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    Light source for illuminating an electronics rack to facilitate servicing thereof
    1.
    发明授权
    Light source for illuminating an electronics rack to facilitate servicing thereof 有权
    用于照亮电子机架以便于维修的光源

    公开(公告)号：US07837352B2

    公开(公告)日：2010-11-23

    申请号：US11954272

    申请日：2007-12-12

    申请人： David P. Graybill ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber

    发明人： David P. Graybill ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber

    IPC分类号： F21S4/00

    CPC分类号： H05K7/1488 ,  F21K9/00 ,  F21S4/20 ,  F21V21/30

    摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.

    摘要翻译： 提供了一种便于维护电子机架的装置。 该装置包括一个包括多个发光二极管的光源。 多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架 。 还提供用于选择性地向多个发光二极管供电的电源。 在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到 用于调节发光二极管的照明方向的基板。

    Apparatus and method for facilitating air cooling of an electronics rack
    2.
    发明授权
    Apparatus and method for facilitating air cooling of an electronics rack 有权
    用于促进电子机架的空气冷却的装置和方法

    公开(公告)号：US09480186B2

    公开(公告)日：2016-10-25

    申请号：US11958528

    申请日：2007-12-18

    申请人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

    发明人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

    IPC分类号： H05K5/00 ,  H05K7/20

    CPC分类号： H05K7/20745 ,  H05K7/20736

    摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.

    摘要翻译： 提供了用于促进电子机架的空气冷却的装置和方法。 该装置包括瓦片组件，温度传感器和控制器。 瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。 温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。 基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。 在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

    Airflow recirculation and cooling apparatus and method for an electronics rack
    4.
    发明授权
    Airflow recirculation and cooling apparatus and method for an electronics rack 有权
    用于电子机架的气流再循环和冷却装置及方法

    公开(公告)号：US08164897B2

    公开(公告)日：2012-04-24

    申请号：US12708792

    申请日：2010-02-19

    申请人： David P. Graybill ,  Madhusudan K Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt

    发明人： David P. Graybill ,  Madhusudan K Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20745 ,  H05K7/20836

    摘要： An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

    摘要翻译： 提供了一种便于冷却数据中心的电子机架的装置。 该装置包括：气流导向器，其安装到电子机架，以将从电子机架排出的气流重新定向到机架的空气入口侧的气流返回路径; 设置在所述气流返回路径内的空气对液体热交换器，用于在退出到所述齿条的空气入口侧附近的数据中心之前冷却重新导向的气流; 用于监测重定向气流的空气温度的空气温度传感器; 以及与气流导向器相关联的自动隔离门，用于根据重定向气流的温度自动阻止从电子机架的空气出口侧排出的气流通过气流返回通道返回到机架的进气侧， 温度阈值。

    Method and system for automated energy usage monitoring within a data center
    5.
    发明授权
    Method and system for automated energy usage monitoring within a data center 有权
    数据中心内自动化能源使用监控的方法和系统

    公开(公告)号：US07653499B2

    公开(公告)日：2010-01-26

    申请号：US11956405

    申请日：2007-12-14

    申请人： Ronald P. Corrado ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Gerard V. Weber

    发明人： Ronald P. Corrado ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Gerard V. Weber

    IPC分类号： G01R21/00

    CPC分类号： G06Q10/06 ,  G01R22/00 ,  G06Q50/00 ,  G06Q50/06 ,  Y02P90/82

    摘要： An automated method and system are provided for facilitating monitoring of energy usage within a data center. The method includes automatically determining energy usage of one or more electronics racks of a data center by automatically ascertaining time-based energy usage of the electronics racks. The automatically ascertaining includes obtaining multiple measurements of instantaneous energy usage by each of the electronics racks in the data center over a period of time, and then separately averaging the multiple measurements for each electronics rack to obtain the time-based energy usage of each electronics racks. The method also includes outputting the time-based energy usage of the electronic(s) racks to facilitate monitoring of the data center.

    摘要翻译： 提供了一种自动化方法和系统，用于便于监视数据中心内的能量使用。 该方法包括通过自动确定电子机架的基于时间的能量使用来自动确定数据中心的一个或多个电子机架的能量使用。 自动确定包括在一段时间内获得数据中心中每个电子机架的瞬时能量使用的多个测量值，然后分别平均每个电子机架的多个测量值，以获得每个电子机架的基于时间的能量使用 。 该方法还包括输出电子机架的基于时间的能量使用以便于监视数据中心。

    APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S)
    6.
    发明申请
    APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 审中-公开
    通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法

    公开(公告)号：US20110056675A1

    公开(公告)日：2011-03-10

    申请号：US12556040

    申请日：2009-09-09

    申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, JR.

    发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, JR.

    IPC分类号： G05D23/00 ,  F28F13/00

    CPC分类号： H05K7/20709 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20736 ,  H05K7/20763 ,  H05K7/2079

    摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.

    摘要翻译： 提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。 流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。 与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。 这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。 在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

    Stress relieved hose routing to liquid-cooled electronics rack door
    8.
    发明授权
    Stress relieved hose routing to liquid-cooled electronics rack door 失效
    减轻软管布置到液冷电子机柜门

    公开(公告)号：US08077462B2

    公开(公告)日：2011-12-13

    申请号：US12552479

    申请日：2009-09-02

    申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

    发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

    摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.

    摘要翻译： 提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。 增压室与热交换器流体连通，分别包括入口和出口。 冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。 软管足够长且灵活以打开或关闭门。 应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
    9.
    发明授权
    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
    将电子卡耦合到冷却剂冷却结构的热转印结构

    公开(公告)号：US08913384B2

    公开(公告)日：2014-12-16

    申请号：US13527947

    申请日：2012-06-20

    申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

    摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

    摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。