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公开(公告)号：US08564005B2
公开(公告)日：2013-10-22
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
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公开(公告)号：US07283931B2
公开(公告)日：2007-10-16
申请号：US10820747
申请日：2004-04-09
申请人： Je-hyoung Ryu , Sung-jin Lee , Jun-ho Lee , Tae-gyu Kim
发明人： Je-hyoung Ryu , Sung-jin Lee , Jun-ho Lee , Tae-gyu Kim
CPC分类号： G01R31/2877
摘要： An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.
摘要翻译： 一种具有匹配板的半导体器件的检查装置; 与所述匹配板组合的接触模块，包括接触半导体器件的辐射单元和所述半导体器件的压接引线的测试单元; 以及安装在接触模块的辐射单元的接触面上的导热焊盘，以将热量从半导体器件传递到接触模块的辐射单元。 本发明提供一种用于半导体器件的检查装置，其提高半导体器件耐热耐久性的测试的可靠性，并且在测试期间最小化对半导体器件的损坏。
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公开(公告)号：US20050286607A1
公开(公告)日：2005-12-29
申请号：US11167093
申请日：2005-06-28
申请人： Tae-gyu Kim , Seong-gu Kim
发明人： Tae-gyu Kim , Seong-gu Kim
CPC分类号： G01K7/00
摘要： A temperature measuring apparatus measures the temperature of a wafer in real time using a change of magnetic field during a thermal process. The temperature measuring apparatus includes: at least one conductive structure disposed on one surface of the wafer, in which an electrical conductivity of the conductive structure varies depending on temperature; a magnetic field generator installed facing the conductive structure with respect to a center of the wafer; and a magnetic field measuring sensor installed above the conductive structure.
摘要翻译： 温度测量装置在热处理期间使用磁场的变化来实时测量晶片的温度。 所述温度测量装置包括：至少一个导电结构，设置在所述晶片的一个表面上，其中所述导电结构的导电性根据温度而变化; 相对于晶片的中心面向导电结构安装的磁场发生器; 以及安装在导电结构上方的磁场测量传感器。
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34.发明授权Fusing roller assembly having working fluid and heater coil for quick heating and low power consumption for an electrophotographic image forming apparatus and method of making the same 失效具有用于快速加热的工作流体和加热器线圈的定影辊组件和用于电子照相成像设备的低功率消耗的定影辊组件及其制造方法公开(公告)号：US06571080B2
公开(公告)日：2003-05-27
申请号：US09947657
申请日：2001-09-07
申请人： Kyung-woo Lee , Tae-gyu Kim
发明人： Kyung-woo Lee , Tae-gyu Kim
IPC分类号： G03G1520
CPC分类号： G03G15/2053 , H05B3/0095
摘要： A structurally improved fusing roller assembly based on a heat pipe principle is provided. The fusing roller assembly includes a fusing roller that serves as a heat pipe, and a resistance heater and/or a halogen lamp inside the fusing roller, so that the surface of the fusing roller can be instantaneously heated up to a target fusing temperature. The fusing roller assembly can be heated up to a target fusing temperature within a shorter period of time without need for a warm-up period and a stand-by period, so that power consumption decreases.
摘要翻译： 提供了一种基于热管原理的结构改进的定影辊组件。 定影辊组件包括用作热管的定影辊和定影辊内部的电阻加热器和/或卤素灯，使得定影辊的表面可以瞬间加热到目标定影温度。 定影辊组件可以在更短的时间内加热到目标定影温度，而不需要预热时间和待机时间，从而功耗降低。
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公开(公告)号：US20120255873A1
公开(公告)日：2012-10-11
申请号：US13369920
申请日：2012-02-09
申请人： Hyun-suk KWAK , Young-chul Ko , Tae-gyu Kim , Jong-ho Ahn , Bok-soo Kim
发明人： Hyun-suk KWAK , Young-chul Ko , Tae-gyu Kim , Jong-ho Ahn , Bok-soo Kim
CPC分类号： C02F1/441 , C02F1/4618 , C02F2001/46142 , C02F2001/46157 , C02F2001/4619 , C02F2201/46115 , C02F2201/4613
摘要： An apparatus for producing electrolytic reducing water with excellent reducing ability and a pH that is maintained neutral by combining advantages of a conventional water purifier and a conventional alkaline ionized water device.
