MODIFIED MALEIMIDE RESIN
    31.
    发明公开

    公开(公告)号:US20240174810A1

    公开(公告)日:2024-05-30

    申请号:US18072630

    申请日:2022-11-30

    CPC classification number: C08G73/1067

    Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.

    RESIN COMPOSITION
    32.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240166866A1

    公开(公告)日:2024-05-23

    申请号:US18182399

    申请日:2023-03-13

    CPC classification number: C08L71/00 C08L2201/08

    Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.

    MODIFIED DICYCLOPENTADIENE-BASED RESIN
    40.
    发明公开

    公开(公告)号:US20240166788A1

    公开(公告)日:2024-05-23

    申请号:US18178547

    申请日:2023-03-06

    CPC classification number: C08F232/08

    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.

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