Semiconductor memory device and method of manufacturing the same

    公开(公告)号:US10312243B2

    公开(公告)日:2019-06-04

    申请号:US15920628

    申请日:2018-03-14

    Abstract: A semiconductor memory device includes a separation member defining active regions of a substrate. Gate lines intersect the active regions and are each buried in a trench formed in the substrate. Each of the gate lines includes a lower electrode structure and an upper electrode structure on the lower electrode structure. The upper electrode structure includes a source layer substantially covering a sidewall of the trench and including a work-function adjustment element. A conductive layer is on the source layer. A work-function adjustment layer is disposed between the source layer and the conductive layer. The work-function adjustment layer includes a material different from that of the source layer and is doped with the work-function adjustment element.

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190115351A1

    公开(公告)日:2019-04-18

    申请号:US15966554

    申请日:2018-04-30

    Abstract: Disclosed are a semiconductor memory device and a method of manufacturing the same. The semiconductor memory device includes a device isolation layer defining active regions of a substrate, and gate lines buried in the substrate and extending across the active regions. Each of the gate lines includes a conductive layer, a liner layer disposed between and separating the conductive layer and the substrate, and a first work function adjusting layer disposed on the conductive layer and the liner layer. The first work function adjusting layer includes a first work function adjusting material. A work function of the first work function adjusting layer is less than those of the conductive layer and the liner layer.

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