公开(公告)号：US10984953B2

公开(公告)日：2021-04-20

申请号：US16369813

申请日：2019-03-29

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

公开(公告)号：US10790088B2

公开(公告)日：2020-09-29

申请号：US16351060

申请日：2019-03-12

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/30

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.

公开(公告)号：US10607778B2

公开(公告)日：2020-03-31

申请号：US15819674

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Katsumi Kobayashi ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G2/06 ,  H01G4/008

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.

公开(公告)号：US10381158B2

公开(公告)日：2019-08-13

申请号：US15819778

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/248 ,  H01G4/32 ,  H01G4/30 ,  H01G4/232 ,  H01G4/38 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.

公开(公告)号：US10276305B2

公开(公告)日：2019-04-30

申请号：US15854523

申请日：2017-12-26

Applicant: TDK CORPORATION

Inventor： Kosuke Yazawa ,  Norihisa Ando ,  Masahiro Mori ,  Sunao Masuda ,  Kayou Matsunaga

IPC: H01G4/224 ,  H01G4/248 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G4/232

Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.

公开(公告)号：US12278055B2

公开(公告)日：2025-04-15

申请号：US18154165

申请日：2023-01-13

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Hideki Kaneko ,  Ken Aburakawa ,  Kenya Tamaki ,  Akitoshi Yoshii

IPC: H01G4/224 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248

Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

公开(公告)号：US12230448B2

公开(公告)日：2025-02-18

申请号：US17899797

申请日：2022-08-31

Applicant: TDK CORPORATION

Inventor： Hisashi Kobayashi ,  Norihisa Ando ,  Toshihiro Iguchi ,  Kenya Tamaki

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

Abstract: An electronic component with a metal terminal includes an electronic component having an element body, and external electrodes respectively provided on end surfaces facing each other in an X direction in the element body; and plate-shaped metal terminals having joint portions joined to the external electrodes, and leg portions provided to protrude beyond the electronic component in a Z direction. The leg portion of the metal terminal has an extending part continuously extending in the Z direction from the joint portion, a first bent part bent from a tip of the extending part to the electronic component side at a first angle formed to be an acute angle with respect to the extending part, and a second bent part bent from a tip of the first bent part at a second angle larger than the first angle with respect to the extending part.

公开(公告)号：US11915876B2

公开(公告)日：2024-02-27

申请号：US17858761

申请日：2022-07-06

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Norihisa Ando ,  Kenya Tamaki ,  Hisashi Kobayashi

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G4/2325 ,  H01G4/1227 ,  H01G4/30

Abstract: A ceramic electronic device comprises an element body including a ceramic layer and an internal electrode layer, and an external electrode electrically connected to at least one end of the internal electrode layer. The element body includes an interface part at least at a part of a boundary between the external electrode and the ceramic layer. The interface part includes an oxide containing aluminium and an oxide containing boron.

公开(公告)号：US11430607B2

公开(公告)日：2022-08-30

申请号：US17322079

申请日：2021-05-17

Applicant: TDK CORPORATION

Inventor： Toshihiro Iguchi ,  Norihisa Ando ,  Kenya Tamaki ,  Kayou Matsunaga

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/248 ,  H01G4/228

Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

公开(公告)号：US11335508B2

公开(公告)日：2022-05-17

申请号：US16725374

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Akihiro Masuda ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/224 ,  H01G4/248 ,  H01G4/38

Abstract: An electronic device including chip components each having a first terminal electrode and a second terminal electrode formed on both end faces, and a case provided with an accommodation recess in which the chip components are accommodated, and an opening edge face formed around an opening face of the accommodation recess. An individual metal terminal is attached to the case. The individual metal terminal includes an inner electrode part inserted along an inner side wall of the accommodation recess in the case for connecting to the first terminal electrode, an opening edge electrode part formed over the opening edge face to be continuous to the inner electrode part and a side electrode part formed along the outer side face of the case to be continuous to the opening edge electrode part.