公开(公告)号：US11096215B2

公开(公告)日：2021-08-17

申请号：US15756678

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongho Lee ,  Seungjoo Maeng ,  Youngsung Kho ,  Hanseok Kim ,  Kyuho Han

IPC: H04W74/08 ,  H04W28/26 ,  H04W74/00 ,  H04W72/04 ,  H04W16/14

Abstract: The present disclosure provides methods and apparatuses for transmitting data, by a base station, in an unlicensed frequency. A method according to a representative embodiment includes: transmitting a first signal for determining whether a data transmission is possible in an unlicensed frequency band; transmitting a second signal for reserving a data transmission in the unlicensed frequency band when the data transmission in the unlicensed frequency band is possible; and transmitting first data to a terminal through the unlicensed frequency band after transmitting the second signal. In an aspect, the base station determines whether other communication devices do not use the unlicensed frequency band, and transmits a channel reservation signal having a period shorter than a resource allocation period during a predetermined period of time, thereby pursuing coexistence with other communication devices and improving the performance of a communication system at the same time.

公开(公告)号：US11962675B2

公开(公告)日：2024-04-16

申请号：US18299972

申请日：2023-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younho Jeon ,  Hyeokjun Choe ,  Jeongho Lee

IPC: H04L69/22 ,  H04L69/04 ,  H04L69/08

CPC classification number: H04L69/22 ,  H04L69/04 ,  H04L69/08

Abstract: An interface circuit includes: a packet transmitter configured to generate a plurality of transmission packets based on a request, which is output from a core circuit, and output the plurality of transmission packets, the plurality of transmission packets including information indicative of being a packet to be merged; and a packet receiver configured to generate a merged packet by merging a plurality of extension packets from among a plurality of reception packets received from outside the interface circuit, the plurality of extension packets including information indicative of being a packet to be merged.

公开(公告)号：US11901301B2

公开(公告)日：2024-02-13

申请号：US17306555

申请日：2021-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho Lee ,  Doohwan Lee

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2221/68372 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161

Abstract: A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.

公开(公告)号：US11741034B2

公开(公告)日：2023-08-29

申请号：US17368981

申请日：2021-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heehyun Nam ,  Jeongho Lee ,  Wonseb Jeong ,  Ipoom Jeong ,  Hyeokjun Choe

IPC: G06F13/28 ,  G06F3/06

CPC classification number: G06F13/28 ,  G06F3/0604 ,  G06F3/0655 ,  G06F3/0679 ,  G06F2213/28

Abstract: A memory device is configured to communicate with a plurality of host devices, through an interconnect, and includes a memory including a plurality of memory regions that includes a first memory region that is assigned to a first host device and a second memory region that is assigned to a second host device. The memory device further includes a direct memory access (DMA) engine configured to, based on a request from the first host device, the request including a copy command to copy data that is stored in the first memory region to the second memory region, read the stored data from the first memory region, and write the read data to the second memory region without outputting the read data to the interconnect.

公开(公告)号：US11586543B2

公开(公告)日：2023-02-21

申请号：US17380805

申请日：2021-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho Lee ,  Heehyun Nam ,  Jaeho Shin ,  Hyodeok Shin ,  Younggeon Yoo ,  Younho Jeon ,  Wonseb Jeong ,  Ipoom Jeong ,  Hyeokjun Choe

IPC: G06F12/00 ,  G06F12/0817 ,  G06F3/06 ,  G06F12/0862

Abstract: A device connected to a host processor via a bus includes: an accelerator circuit configured to operate based on a message received from the host processor; and a controller configured to control an access to a memory connected to the device, wherein the controller is further configured to, in response to a read request received from the accelerator circuit, provide a first message requesting resolution of coherence to the host processor and prefetch first data from the memory.

