Semiconductor device and method for manufacturing semiconductor device
    31.
    发明申请
    Semiconductor device and method for manufacturing semiconductor device 审中-公开
    半导体装置及半导体装置的制造方法

    公开(公告)号:US20070262380A1

    公开(公告)日:2007-11-15

    申请号:US11796802

    申请日:2007-04-30

    IPC分类号: H01L27/12

    摘要: A semiconductor device comprises: a semiconductor substrate including a SOI region and a bulk region; a first element formed in the SOI region; a second element formed in the bulk region; a first element isolation layer including a trench structure; and a second element isolation layer including a LOCOS structure. The first element is separated from the second element by the first isolation layer and the second isolation layer.

    摘要翻译: 半导体器件包括:包括SOI区域和体区域的半导体衬底; 形成在SOI区域中的第一元件; 形成在本体区域中的第二元件; 包括沟槽结构的第一元件隔离层; 以及包括LOCOS结构的第二元件隔离层。 第一元件通过第一隔离层和第二隔离层与第二元件分离。

    Semiconductor device
    32.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US07271447B2

    公开(公告)日:2007-09-18

    申请号:US11212400

    申请日:2005-08-26

    IPC分类号: H01L27/01

    CPC分类号: H01L29/66772 H01L29/78654

    摘要: A semiconductor substrate includes a first semiconductor layer that is formed on a semiconductor base substrate, a second semiconductor layer that is formed on the first semiconductor layer and that has an etching selection ratio smaller than that of the first semiconductor layer, a cavity portion that is formed below the second semiconductor layer by removing a portion of the first semiconductor layer, a thermal oxidation film that is formed on the surface of the second semiconductor layer in the cavity portion, and a buried insulating film that is buried in the cavity portion.

    摘要翻译: 半导体衬底包括形成在半导体基底衬底上的第一半导体层,形成在第一半导体层上并具有小于第一半导体层的蚀刻选择比的蚀刻选择比的第二半导体层, 通过去除第一半导体层的一部分而形成在第二半导体层的下方,形成在空腔部分中的第二半导体层的表面上的热氧化膜和埋在空腔部分中的埋入绝缘膜。

    Semiconductor device and semiconductor device manufacturing method
    34.
    发明申请
    Semiconductor device and semiconductor device manufacturing method 审中-公开
    半导体器件和半导体器件制造方法

    公开(公告)号:US20070075317A1

    公开(公告)日:2007-04-05

    申请号:US11489572

    申请日:2006-07-20

    IPC分类号: H01L29/04

    CPC分类号: H01L27/1203 H01L21/84

    摘要: A semiconductor device includes a back gate electrode composed of a first single-crystal semiconductor layer formed on a first insulating layer; a second insulating layer formed on the first single-crystal semiconductor layer and having a film thickness smaller than a film thickness of the first insulating layer; a second single-crystal semiconductor layer formed on the second insulating layer; a gate electrode formed on the second single-crystal semiconductor layer; and source and drain layers that are formed on the second single-crystal semiconductor layer and arranged on respective sides of the gate electrode.

    摘要翻译: 半导体器件包括由形成在第一绝缘层上的第一单晶半导体层构成的背栅电极; 形成在所述第一单晶半导体层上并具有比所述第一绝缘层的膜厚小的膜厚度的第二绝缘层; 形成在所述第二绝缘层上的第二单晶半导体层; 形成在第二单晶半导体层上的栅电极; 以及形成在第二单晶半导体层上并且布置在栅电极的相应侧上的源极和漏极层。

    Semiconductor device and method for manufacturing semiconductor device
    36.
    发明申请
    Semiconductor device and method for manufacturing semiconductor device 审中-公开
    半导体装置及半导体装置的制造方法

    公开(公告)号:US20060197163A1

    公开(公告)日:2006-09-07

    申请号:US11363694

    申请日:2006-02-27

    申请人: Juri Kato

    发明人: Juri Kato

    IPC分类号: H01L29/76 H01L21/336

    摘要: A semiconductor device comprising: a semiconductor layer having a film formation face in a side wall, the side wall being film-formed with epitaxial-growth; a gate electrode arranged on the side wall of the semiconductor layer; a source layer arranged in one side of the gate electrode, the source layer being formed in the semiconductor layer; and a drain layer arranged in other side of the gate electrode, the drain layer being formed in the semiconductor layer.

