Semiconductor device
    34.
    发明授权

    公开(公告)号:US11588054B2

    公开(公告)日:2023-02-21

    申请号:US17240616

    申请日:2021-04-26

    Abstract: A semiconductor device includes first active patterns on a PMOSFET section of a logic cell region of a substrate, second active patterns on an NMOSFET section of the logic cell region, third active patterns on a memory cell region of the substrate, fourth active patterns between the third active patterns, and a device isolation layer that fills a plurality of first trenches and a plurality of second trenches. Each of the first trenches is interposed between the first active patterns and between the second active patterns. Each of the second trenches is interposed between the fourth active patterns and between the third and fourth active patterns. Each of the third and fourth active patterns includes first and second semiconductor patterns that are vertically spaced apart from each other. Depths of the second trenches are greater than depths of the first trenches.

    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

    公开(公告)号:US20230049858A1

    公开(公告)日:2023-02-16

    申请号:US17720741

    申请日:2022-04-14

    Abstract: A semiconductor device may include: an active pattern on a substrate and extending in a first direction; a plurality of source/drain patterns on the active pattern and spaced apart from each other in the first direction; a gate electrode between the plurality of source/drain patterns that crosses the active pattern and extends in a second direction intersecting the first direction; and a plurality of channel patterns stacked on the active pattern and configured to connect two or more of the source/drain patterns to each other. The channel patterns may be spaced apart from each other. Each of the channel patterns may include a first portion between the gate electrode and the source/drain patterns, and a plurality of second portions connected to the first portion and overlapped with the gate electrode in a direction perpendicular to a plane defined by an upper surface of the substrate.

    Semiconductor devices
    36.
    发明授权

    公开(公告)号:US11296204B2

    公开(公告)日:2022-04-05

    申请号:US16418705

    申请日:2019-05-21

    Abstract: Semiconductor devices and methods of forming the same are provided. The semiconductor devices may include a substrate, a pair of semiconductor patterns adjacent to each other on the substrate, a gate electrode on the pair of semiconductor patterns, a source/drain pattern connected to the pair of semiconductor patterns, and a ferroelectric pattern on surfaces of the pair of semiconductor patterns. The surfaces of the pair of semiconductor patterns may face each other, and the ferroelectric pattern may define a first space between the pair of semiconductor patterns. The gate electrode may include a work function metal pattern that is in the first space.

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20210020636A1

    公开(公告)日:2021-01-21

    申请号:US16789588

    申请日:2020-02-13

    Abstract: There is provided a semiconductor device having enhanced operation performance by utilizing a cut region where a gate cut is implemented. There is provided a semiconductor device comprising a first active pattern, a second active pattern, a third active pattern, and a fourth active pattern, all of which extend in parallel in a first direction, and are arranged along a second direction intersecting the first direction; a first gate electrode extended in the second direction on the first to fourth active patterns a first cut region extended in the first direction between the first active pattern and the second active pattern to cut the first gate electrode and a second cut region extended in the first direction between the third active pattern and the fourth active pattern to cut the first gate electrode, wherein one or more first dimensional features related to the first cut region is different from one or more second dimensional features related to the second cut region.

    Semiconductor devices
    39.
    发明授权

    公开(公告)号:US12183800B2

    公开(公告)日:2024-12-31

    申请号:US18449734

    申请日:2023-08-15

    Abstract: Semiconductor devices include a first active pattern including a first lower pattern extending in a first direction and a first sheet pattern spaced apart from the first lower pattern; and a first gate electrode on the first lower pattern, the first gate electrode extending in a second direction and surrounding the first sheet pattern, wherein the first lower pattern includes a first sidewall and a second sidewall opposite to each other, each of the first sidewall of the first lower pattern and the second sidewall of the first lower pattern extends in the first direction, the first gate electrode overlaps the first sidewall of the first lower pattern in the second direction by a first depth, the first gate electrode overlaps the second sidewall of the first lower pattern in the second direction by a second depth, and the first depth is different from the second depth.

    Semiconductor device
    40.
    发明授权

    公开(公告)号:US12142650B2

    公开(公告)日:2024-11-12

    申请号:US18495292

    申请日:2023-10-26

    Abstract: A semiconductor device includes first and second isolation regions, a first active region extending in a first direction between the first and second isolation regions, a first fin pattern on the first active region, nanowires on the first fin pattern, a gate electrode in a second direction on the first fin pattern, the gate electrode surrounding the nanowires, a first source/drain region on a side of the gate electrode, the first source/drain region being on the first active region and in contact with the nanowires, and a first source/drain contact on the first source/drain region, the first source/drain contact including a first portion on a top surface of the first source/drain region, and a second portion extending toward the first active region along a sidewall of the first source/drain region, an end of the first source/drain contact being on one of the first and second isolation regions.

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