摘要:
A semiconductor device comprises: a semiconductor substrate including a SOI region and a bulk region; a first element formed in the SOI region; a second element formed in the bulk region; a first element isolation layer including a trench structure; and a second element isolation layer including a LOCOS structure. The first element is separated from the second element by the first isolation layer and the second isolation layer.
摘要:
A semiconductor substrate includes a first semiconductor layer that is formed on a semiconductor base substrate, a second semiconductor layer that is formed on the first semiconductor layer and that has an etching selection ratio smaller than that of the first semiconductor layer, a cavity portion that is formed below the second semiconductor layer by removing a portion of the first semiconductor layer, a thermal oxidation film that is formed on the surface of the second semiconductor layer in the cavity portion, and a buried insulating film that is buried in the cavity portion.
摘要:
A nonvolatile semiconductor memory device includes a gate electrode provided on a channel region of a semiconductor layer and a floating gate provided on a back side of the semiconductor layer with a first insulating layer interposed therebetween.
摘要:
A semiconductor device includes a back gate electrode composed of a first single-crystal semiconductor layer formed on a first insulating layer; a second insulating layer formed on the first single-crystal semiconductor layer and having a film thickness smaller than a film thickness of the first insulating layer; a second single-crystal semiconductor layer formed on the second insulating layer; a gate electrode formed on the second single-crystal semiconductor layer; and source and drain layers that are formed on the second single-crystal semiconductor layer and arranged on respective sides of the gate electrode.
摘要:
A semiconductor substrate comprising a semiconductor base, a dielectric layer formed in at least a part of an area on the semiconductor base, and a single crystal semiconductor layers having mutually different film thicknesses, disposed on the dielectric layer and formed by epitaxial growth.
摘要:
A semiconductor device comprising: a semiconductor layer having a film formation face in a side wall, the side wall being film-formed with epitaxial-growth; a gate electrode arranged on the side wall of the semiconductor layer; a source layer arranged in one side of the gate electrode, the source layer being formed in the semiconductor layer; and a drain layer arranged in other side of the gate electrode, the drain layer being formed in the semiconductor layer.
摘要:
A semiconductor device includes a gate electrode formed on a semiconductor layer, source and drain layers formed in the semiconductor layer and disposed on both sides of the gate electrode, and a field plate disposed at the back of the semiconductor layer with an insulating layer provided therebetween.
摘要:
In a CMOS-element-containing semiconductor device, the CMOS element comprises: a silicon substrate; an n-channel MOS element formed on the silicon substrate and including an n-type source/drain region, a gate oxide film and a gate electrode; a p-channel MOS element formed on the silicon substrate and including a p-type source/drain region, a gate oxide film and a gate electrode; and a gate wiring layer electrically interconnecting the gate electrode of the n-channel MOS element and the gate electrode of the p-channel MOS element with one another. At least one of the p-channel MOS element gate electrode, the n-channel MOS element gate electrode and the gate wiring layer include at least in part a metal silicide layer. The gate electrodes and the gate wiring layer contain impurities consisting of at least one of a III group dopant and a V group dopant in total concentration of at most 3.times.10.sup.20 atoms cm.sup.-3.
摘要:
A method for forming a diffused region on a semiconductor substrate is provided. A silicide layer is formed in a region of a substrate where a diffused layer is to be formed and a material containing an impurity to be defined into the substrate deposited on the silicide layer. The device is heat treated to cause the impurity to diffuse through the silicide layer into the substrate. The method may be used to produce a MOSFET.
摘要:
A sensor device includes a first electrode, a second electrode, a gap forming member and a functional element. The first electrode is composed of a first metallic material. The second electrode is spaced apart from the first electrode, and composed of a second metallic material. The gap forming member is arranged with a gap being formed between the gap forming member and a portion of a surface of the first electrode. The functional element is configured and arranged to measure a difference in electric potential between the first electrode and the second electrode so that a state of a measurement site to be measured is measured based on the difference in electric potential as measured by the functional element.