公开(公告)号：US20200185576A1

公开(公告)日：2020-06-11

申请号：US16315020

申请日：2017-06-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ivar Tangring

IPC: H01L33/50 ,  H01L33/60

Abstract: A method of producing an optoelectronic lighting device includes forming a volume emitter such that it is at least partly transmissive to generated electromagnetic radiation, forming a concavely formed, optically transparent frame element including a curable, flowable material including phosphor particles at a side region of the volume emitter, wherein forming a conversion layer that converts the electromagnetic radiation into a second wavelength range is carried out by a sedimentation process of phosphor particles, and the conversion layer is formed within an optically transparent frame element in a manner adjoining an optically active region, forming a reflection element on the optically transparent frame element, and forming a conversion element that converts the electromagnetic radiation into a second wavelength range, wherein the conversion element is formed in a manner overlapping at least a second surface of the volume emitter and frame element.

公开(公告)号：US20190113181A1

公开(公告)日：2019-04-18

申请号：US16087949

申请日：2017-03-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schlereth ,  Elena Rachkova ,  Michael Bestele ,  Ivar Tangring

IPC: F21K9/232 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/54 ,  F21K9/275

CPC classification number: F21K9/232 ,  F21K9/275 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.