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公开(公告)号:US20230402975A1
公开(公告)日:2023-12-14
申请号:US17836359
申请日:2022-06-09
Inventor: Wei Ling Chang , Hsieh-Hung Hsieh , Tzu-Jin Yeh
CPC classification number: H03F3/19 , H03F1/565 , H03F2200/451 , H03F2200/222 , H03F2200/387
Abstract: In some aspects of the present disclosure, a millimeter-wave amplifier circuit is disclosed. The millimeter-wave amplifier circuit includes a first amplifier, a first inductor coupled to an output of the first amplifier, a second amplifier coupled to the output of the first amplifier and a second inductor coupled to an output of the second amplifier. The second inductor electro-magnetically couples to the first inductor to send a first signal substantially in-phase with a second signal generated at the output of the first amplifier.
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公开(公告)号:US11777446B2
公开(公告)日:2023-10-03
申请号:US17728877
申请日:2022-04-25
Inventor: Chi-Hsien Lin , Ho-Hsiang Chen , Hsien-Yuan Liao , Tzu-Jin Yeh , Ying-Ta Lu
CPC classification number: H03B5/1228 , H03B1/04 , H03B5/1203 , H03B5/1206 , H03B5/1212 , H03B5/1243 , H03B5/1296 , H03H7/0161 , H03B2200/009
Abstract: An oscillator includes a forward stage including first and second terminals and a transformer-coupled band-pass filter (BPF) coupled between the first and second terminals and including a coupling device between the first and second terminals, and a transformer including first and second windings in a metal layer of an IC. The first winding includes a first conductive structure coupled to the first terminal and a second conductive structure coupled to a voltage node, a third conductive structure including first and second extending portions connected to the first and second conductive structures. The second winding includes a fourth conductive structure including a third extending portion coupled to the voltage node, and a fourth extending portion coupled to the second terminal. The third extending portion is between the second conductive structure and the first extending portion, and the fourth extending portion is between the first conductive structure and the second extending portion.
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公开(公告)号:US11354481B2
公开(公告)日:2022-06-07
申请号:US16442178
申请日:2019-06-14
Inventor: Chi-Hsien Lin , Ho-Hsiang Chen , Hsien-Yuan Liao , Tzu-Jin Yeh , Ying-Ta Lu
IPC: G06F30/398 , G03F1/70 , G03F1/36
Abstract: A phase shifter includes an active region, a first and a second set of gates and a set of contacts. The active region extends in a first direction and is located at a first level. The first and second set of gates each extend in a second direction, overlap the active region and are located at a second level. The second set of gates are positioned along opposite edges of the active region, are configured to receive a first voltage, and are part of a first transistor. The first transistor is configured to adjust a first capacitance of the phase shifter responsive to the first voltage. The set of contacts extend in the second direction, are over the active region, are located at a third level, and are positioned between at least the second set of gates.
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公开(公告)号:US11323068B2
公开(公告)日:2022-05-03
申请号:US17231245
申请日:2021-04-15
Inventor: Chi-Hsien Lin , Ho-Hsiang Chen , Hsien-Yuan Liao , Tzu-Jin Yeh , Ying-Ta Lu
Abstract: In some embodiments, a differential oscillator includes a differential circuit coupled between a first output node and a second output node and a transformer-coupled band-pass filter (BPF). The transformer-coupled BPF is coupled between the first output node and the second output node and includes a coupling device and a transformer. The coupling device is coupled between the first output node and the second output node. The transformer includes a first winding coupled between the first output node and a voltage node and a second winding coupled between the second output node and the voltage node.
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公开(公告)号:US20220069779A1
公开(公告)日:2022-03-03
申请号:US17006892
申请日:2020-08-31
Inventor: En-Hsiang Yeh , Wen-Sheng Chen , Chia-Ming Liang , Chung-Ho Chai , Zong-You Li , Tzu-Jin Yeh
Abstract: The measurement method includes operations of applying a first gate bias voltage to a gate terminal of a first transistor that is included in a radio frequency (RF) power amplifier during a direct current (DC) measurement period, wherein the first transistor operates in a linear operation mode during the DC measurement period; measuring a first drain-source voltage of the first transistor and a current flowing through the first transistor via a connection node during the DC measurement period; applying a second gate bias voltage and a drain bias voltage to a gate terminal and a drain terminal of a second transistor that is electrically connected to the first transistor via the connection node; and measuring a DC value of the second transistor via the connection node during the DC measurement period.