摘要翻译： 一种具有优异的还原能力的电解还原水的制造装置和通过结合常规的净水器和常规碱性电离水装置的优点而保持中性的pH。
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公开(公告)号：US20120181559A1
公开(公告)日：2012-07-19
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
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公开(公告)号：US07275865B2
公开(公告)日：2007-10-02
申请号：US11167093
申请日：2005-06-28
申请人： Tae-gyu Kim , Seong-gu Kim
发明人： Tae-gyu Kim , Seong-gu Kim
CPC分类号： G01K7/00
摘要： A temperature measuring apparatus measures the temperature of a wafer in real time using a change of magnetic field during a thermal process. The temperature measuring apparatus includes: at least one conductive structure disposed on one surface of the wafer, in which an electrical conductivity of the conductive structure varies depending on temperature; a magnetic field generator installed facing the conductive structure with respect to a center of the wafer; and a magnetic field measuring sensor installed above the conductive structure.
摘要翻译： 温度测量装置在热处理期间使用磁场的变化来实时测量晶片的温度。 所述温度测量装置包括：至少一个导电结构，设置在所述晶片的一个表面上，其中所述导电结构的导电性根据温度而变化; 相对于晶片的中心面向导电结构安装的磁场发生器; 以及安装在导电结构上方的磁场测量传感器。
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公开(公告)号：US07176704B2
公开(公告)日：2007-02-13
申请号：US10823546
申请日：2004-04-14
申请人： Je-hyoung Ryu , Tae-gyu Kim , Soon-kyu Yim , Sung-jin Lee , Jun-ho Lee
发明人： Je-hyoung Ryu , Tae-gyu Kim , Soon-kyu Yim , Sung-jin Lee , Jun-ho Lee
IPC分类号： G01R31/02
CPC分类号： G01R1/0458
摘要： An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results. Accurate testing improves productivity and saves expense by removing faulty test results caused by identifying a qualified semiconductor as a defective semiconductor due to heat radiated from the semiconductor device.
摘要翻译： 一种用于半导体器件的检查装置，包括：匹配板; 与所述匹配板组合的接触模块，所述匹配板包括从所述半导体器件向外部辐射热的辐射单元，以及接触所述半导体的引线的测试单元; 插入模块，安装在所述触点模块的底部，并且具有用于容纳所述半导体器件的半导体器件容纳器; 以及安装在所述插入模块的底部上的辅助辐射构件，并且将来自所述半导体器件的热量散发到外部。 因此，根据本发明的半导体装置的检查装置不管来自半导体的热量是恒定的，通过立即有效地辐射来自半导体的热量进行测试，从而产生更准确的测试结果。 通过从半导体器件辐射的热量，通过识别合格的半导体作为有缺陷的半导体而导致的故障测试结果，可以提高生产率并节省成本。
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39.发明授权Inspecting apparatus having a radiator to radiate heat from a semiconductor device 有权检测装置具有散热器以从半导体器件辐射热量公开(公告)号：US07034557B2
公开(公告)日：2006-04-25
申请号：US10820748
申请日：2004-04-09
申请人： Je-hyoung Ryu , Tae-gyu Kim , Jun-ho Lee , Sung-jin Lee , Hong-yong Lee
发明人： Je-hyoung Ryu , Tae-gyu Kim , Jun-ho Lee , Sung-jin Lee , Hong-yong Lee
IPC分类号： G01R31/26
CPC分类号： G01R1/0458
摘要： An inspecting apparatus for a semiconductor device includes a match plate; a contact module combined with the match plate and including a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. The inspecting apparatus performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring the heat quickly and efficiently, thereby producing more accurate test results. The apparatus also improves productivity and saves expense by removing faulty test results caused by incorrectly identifying a qualified semiconductor device as a defective semiconductor device.
摘要翻译： 半导体装置的检查装置包括：匹配板; 与所述匹配板结合的接触模块，并且包括散热器以将热量从所述半导体器件辐射到外部;以及测试器，以接触所述半导体器件的引线; 以及设置在散热器中的热管。 检查装置通过快速有效地传递热量而与来自半导体装置的热量恒定地进行测试，从而产生更准确的测试结果。 该装置还通过消除由于将合格的半导体器件错误地识别为有缺陷的半导体器件而引起的故障测试结果，从而提高了生产率并节约了费用。
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