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公开(公告)号:US20250067667A1
公开(公告)日:2025-02-27
申请号:US18948569
申请日:2024-11-15
Applicant: PixArt Imaging Inc.
Inventor: CHENG-NAN TSAI , Yen-Chang Chu , Chih-Ming Sun , Chi-Chih Shen , Kuo-Hsiung Li
IPC: G01N21/47 , G01N21/53 , G01N33/00 , G08B17/107
Abstract: There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.
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公开(公告)号:US12158375B2
公开(公告)日:2024-12-03
申请号:US18143565
申请日:2023-05-04
Applicant: PIXART IMAGING INC.
Inventor: Ming-Han Tsai , Chih-Ming Sun , Jian-Cheng Liao
IPC: G01J5/04 , G01J5/00 , G01J5/05 , G01J5/0802 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号:US20240159642A1
公开(公告)日:2024-05-16
申请号:US18422024
申请日:2024-01-25
Applicant: PixArt Imaging Inc.
Inventor: Yen-Chang Chu , Cheng-Nan Tsai , Chih-Ming Sun , Zhi-Hao Wu , Hung-Yu Lai
IPC: G01N15/075 , G01N33/00
CPC classification number: G01N15/075 , G01N33/0027
Abstract: A smoke detector with an anti-insect function includes a substrate, an optical detection module, a top cover, a base and a perforated plate. The substrate has a ring shape region surrounding a central detection region, and a first block structure of the central detection region is protruded from the substrate and higher than an upper surface of the ring shape region. The optical detection module is disposed inside the central detection region. The top cover has a lateral wall. The base is disposed on the substrate and connected to the top cover to cover the optical detection module. The base has a second block structure partly overlapped with the lateral wall to form a guiding channel. The perforated plate is disposed between the lateral wall and the second block structure to prevent an insect from moving into the top cover through the guiding channel.
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公开(公告)号:US11854361B2
公开(公告)日:2023-12-26
申请号:US18111605
申请日:2023-02-20
Applicant: PixArt Imaging Inc.
Inventor: Cheng-Nan Tsai , Guo-Zhen Wang , Ching-Kun Chen , Yen-Chang Chu , Chih-Ming Sun
IPC: G08B17/10 , G08B17/107
CPC classification number: G08B17/107
Abstract: There is provided a smoke detector including a light source, a reflective surface, a light sensor and a processor. The light sensor receives reflected light when the light source emits light toward the reflective surface, and generates a reference detection signal when there is no smoke. The processor receives the detection signal from the light sensor, and automatically selects a set of predetermined condition thresholds according to a profile of the detection signal to be compared with the detection signal thereby determining whether to generate an alarm according to the comparison result.
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公开(公告)号:US11754293B2
公开(公告)日:2023-09-12
申请号:US17584755
申请日:2022-01-26
Applicant: PixArt Imaging Inc.
Inventor: Chih-Ming Sun , Ming-Han Tsai , Chiung-Wen Lin , Po-Wei Yu , Wei-Ming Wang , Sen-Huang Huang
CPC classification number: F24C15/2042 , A61F13/42 , B66B5/0012 , G01J5/0025 , G01J5/10 , A61F2013/421 , G01J2005/0077 , G01J2005/106
Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
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公开(公告)号:US11733109B2
公开(公告)日:2023-08-22
申请号:US17130103
申请日:2020-12-22
Applicant: PixArt Imaging Inc.
Inventor: Chih-Ming Sun
CPC classification number: G01L1/144 , H05K1/0393 , H05K1/118 , H05K2201/10151
Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed.
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公开(公告)号:US11719579B2
公开(公告)日:2023-08-08
申请号:US17578691
申请日:2022-01-19
Applicant: PIXART IMAGING INC.
Inventor: Chih-Ming Sun , Ming-Han Tsai , Cheng-Nan Tsai
CPC classification number: G01J5/0265 , B81B7/0064 , B81B7/0067 , G01J5/041 , G01J5/045 , G01J5/06 , H04N5/33 , H04N23/57 , B81B2201/0278
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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公开(公告)号:US11465901B2
公开(公告)日:2022-10-11
申请号:US17091062
申请日:2020-11-06
Applicant: PixArt Imaging Inc.
Inventor: Chih-Ming Sun , Ming-Han Tsai , Yu-Tao Lee
IPC: B81B3/00 , H01L27/146 , H01L23/00 , B81C1/00
Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
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公开(公告)号:US20210290085A1
公开(公告)日:2021-09-23
申请号:US16822024
申请日:2020-03-18
Applicant: PixArt Imaging Inc.
Inventor: Shih-Jen Lu , Yang-Ming Chou , Chien-Yi Kao , Hsin-Yi Lin , Chih-Ming Sun , Chung-Yuo Wu
IPC: A61B5/0295 , A61B5/026 , A61B5/021 , A61B5/00 , A61B5/0205
Abstract: An optical medical detection device includes a first physiological sensor and a processor. The first physiological sensor is adapted to continuously output a first photoplethysmography (PPG) signal generated by a first skin area of an object, and further to optionally and continuously output a second photoplethysmography (PPG) signal generated by a second skin area of the object. The second skin area is different from the first skin area. The processor is electrically connected to the first physiological sensor. The processor is adapted to convert the first PPG signal and the second PPG signal into a physiological feature, and the physiological feature is at least one of a blood pressure ratio and a blood flow velocity.
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公开(公告)号:US10168220B2
公开(公告)日:2019-01-01
申请号:US15172983
申请日:2016-06-03
Applicant: PIXART IMAGING INC.
Inventor: Chih-Ming Sun , Ming-Han Tsai , Cheng-Nan Tsai
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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