摘要:
A debugger apparatus according to the present embodiment comprises a host, CPU, a plurality of E-memory units (emulation memory units) for storing instructions, and an execution supervision unit. The host traces the instructions to be stored in the E-memory units and transfers the tracing result in the form of an instruction sequence. The execution supervision unit is connected to the CPU, E-memory units, and host. The execution supervision unit individually writes the instruction sequences transferred from the host in the plurality of E-memory units, reads an instruction sequence from one of the plurality of E-memory units in accordance with an instruction address of the CPU to thereby transfer the instruction sequence to the CPU, and outputs an instruction rewriting order to the host when the instruction address of the CPU is irrelevant.
摘要:
A substrate-holding apparatus for holding a semiconductor substrate in a semiconductor processor is characterized in that the apparatus includes a mount block made of, e.g., aluminum nitrate with a high-frequency electrode embedded therein and a heating block made of, e.g., an aluminum alloy with a heating body embedded therein. The mount block is tightly attached to the heating block by engaging the bottom surface of the mount block with the top surface of the heating block, for example, by using a latching mechanism.
摘要:
In a data processing apparatus, a decoding unit decodes instructions. A calculator operates N-bit data in accordance with the decoded results. A flag storage unit stores a plurality of flag groups which are changed in correspondence to data having different widths, based on the operated results. Selectors select a predetermined flag group in accordance with the direction of a conditional branch instruction. A branch judging unit judges whether a branch is taken or not by referring to the selected flag group.
摘要:
There is provided a ceramic member which is a sintered body containing enstatite and boron nitride as constituents, in which boron nitride is oriented in a single direction, a probe holder formed using the ceramic member, and a manufacturing method of the ceramic member. In the ceramic member, an index of orientation degree is not less than 0.8. In so doing, it is possible to provide a ceramic member which has a free machining property, a coefficient of thermal expansion which is close to that of silicon, and high strength, and a probe holder which is formed using the ceramic member, and a manufacturing method of the ceramic member.
摘要:
An insulation coating method for a metal base comprises a thermal spraying step, an impregnation step, and a beam irradiation step. In the thermal spraying step, a first insulation coating is formed by thermally spraying a first metal oxide to the surface of the metal base. In the impregnation step, pores formed in the surface of the first insulation coating are impregnated with a sol that contains, as a dispersoid, a metal oxide, a hydrate of a metal oxide, or a metal hydroxide. In the beam irradiation step, a second insulation coating that is composed of a second metal oxide is formed by irradiating the first insulation coating and the sol with a high energy beam after the impregnation step.
摘要:
A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×10−6 to 5×10−6/° C. and one or more thin-film wiring sheets stacked on one surface of the ceramic substrate, and a probe head on which a plurality of conductive proves are arranged in accordance with wiring on the thin-film wiring sheet, which holds individual probes while preventing the probes from coming off and allowing both ends of each probe to be exposed, and which is stacked on the wiring substrate while one end of each probe is brought into contact with the thin-film wiring sheet.
摘要:
The present invention provides an electrostatic chuck comprising a substrate, a dielectric layer formed by thermal spraying on an upper face of the substrate, an internal electrode embedded in the dielectric layer, a feeder terminal portion extending from a lower face of the substrate to the internal electrode, and an electrode provided in the feeder terminal portion, wherein the feeder terminal portion and the substrate are fixed to each other by mechanical joining.
摘要:
To efficiently debug while reducing a debugging circuit in a system LSI made up of a plurality of CPUs. A debugging apparatus includes debug object selection means 109 for selecting the CPU to be debugged from CPUs 11 and 12 in accordance with a debug object selection request from a host PC 15 connected to a system LSI 17, event information output means 110 for outputting internal event information of one selected CPU to be debugged, detected event storage means 106 for temporarily storing a detected event set by the host PC 15, and event comparison means 105 for making a comparison between the internal event information output from the event information output means 110 and the detected event stored in the detected event storage means 106 to detect a match therebetween. The event comparison means 105 notifies the host PC 15 that an event match is detected.
摘要:
In a data processing apparatus, a decoding unit decodes instructions. A calculator operates N-bit data in accordance with the decoded results. A flag storage unit stores a plurality of flag groups which are changed in correspondence to data having different widths, based on the operated results. Selectors select a predetermined flag group in accordance with the direction of a conditional branch instruction. A branch judging unit judges whether a branch is taken or not by referring to the selected flag group.
摘要:
An upper metallic base is placed over a lower metallic base with a resistance heater element interposed between them so as to cause a plastic deformation to at least one of the opposing surfaces until the corresponding surfaces conform to an outer profile of the heater element, and the opposing surfaces of the lower and upper bases, and the resistance heater element are substantially entirely bonded to one another by a metallic bonding which may consist of brazing, soldering or diffusion bonding. Because the metallic bonding provides a favorable heat conduction, and can thereby improve the thermal efficiency and prevent local heating, a rapid temperature rise and uniform heating are made possible. Because the base consists of two parts, the material for the base can be selected from a wide range of materials including those capable of withstanding high temperatures and corrosive materials.