    摘要翻译: 一种半导体器件,包括:半导体层,其具有在侧壁中的成膜面,所述侧壁被外延生长成膜; 设置在所述半导体层的侧壁上的栅电极; 源极层,布置在栅电极的一侧,源极层形成在半导体层中; 以及排列在所述栅电极的另一侧的漏极层,所述漏极层形成在所述半导体层中。

    Method of manufacturing a semiconductor device containing CMOS elements
    38.
    发明授权
    Method of manufacturing a semiconductor device containing CMOS elements 失效
    制造含有CMOS元件的半导体器件的方法

    公开(公告)号:US5879979A

    公开(公告)日:1999-03-09

    申请号:US412939

    申请日:1995-03-29

    摘要: In a CMOS-element-containing semiconductor device, the CMOS element comprises: a silicon substrate; an n-channel MOS element formed on the silicon substrate and including an n-type source/drain region, a gate oxide film and a gate electrode; a p-channel MOS element formed on the silicon substrate and including a p-type source/drain region, a gate oxide film and a gate electrode; and a gate wiring layer electrically interconnecting the gate electrode of the n-channel MOS element and the gate electrode of the p-channel MOS element with one another. At least one of the p-channel MOS element gate electrode, the n-channel MOS element gate electrode and the gate wiring layer include at least in part a metal silicide layer. The gate electrodes and the gate wiring layer contain impurities consisting of at least one of a III group dopant and a V group dopant in total concentration of at most 3.times.10.sup.20 atoms cm.sup.-3.

    摘要翻译: 在含CMOS元件的半导体器件中,CMOS元件包括:硅衬底; 形成在硅衬底上并包括n型源极/漏极区,栅极氧化膜和栅电极的n沟道MOS元件; 形成在硅衬底上并包括p型源极/漏极区,栅极氧化膜和栅电极的p沟道MOS元件; 以及将n沟道MOS元件的栅电极和p沟道MOS元件的栅电极彼此电连接的栅极布线层。 p沟道MOS元件栅极电极,n沟道MOS元件栅极电极和栅极布线层中的至少一个至少部分地包括金属硅化物层。 栅电极和栅极布线层含有由III族掺杂剂和V族掺杂剂中的至少一种构成的杂质,总浓度为3×10 20原子cm -3以下。

    Method for diffusing a semiconductor substrate through a metal silicide
layer by rapid heating
    39.
    发明授权
    Method for diffusing a semiconductor substrate through a metal silicide layer by rapid heating 失效
    通过快速加热使半导体衬底通过金属硅化物层扩散的方法

    公开(公告)号:US4669176A

    公开(公告)日:1987-06-02

    申请号:US756895

    申请日:1985-07-19

    申请人: Juri Kato

    发明人: Juri Kato

    IPC分类号: H01L21/225 H01L21/385

    CPC分类号: H01L21/2257 Y10S438/923

    摘要: A method for forming a diffused region on a semiconductor substrate is provided. A silicide layer is formed in a region of a substrate where a diffused layer is to be formed and a material containing an impurity to be defined into the substrate deposited on the silicide layer. The device is heat treated to cause the impurity to diffuse through the silicide layer into the substrate. The method may be used to produce a MOSFET.

    摘要翻译: 提供了一种在半导体衬底上形成扩散区域的方法。 在要形成扩散层的基板的区域中形成硅化物层,并且将含有要限定的杂质的材料沉积到硅化物层上。 该器件被热处理以使杂质通过硅化物层扩散到衬底中。 该方法可用于制造MOSFET。

    Sensor device
    40.
    发明授权
    Sensor device 有权
    传感器装置

    公开(公告)号:US09030204B2

    公开(公告)日:2015-05-12

    申请号:US13525695

    申请日:2012-06-18

    摘要: A sensor device includes a first electrode, a second electrode, a gap forming member and a functional element. The first electrode is composed of a first metallic material. The second electrode is spaced apart from the first electrode, and composed of a second metallic material. The gap forming member is arranged with a gap being formed between the gap forming member and a portion of a surface of the first electrode. The functional element is configured and arranged to measure a difference in electric potential between the first electrode and the second electrode so that a state of a measurement site to be measured is measured based on the difference in electric potential as measured by the functional element.

    摘要翻译: 传感器装置包括第一电极,第二电极,间隙形成部件和功能元件。 第一电极由第一金属材料构成。 第二电极与第一电极间隔开,并由第二金属材料构成。 间隙形成构件被布置成在间隙形成构件和第一电极的表面的一部分之间形成间隙。 功能元件被配置和布置成测量第一电极和第二电极之间的电位差,使得基于由功能元件测量的电位差来测量待测量的测量部位的状态。