second base material layer in a second direction such that a space from the other end portion of two end portions of a multilayer body in a first direction is provided. The first and third planar or substantially planar conductors are connected to each other by interlayer conductors near the other end portion of the multilayer body. The first and second planar or substantially planar conductor are connected to each other by interlayer conductors near one end portion of the multilayer body.
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公开(公告)号：US09934905B2
公开(公告)日：2018-04-03
申请号：US14873282
申请日：2015-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke Nishino , Kuniaki Yosui
CPC classification number: H01F41/041 , H01F7/06 , H01F17/0013 , H01F41/0233 , H01F41/042 , H01F2007/068 , H01F2017/0073 , H05K1/165 , H05K3/4617 , H05K3/4632 , H05K2201/0129
Abstract: In a linear conductor forming step, a wide portion having a relatively large line width and a narrow portion having a relatively small line width are formed in each of a plurality of linear conductors. In addition, in a multilayer board, in base material layers adjacent to each other in a stacking direction, the wide portion overlaps the narrow portion on the adjacent base material layer, and end portions of the wide portions at both sides of the narrow portion in a line width direction, in a planar view. The wide portions are disposed such that the end portions thereof overlap each other in the stacking direction and resistance of a fluid thermoplastic resin increases. The narrow portion is located between the wide portions in the stacking direction.
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