公开(公告)号：US5470943A

公开(公告)日：1995-11-28

申请号：US360584

申请日：1994-12-21

申请人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G77/10 ,  C07D213/69 ,  C08G69/26

CPC分类号： C08G73/1039 ,  C08G73/1085

摘要： This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond.The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.

摘要翻译： 本发明涉及一种新颖的含氟聚酰亚胺或聚酰亚胺共聚物，其具有透明性和非常低的介电特性，并且具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，该聚酰亚胺系树脂组合物含有聚酰亚胺 或聚酰亚胺共聚物和纤维增强剂，树脂组合物的制备方法，树脂组合物的注塑制品。 聚酰亚胺包含具有一个或多个下式的重复结构单元的必需结构单元：其中Ar是具有6至27个碳原子的四价基团，并且选自单芳族基团，缩合多芳族基团 具有芳族基团的自由基和非缩合多芳族基团彼此直接键合或桥接成员，三氟甲基位于吡啶核上的3-或4-位，酰亚胺氮原子连接在3 - 或4-位到醚键。 聚酰亚胺或聚酰亚胺共聚物具有优异的耐热性，优异的熔体流动稳定性和极好的加工性，并且是无色的，具有高透明度和非常低的介电系数，并且可以预期用作电气电子设备的原料 光学仪器由于上述特点。

公开(公告)号：US5484880A

公开(公告)日：1996-01-16

申请号：US354806

申请日：1994-12-13

申请人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Mitsunori Matsuo ,  Tsutomu Ishida ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Mitsunori Matsuo ,  Tsutomu Ishida ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C07B61/00 ,  C07C221/00 ,  C08G73/10 ,  C08L79/08 ,  C08G77/10 ,  C08G69/26

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/105 ,  C08G73/1064 ,  C08L79/08

摘要： The present invention relates to an amorphous polyimide or a polyimide copolymer having a requisite structural unit consisting of one or more recurring structural units represented by the formula (1): ##STR1## wherein X is a direct bond, oxygen atom or sulfur atom, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually a hydrogen atom or methyl, and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.Polyimide and the polyimide copolymer of the invention has excellent heat resistance, is outstanding in melt-flow stability, has greatly improved processability, and can be applied to structural materials, and electric- electronic appliances.

摘要翻译： 本发明涉及具有必要结构单元的无定形聚酰亚胺或聚酰亚胺共聚物，所述结构单元由一个或多个由式（1）表示的重复结构单元：原子或硫原子组成，并且R 1，R 2，R 3和R 4分别为 氢原子或甲基，Ar是具有6至27个碳原子的四价基团，并且选自具有芳族基团的单芳族基团，缩合多芳族基团和具有直接键或桥键的彼此连接的非缩合多芳族基团 会员。 本发明的聚酰亚胺和聚酰亚胺共聚物具有优异的耐热性，熔体流动稳定性优异，加工性能大大提高，可应用于结构材料和电子电器。

公开(公告)号：US5364967A

公开(公告)日：1994-11-15

申请号：US5276

申请日：1993-01-19

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/50

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5300620A

公开(公告)日：1994-04-05

申请号：US79753

申请日：1993-06-22

申请人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

发明人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26 ,  C08L79/08

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1017 ,  C09J179/08 ,  H05K3/386 ,  Y10S525/928

摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

摘要翻译： 本发明的耐热粘合剂包括通过使用1,3-双（3-氨基苯氧基）苯作为芳族二胺组分和3,3'，4,4'-联苯四羧酸二酐3，3'，4,4'-联苯四羧酸二酐制备的聚酰胺酸和/或聚酰亚胺 ，3'，4,4'-二苯甲酮四羧酸二酐和/或3,3'，4,4'-二苯基醚四羧酸二酐作为四羧酸二酐，并进一步通过用二羧酸酐或单胺化合物封闭聚合物链端; 或者包含在良溶剂中含有聚酰亚胺的聚酰亚胺溶液。 本发明的粘合剂是能够在温和/温和的条件下粘合的耐热粘合剂。 聚酰亚胺溶液的粘合剂可以通过简单的方法提供所需的粘附性，例如施加到被粘物上并在加压下加热并显示出优异的粘合强度。 因此，本发明的耐热粘合剂对于结构和电子材料和其它工业材料的粘合是非常有用的。

公开(公告)号：US5252700A

公开(公告)日：1993-10-12

申请号：US871517

申请日：1992-04-21

申请人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

发明人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26 ,  C08G63/00

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1017 ,  C09J179/08 ,  H05K3/386 ,  Y10S525/928

摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

公开(公告)号：US5708128A

公开(公告)日：1998-01-13

申请号：US668836

申请日：1996-06-24

申请人： Hideaki Oikawa ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Hideaki Oikawa ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/101 ,  C08G73/1071 ,  Y10T428/31504

摘要： Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.

