摘要:
An exposure method includes an exposure step and a measurement step. The exposure step transfers a circuit pattern of a mask onto a photosensitive substrate via an optical system. The mask includes a circuit pattern and an inspection pattern to be used for a measurement of a line width of the pattern transferred to the substrate. The measurement step measures, prior to the exposure step, using the inspection pattern which is formed on the mask to be used in the exposure step, a line width of the pattern to be transferred to the substrate.
摘要:
A method for forming a critical dimension test mark, and the use of the mark to characterize and monitor imaging performance is provided. Methods in accordance with the present invention encompass an exposure of an essentially standard critical dimension bar at each of two overlapping orientations that are rotated about an axis with respect to each other. The overlapped portion forming a critical dimension test mark that is useful for enabling low cost, rapid determination of sub-micron critical dimensions for characterizing exposure tool imaging performance and in-process performance monitoring using optical measurement systems.
摘要:
A local air duct directs a temperature-controlled stream of air across two perpendicular sets of interferometer beams which are used to measure the two dimension (X-Y) position of a precision stage in e.g. an optical lithography stepper or step and scan system, or in any other precision coordinate measuring machine. By thereby providing an additional single air flow which is azimuthally directed across both the X and Y direction interferometer beams, the precision of the interferometric measurement is maximized. In addition, a second flow of air is directed downwards from the local air duct, thus providing sufficient air circulation onto the stage when the stage is directly beneath the local duct, even though in that location the stage is otherwise blocked from receiving the main air flow through the chamber.
摘要:
Improvements in a focusing apparatus having an objective optical system for optically manufacturing a workpiece, forming a desired pattern on a surface of a workpiece or inspecting a pattern on a workpiece and used to adjust the state of focusing between the surface of the workpiece and the objective optical system. The focusing apparatus has a first detection system having a detection area at a first position located outside the field of the objective optical system, a second detection system having a detection area at a second position located outside the field of the objective optical system and spaced apart from the first position, and a third detection system having a detection area at a third position located outside the field of the objective optical system and spaced apart from each of the first and second positions. A calculator calculates a deviation between a first focus position and a target focus position and temporarily stores a second focus position at the time of detection made by the first detection system. A controller controls focusing on the surface of the workpiece on the basis of the calculated deviation, the stored second focus position and a third focus position when the area on the workpiece corresponding to the detection area of the first detection system is positioned in the field of the objective optical system by relative movement of the workpiece and the objective optical system.
摘要:
A method of detecting particles on a wafer support surface comprising positioning a wafer in a first position on the surface with the wafer in the first position, generating a first pattern on the wafer, and moving the wafer. Then, after moving the wafer, generating a second pattern on the wafer to generate a moire pattern by the interaction of the second pattern with the first pattern. The moire pattern is inspected to identify any visual distortion in the moire pattern due to physical distortion of the wafer caused by a particle on the support surface during the generation of the first pattern. The patterns may be ruled parallel lines, and the second pattern may be moved during inspection to shift the moire pattern to reveal distortions over a wide area.
摘要翻译:一种检测晶片支撑表面上的颗粒的方法,包括将晶片定位在表面上的第一位置,晶片处于第一位置,在晶片上产生第一图案并移动晶片。 然后,在移动晶片之后,通过第二图案与第一图案的相互作用在晶片上产生第二图案以产生莫尔+ E,acu + EE图案。 在产生第一图案期间,由于由支撑表面上的颗粒引起的晶片的物理失真,检查莫尔+ E,acu e + EE图案以识别moir + E,acu e + EE图案中的任何视觉失真 。 图案可以是划线的平行线,并且可以在检查期间移动第二图案以使莫尔+ E,acu e + EE图案移动以显示在广泛区域上的扭曲。
摘要:
The present invention provides a projection exposure apparatus comprising: a reticle stage; an illumination optical system for illuminating a reticle on the reticle stage; a stage on which a substrate is supported; and a projection optical system having a predetermined numerical aperture to project a pattern formed on the reticle and illuminated by the illumination optical system onto the substrate, and in which a longitudinal spherial aberration thereof regarding the focusing of the pattern formed on the reticle onto the substrate are excessively corrected.
摘要:
A method of detecting a registration diversion between a mask and a wafer prior to a main exposure. This method detects relative diversions between marks on the wafer and latent images of marks on the mask formed on a photosensitive layer of the wafer. The latent images of the marks on the mask are preliminarily formed on the photosensitive layer of the wafer by an exposure energy beam prior to the main exposure.
摘要:
An exposure method for photolithography comprises the steps of forming a pattern on a substrate by the use of a first exposure apparatus including a first imaging optical system having a reduction magnification 1/.beta.1 and an image circle of a diameter .phi.1, and forming a second pattern on the substrate on which the first pattern has been formed, by the use of a second exposure apparatus including a second imaging optical system having a reduction magnification 1/.beta.2 different from the reduction magnification 1/.beta.1 and an image circle of a diameter .phi.2, wherein when N is an integer, the conditions that .beta.1.times..phi.1=.beta.2.times..phi.2 and .phi.1=N.times..phi.2 are satisfied.
摘要翻译:用于光刻的曝光方法包括以下步骤:通过使用包括具有缩小倍率1 /β1的第一成像光学系统和直径φ1的图像圆的第一曝光装置在基板上形成图案,并且形成 通过使用包括具有不同于缩小倍率1 /β1的缩小倍率1 /β2的第二成像光学系统的第二曝光装置和形成第一图案的图像圆的第二图案, 直径phi 2,其中当N是整数时,满足β1 phi 1 =β2 ph 2和ph 1 = N x ph 2的条件。
摘要:
A photomask includes a pattern region including a predetermined original image pattern, a pair of mark regions which respectively include alignment marks located on a line crossing the pattern region and which are located at two sides of the pattern region, and a pair of light-shielding regions each of which has at least the same width as that of a corresponding one of the mark regions along a direction parallel to the line.An exposure apparatus for sequentially exposing a plurality of regions on a photosensitive substrate by using a projection image on the photomask includes means for moving the photosensitive substrate and the photomask relative to each other such that images of marks for a current projection image are projected on a portion of a nonexposed region of a previous projection image, the portion being located next to a previous mark latent image and the nonexposed region being located between the latent image of the previous original image pattern and the latent image of the previous mark.
摘要:
An alignment device in an IC projection exposure apparatus includes a projection lens system for viewing to a wafer surface having a reference mark comprising a periodic pattern structure having a predetermined period in one direction and a mask surface having a reference mark to be position-adjusted with respect to the reference mark of the wafer, the projection lens system being capable of forming an image of an observation light source on the wafer surface through the mask surface, and an observation optical system for detecting the reflected light from the wafer surface passed through the projection lens system. The device further includes means for selecting a particular component of the diffracted light from the wafer surface formed by the pattern of the reference mark on the wafer, and for directing the particular component to the observation optical system. Said means includes a light-intercepting member provided near the pupil of the observation optical system and formed with a light-transmitting opening extending in a band-like form in a direction orthogonal to the direction of the period of the reference mark on the wafer surface.