利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

232 条记录 (耗时 0.038 秒)

    System and method for standby mode cooling of a liquid-cooled electronics rack
    31.
    发明授权
    System and method for standby mode cooling of a liquid-cooled electronics rack 失效
    液冷电子机架待机模式冷却的系统和方法

    公开(公告)号：US07907406B1

    公开(公告)日：2011-03-15

    申请号：US12567954

    申请日：2009-09-28

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/2079 ,  H05K7/202 ,  H05K7/20609

    摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

    摘要翻译： 提供了系统和方法来冷却电子机架。 模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。 来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。 该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。 控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。 在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。

    Light source for illuminating an electronics rack to facilitate servicing thereof
    32.
    发明授权
    Light source for illuminating an electronics rack to facilitate servicing thereof 有权
    用于照亮电子机架以便于维修的光源

    公开(公告)号：US07837352B2

    公开(公告)日：2010-11-23

    申请号：US11954272

    申请日：2007-12-12

    申请人： David P. Graybill ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber

    发明人： David P. Graybill ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber

    IPC分类号： F21S4/00

    CPC分类号： H05K7/1488 ,  F21K9/00 ,  F21S4/20 ,  F21V21/30

    摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.

    摘要翻译： 提供了一种便于维护电子机架的装置。 该装置包括一个包括多个发光二极管的光源。 多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架 。 还提供用于选择性地向多个发光二极管供电的电源。 在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到 用于调节发光二极管的照明方向的基板。

    APPARATUS AND METHOD FOR PROVIDING IN SITU COOLING OF COMPUTER DATA CENTERS DURING SERVICE CALLS
    34.
    发明申请
    APPARATUS AND METHOD FOR PROVIDING IN SITU COOLING OF COMPUTER DATA CENTERS DURING SERVICE CALLS 失效
    计算机数据中心在服务呼叫期间提供现场冷却的装置和方法

    公开(公告)号：US20100147490A1

    公开(公告)日：2010-06-17

    申请号：US12332656

    申请日：2008-12-11

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： F28F7/00

    CPC分类号： H05K7/20736 ,  H05K7/2079

    摘要： An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, comprises a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.

    摘要翻译： 提供一种用于在执行维护操作时冷却容纳在计算机机架中的电子部件的装置和方法。 在一个实施例中，该装置包括设置在计算机机架的出口门盖内的热交换组件，其具有一个或多个穿孔。 当门打开时，一个或多个空气移动装置也设置在出口门上并由致动器启动，使得装置在被激活时迫使热空气进入热交换器。 冷空气然后通过具有多个边缘的平面容纳板排出。 板沿其一个边缘固定在出口门的顶部。

    COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED
    36.
    发明申请
    COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED 审中-公开
    冷却装置和冷却电子模块，具有密封的冷却回路管状结构，密封到要冷却的表面的外围

    公开(公告)号：US20080278913A1

    公开(公告)日：2008-11-13

    申请号：US12178033

    申请日：2008-07-23

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： F28C3/08 ,  F28F7/00 ,  H01L23/4735 ,  H01L2224/73253 ,  Y10S165/908

    摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

    摘要翻译： 使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。 冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。 由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。 返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面 其中基面被密封到待冷却的表面。

    Hybrid cooling system for a multi-component electronics system
    37.
    发明授权
    Hybrid cooling system for a multi-component electronics system 有权
    用于多组件电子系统的混合冷却系统

    公开(公告)号：US07405936B1

    公开(公告)日：2008-07-29

    申请号：US12055455

    申请日：2008-03-26

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

    摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

    摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

    Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
    40.
    发明授权
    Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths 有权
    在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置

    公开(公告)号：US07274566B2

    公开(公告)日：2007-09-25

    申请号：US11008732

    申请日：2004-12-09

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F04B17/00

    CPC分类号： H05K7/2079

    摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

    摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。