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公开(公告)号:US10672704B2
公开(公告)日:2020-06-02
申请号:US15965618
申请日:2018-04-27
Inventor: Wen-Sheng Chen , An-Hsun Lo , En-Hsiang Yeh , Tzu-Jin Yeh
IPC: H01L23/522 , H01L49/02
Abstract: A semiconductor device includes: a polygonal inductive device disposed on a first layer on a substrate, the polygonal inductive device including a first line portion; a first conductive line disposed on a second layer on the substrate; a second conductive line disposed on a third layer on the substrate; and a first conductive via arranged to electrically couple the second conductive line to the first conductive line; wherein the first layer is different from the second layer and the third layer, the first conductive line is electrically connected to a reference voltage, and the first conductive line crosses the first line portion viewing from a top of the semiconductor device.
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公开(公告)号:US20130288443A1
公开(公告)日:2013-10-31
申请号:US13927340
申请日:2013-06-26
Inventor: Chewn-Pu Jou , Tzu-Jin Yeh , Hsieh-Hung Hsieh
IPC: H01L29/66
CPC classification number: H01L29/66795 , H01L29/42372 , H01L29/785
Abstract: Methods for forming reduced gate resistance finFETs. Methods for a metal gate transistor structure are disclosed including forming a plurality of semiconductor fins formed over a semiconductor substrate, the fins being arranged in parallel and spaced apart; a metal containing gate electrode formed over the semiconductor substrate and overlying a channel gate region of each of the semiconductor fins, and extending over the semiconductor substrate between the semiconductor fins; an interlevel dielectric layer overlying the gate electrode and the semiconductor substrate; and a plurality of contacts disposed in the interlevel dielectric layer and extending through the interlevel dielectric layer to the gate electrode; a low resistance metal strap formed over the interlevel dielectric layer and coupled to the gate electrode by the plurality of contacts; wherein the plurality of contacts are spaced apart from the channel gate regions of the semiconductor fins. Additional methods are disclosed.
Abstract translation: 形成栅极电阻finFET的方法。 公开了一种金属栅极晶体管结构的方法,包括形成在半导体衬底上形成的多个半导体鳍片,所述鳍片平行布置并间隔开; 一个含金属的栅电极,形成在半导体衬底之上,并且覆盖每个半导体鳍片的沟道栅极区域,并且在半导体鳍片之间的半导体衬底上延伸; 覆盖所述栅电极和所述半导体衬底的层间电介质层; 以及多个触点,其布置在所述层间电介质层中并且延伸穿过所述层间电介质层到所述栅电极; 形成在所述层间电介质层上并且由所述多个触点耦合到所述栅电极的低电阻金属带; 其中所述多个触点与所述半导体鳍片的沟道栅极区域间隔开。 公开了另外的方法。
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公开(公告)号:US20250169085A1
公开(公告)日:2025-05-22
申请号:US18513873
申请日:2023-11-20
Inventor: Kai-Chun Chang , Hsieh-Hung Hsieh , Tzu-Jin Yeh , Jun-De Jin , Ching-Chung Hsu , Chung-Long Chang , Hua-Chou Tseng
IPC: H01F27/28 , H01F17/00 , H01F27/29 , H01L23/498 , H01L23/552 , H01L23/66
Abstract: Semiconductor device isolation is provided. In one aspect, a semiconductor device include a spiral inductor. The semiconductor device includes a patterned ground shield (PGS) electrically coupled with the spiral inductor. The semiconductor device includes a filter configured to exchange energy with the PGS. The semiconductor device includes a circuit vertically spaced from the inductor, the PGS disposed between the circuit and the spiral inductor.
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公开(公告)号:US20240388266A1
公开(公告)日:2024-11-21
申请号:US18320709
申请日:2023-05-19
Inventor: Wei Ling Chang , Hsieh-Hung Hsieh , Tzu-Jin Yeh
Abstract: An integrated circuit includes a first substrate having a first substrate material, and the first substrate includes a first circuit. A second substrate has a second substrate material different than the first substrate material, and the second substrate includes a second circuit. A conductive interconnect electrically connects the first circuit and the second circuit.
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公开(公告)号:US12095419B2
公开(公告)日:2024-09-17
申请号:US18362925
申请日:2023-07-31
Inventor: Chi-Hsien Lin , Ho-Hsiang Chen , Hsien-Yuan Liao , Tzu-Jin Yeh , Ying-Ta Lu
CPC classification number: H03B5/1228 , H03B1/04 , H03B5/1203 , H03B5/1206 , H03B5/1212 , H03B5/1243 , H03B5/1296 , H03H7/0161 , H03B2200/009
Abstract: A band-pass filter (BPF) includes first and second windings. The first winding includes first and second terminals, a first outer extending portion extending from the first terminal, a second outer extending portion extending from the second terminal, and a first conductive structure configured to electrically connect the first and second outer extending portions to each other at a location opposite the first and second terminals. The second winding includes third and fourth terminals positioned between the first and second terminals, and a second conductive structure electrically connected to the third and fourth terminals and extending between the first conductive structure and each of the first and second outer extending portions.
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