公开(公告)号：US11444653B2

公开(公告)日：2022-09-13

申请号：US17119504

申请日：2020-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho Lee ,  Byungjoon Park ,  Sangho Lee

IPC: H04B1/40 ,  H04B7/06

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transceiver in a wireless communication system may include: a first circuit configured to up-convert a first digital signal corresponding to a first band and to up-convert a second digital signal corresponding to a second band using a same intermediate frequency (IF) frequency, and to analog-convert the up-converted signals into a first analog signal and a second analog signal; a second circuit configured to up-convert the first analog signal and the second analog signal to produce a first radio frequency (RF) signal of the first band and a second RF signal of the second band, and to output an RF signal of a third bandwidth including the first RF signal and the second RF signal; and a third circuit configured to separate the RF signal of the third bandwidth into the first RF signal and the second RF signal, to adjust a phase of the first RF signal to perform beamforming in the first band, and to adjust a phase of the second RF signal to perform beamforming in the second band.

公开(公告)号：US11417613B2

公开(公告)日：2022-08-16

申请号：US17016123

申请日：2020-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jingu Kim ,  Shanghoon Seo ,  Sangkyu Lee ,  Jeongho Lee

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L23/31

Abstract: A semiconductor package includes: a frame substrate having a plurality of wiring layers and a cavity; an adhesive member disposed at the bottom of the cavity; a semiconductor chip disposed in the cavity, with a connection pad on an upper surface and the lower surface in contact with the adhesive member; a first conductive bump disposed on the connection pad; a second conductive bump disposed on the uppermost of the plurality of wiring layers; an insulating post disposed in the cavity and whose lower surface contacts the adhesive member; an encapsulant filling the cavity and covering side surfaces of the first and second conductive bumps and the insulating post’ and a redistribution structure disposed on the encapsulant, including a redistribution layer electrically connected to the first and second conductive bumps, wherein the insulating post includes a material having a greater hardness than that of the first and second conductive bumps.

公开(公告)号：US11342274B2

公开(公告)日：2022-05-24

申请号：US16990717

申请日：2020-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyu Lee ,  Jingu Kim ,  Kyungdon Mun ,  Shanghoon Seo ,  Jeongho Lee

IPC: H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/10

Abstract: A semiconductor package is disclosed. The semiconductor package includes a back-side wiring substrate and a front-side redistribution layer which are in parallel, and a connector, a semiconductor chip and an encapsulator which are between the back-side wiring substrate and the front-side redistribution layer. The encapsulator surrounds surfaces of the connector and the semiconductor chip. The back-side wiring substrate includes a core layer, a back-side via plug extending through the core layer, and a back-side redistribution layer on the back-side via plug.

公开(公告)号：US10897280B2

公开(公告)日：2021-01-19

申请号：US16725243

申请日：2019-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongho Lee ,  Yunsung Cho ,  Daehyun Kang ,  Byungjoon Park ,  Hyunchul Park ,  Juho Son

IPC: H03F3/68 ,  H04W88/08 ,  H04B1/38 ,  H01L23/66 ,  H01Q1/24 ,  H01Q3/26 ,  H01Q23/00 ,  H03F3/21 ,  H01Q21/06

Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The electronic device includes a first antenna module including a first amplifier configured to amplify a signal received from a communication circuit, a second antenna module including a second amplifier configured to amplify a signal received from the communication circuit, and an impedance matching circuit disposed between an output terminal of the first amplifier and an output terminal of the second amplifier.

公开(公告)号：US20200161248A1

公开(公告)日：2020-05-21

申请号：US16590960

申请日：2019-10-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangkyu Lee ,  Shanghoon Seo ,  Jeongho Lee

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

Abstract: A package module includes a core structure including a frame having a penetrating portion, an electronic component disposed in the penetrating portion, and an insulating material covering at least a portion of each of the frame and the electronic component and filling at least a portion of the penetrating portion. The core structure further has a recessed portion in which a stopper layer is disposed on a bottom surface of the recessed portion. A semiconductor chip has a connection pad and is disposed in the recessed portion such that an inactive surface faces the stopper layer. An encapsulant covers at least a portion of each of the core structure and the semiconductor chip, and fills at least a portion of the recessed portion. An interconnect structure is disposed on the core structure and an active surface of the semiconductor chip, and includes a redistribution layer.