摘要翻译： 根据本发明制备了新型热固性聚酰亚胺和包含热固性聚酰亚胺和纤维增强材料的复合材料。 热固性聚酰亚胺通过热处理线性聚酰胺酸或通过使用4,4'-双（3-氨基苯氧基）联苯和均苯四酸二酐作为必需单体制备的线性聚酰亚胺或通过加入4,4'-二氨基二苯醚或3 ，3'，4,4'-联苯四羧酸二酐加入到基本单体中，并通过用具有碳 - 碳三键的芳族二羧酸酐封端分子链末端。 热固性聚酰亚胺具有热塑性聚酰亚胺的基本优异性能，并且还具有增强的耐热性和改善的机械性能。 热固性聚酰亚胺可用于为飞机基体，电气和电子设备等提供各种复合材料。

公开(公告)号：US5210174A

公开(公告)日：1993-05-11

申请号：US612461

申请日：1990-11-14

申请人： Shoji Tamai ,  Hideaki Oikawa ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Hideaki Oikawa ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10

CPC分类号： C08G73/1067 ,  C08G73/1007 ,  C08G73/1028 ,  C08G73/1071

摘要： In a process for the preparation of polyimide by reacting a diamine compound with tetracarboxylic dianhydride in a phenol based solvent, an improved process for reacting the diamine compound with tetracarboxylic dianhydride in a solution by forming separate solutions of the tetracarboxylic dianhydride and the diamine compound and mixing the solutions and/or by dissolving tetracarboxylic dianhydride in the phenol-based solvent containing an organic base.

公开(公告)号：US5286840A

公开(公告)日：1994-02-15

申请号：US795750

申请日：1991-11-21

申请人： Hideaki Oikawa ,  Nobuhito Koga ,  Akihiro Yamaguchi ,  Shoji Tamai

发明人： Hideaki Oikawa ,  Nobuhito Koga ,  Akihiro Yamaguchi ,  Shoji Tamai

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/1071 ,  C08G73/1014

摘要： A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.

摘要翻译： 在聚合物末端用由式（III）表示的二羧酸酐封闭的热稳定聚酰亚胺：（*化学结构*）（III）其中Z是选自以下的二价基团：单芳族基团，其为 基本上未被取代或被不与胺或二羧酸酐反应的基团或具有6至15个碳原子的基团取代，稠合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接，并具有基本的 由式（IV）的重复结构单元表示的骨架：（*化学结构*）（IV）和制备聚酰亚胺的方法。

公开(公告)号：US06531568B1

公开(公告)日：2003-03-11

申请号：US09762260

申请日：2001-04-09

申请人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

发明人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

IPC分类号： C08G7310

CPC分类号： C08G73/10 ,  C08G73/101

摘要： This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

摘要翻译： 本发明提供了各种已知的热塑性聚酰亚胺骨架结构的含交联性基团的聚酰亚胺，其具有比已知结构的聚酰亚胺更好的耐热性，耐化学性和机械性能，而不损害优异的成型性或成型性，优异的滑动性，低水 吸收性能，优异的电性能，高热氧化稳定性和高耐辐射性，所有这些都是结构固有的。

公开(公告)号：US06458912B1

公开(公告)日：2002-10-01

申请号：US09674916

申请日：2001-02-05

申请人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

发明人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

IPC分类号： C08G7300

CPC分类号： C08G73/1042 ,  C08G73/101 ,  C08G73/105

摘要： A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding. {circle around (2)} It has high heat resistance. {circle around (3)} It is superior in productivity. {circle around (4)} It is superior in dimensional accuracy.

摘要翻译： 一种具有良好热稳定性的热塑性聚酰亚胺，其包含由化学式（1）表示的重复单元，由化学式（2）和/或化学式（3）组成的分子末端，其特征在于：熔体粘度比 由式（1）和/或数值式（3）计算的数值在数值式（2）和/或数值式（4）和1,3-双（4-氨基苯氧基） 由化学式（3）表示的用于制备上述聚酰亚胺的苯，其特征在于偶氮化合物的含量为0.0-0.2％。 本发明的热塑性聚酰亚胺具有以下所述的{圆周（1）}〜{圆周（4）}的特性。 {circle around（1）}熔融时的热稳定性优异。 也就是说，随着时间的流逝，熔融流动性的降低程度小，可以适用于常规的熔融成型。 {circle around（2）}它具有很高的耐热性。 {circle around（3）}它的生产力优越。 {circle around（4）}尺寸精度优越。