公开(公告)号：US20140020884A1

公开(公告)日：2014-01-23

申请号：US13551858

申请日：2012-07-18

申请人： Mark D. Schultz

发明人： Mark D. Schultz

IPC分类号： G05D23/00

CPC分类号： H05K7/20836 ,  G05D23/00 ,  H05K7/20281

摘要： According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

摘要翻译： 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的架构利用的空气以冷却信息技术设备的机架。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 由信息技术设备架构产生。

公开(公告)号：US20100252225A1

公开(公告)日：2010-10-07

申请号：US12814746

申请日：2010-06-14

申请人： Mark D. Schultz

发明人： Mark D. Schultz

IPC分类号： B22D17/00

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.

摘要翻译： 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在穿过平台时减压。

公开(公告)号：US20090183849A1

公开(公告)日：2009-07-23

申请号：US12018421

申请日：2008-01-23

申请人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

发明人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC分类号： B22D27/15 ,  B67D5/00 ,  B22D23/00

CPC分类号： H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US20090147394A1

公开(公告)日：2009-06-11

申请号：US12116175

申请日：2008-05-06

申请人： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

发明人： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC分类号： G11B15/18

CPC分类号： G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

摘要： In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

摘要翻译： 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US07408780B2

公开(公告)日：2008-08-05

申请号：US11151843

申请日：2005-06-14

申请人： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

发明人： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.

摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中弹簧元件中的至少一个包括弹簧部分和翅片部分。 至少一个弹簧元件提供来自电子设备的热路径并且提供机械顺应性。 在另一个实施例中，该结构还包括设置在电子设备上的导热层，其中至少一个弹簧元件中的每一个的翅片部分耦合到导热层。

公开(公告)号：US20080048008A1

公开(公告)日：2008-02-28

申请号：US11508082

申请日：2006-08-22

申请人： Mark D. Schultz

发明人： Mark D. Schultz

IPC分类号： B23K1/08 ,  B23K31/02

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one cavity in the mold plate with solder; and then relatively moving the fill head from the second location to a third location such that the o-ring decompresses as it crosses from the second location to the third location. The step of relatively moving the fill head from the first location to the second location includes moving from a higher elevation to a lower elevation. A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the interface.

摘要翻译： 一种用于在模具板上分配焊料凸块的方法包括以下步骤：将包括O形环的填充头从第一位置相对移动到第二位置，使得O形环在从第一位置穿过第二位置时减压 位置; 用焊料填充模具板中的至少一个空腔; 然后将填充头从第二位置相对移动到第三位置，使得O形环在从第二位置到第三位置越过时解压缩。 将填充头从第一位置相对移动到第二位置的步骤包括从较高的高度移动到较低的高度。 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在通过界面时减压。

公开(公告)号：US07236323B2

公开(公告)日：2007-06-26

申请号：US10930163

申请日：2004-08-31

申请人： Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

发明人： Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

IPC分类号： G11B21/02 ,  G11B5/09

CPC分类号： G11B5/59633 ,  G11B5/59666

摘要： A method and apparatus for providing combined radial and timing multislot self-servowrite propagation is disclosed. Radial bursts are combined with each timing mark and requires only three recovery/read-write spacing allocations per sector. The channel operates without requiring the writing of any bursts between reading radial bursts.

摘要翻译： 公开了一种用于提供组合的径向和定时多槽自伺服传播的方法和装置。 辐射脉冲串与每个定时标记组合，每扇区只需要三个恢复/读写间距分配。 信道操作而不需要在读取径向脉冲串之间写入任何脉冲串。

公开(公告)号：US09425124B2

公开(公告)日：2016-08-23

申请号：US13364907

申请日：2012-02-02

申请人： John P. Karidis ,  Mark D. Schultz

发明人： John P. Karidis ,  Mark D. Schultz

IPC分类号： H01L23/367 ,  H01L23/473 ,  H01L23/00 ,  H01L23/467 ,  H01L21/48

CPC分类号： H01L23/473 ,  B23K1/0014 ,  B23K31/02 ,  B23K2101/14 ,  H01L21/4882 ,  H01L21/4885 ,  H01L23/3677 ,  H01L23/467 ,  H01L24/72 ,  H01L2924/01322 ,  H01L2924/00

摘要： A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

摘要翻译： 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。

公开(公告)号：US09167728B2

公开(公告)日：2015-10-20

申请号：US13551858

申请日：2012-07-18

申请人： Mark D. Schultz

发明人： Mark D. Schultz

IPC分类号： H05K7/20 ,  G05D23/00

CPC分类号： H05K7/20836 ,  G05D23/00 ,  H05K7/20281

摘要： According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

摘要翻译： 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的架构利用的空气以冷却信息技术设备的机架。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 由信息技术设备架构产生。

公开(公告)号：US20130214406A1

公开(公告)日：2013-08-22

申请号：US13398534

申请日：2012-02-16

申请人： Mark D. Schultz

发明人： Mark D. Schultz

IPC分类号： H01L23/36

CPC分类号： H01L23/46 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

摘要： A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.

摘要翻译： 多芯片模块（MCM）结构包括位于水平面中的多于一个的半导体芯片，MCM在芯片上具有单独的芯片接触贴片，并且柔性散热器具有侧向顺应性并且在MCM中的平面中延伸并固定在 通过接触片与芯片的热交换关系。 MCM具有散热器的热膨胀系数与MCM之间的不匹配，并且还具有芯片倾斜和芯片高度失配。 具有横向顺从性的柔性散热器通过允许相对于MCM的散热器的水平膨胀和收缩，最小化或消除了在散热器和芯片接触片之间的界面处在水平方向上产生的剪切应力和剪切应变，而不移动 单个芯片接触片在水平方向。