Abstract:
Disclosed is a card connector, which includes an insulative body, a plurality of the conductive terminals, a metal shell and a supporting plate. The insulative body has a main body in which a plurality of terminal slots is defined. The conductive terminals are respectively received in the terminal slot. The metal shell covers the insulative body and defines a receiving space therebetween. The supporting plate is movably disposed in the receiving space. The supporting plate has a swingable connecting portion. The front substrate can swing up and down relative to the rear substrate through the design of the supporting plate and the swingable connecting portion, so that the electronic card can be easily inserted into and ejected from the card connector without being damaged, thereby prolong the service life of the electronic card.
Abstract:
Phase shifting allows generating very narrow features in a printed features layer. Thus, forming a fabrication layout for a physical design layout having critical features typically includes providing a layout for shifters. Specifically, pairs of shifters can be placed to define critical features, wherein the pairs of shifters conform to predetermined design rules. After placement, phase information for the shifters associated with the set of critical features can be assigned. Complex designs can lead to phase-shift conflicts among shifters in the fabrication layout. An irresolvable conflict can be passed to the design process earlier than in a conventional processes, thereby saving valuable time in the fabrication process for printed circuits.
Abstract:
A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.
Abstract:
A card connector includes an insulating housing defining a receiving room for receiving a card, a plurality of electrical terminals disposed in the insulating housing and each having a contact portion stretching into the receiving room for electrically contacting a corresponding contact trace of the card, and a monitoring member having a base plate disposed in the insulating housing, a monitoring arm extending along the insertion direction of the card, and a connecting arm connecting the monitoring arm to the base plate. The connecting arm is inclined upward to make the monitoring arm stretched into the receiving room. Both the monitoring arm and the contact portion of one corresponding electrical terminal are aligned with each other along the insertion direction of the card for electrically contacting one same contact trace of the card so as to monitor whether the card is fully inserted in the card connector or not.
Abstract:
An audio jack connector adapted for mating with a plug connector which has an insulating loop thereon includes a dielectric housing, a plurality of signal terminals, and a set of switch terminals. The dielectric housing defines an inserting hole therethrough. The signal terminals are received in the dielectric housing. The set of switch terminals include a first switch terminal and a second switch terminal disposed in the dielectric housing. The second switch terminal has a contact portion extending into the inserting hole. When the plug connector is fully inserted into the inserting hole, the signal terminals are electrically connected with the plug connector, and the contact portion of the second switch terminal is against and pushed outwardly by the insulating loop of the plug connector to make the second switch terminal electrically connected with the first switch terminal.
Abstract:
A SIM card connector includes an insulating body and a plurality of electric terminals. The insulating body has accepting holes and accepting cavities. The electric terminal has a welded slice, a contact and a fixing portion. The welded slice and the contact are accepted in the accepting hole, the contact projects from the accepting hole. A lump is formed in one side of the fixing portion, the fixing portion accepted in the accepting cavities. While the SIM card connector passes through a SMT apparatus, the insulated body is soften and the lump is against the side wall of the accepting cavities for preventing the holding portion out of the insulated body. Therefore, the SIM card connector is welded firmly in the PCB of a mobile.
Abstract:
A semiconductor layout testing and correction system is disclosed. The system combines both rule-based optical proximity correction and model-based optical proximity correction in order to test and correct semiconductor layouts. In a first embodiment, a semiconductor layout is first processed by a rule-based optical proximity correction system and then subsequently processed by a model-based optical proximity correction system. In another embodiment, the system first processes a semiconductor layout with a rule-based optical proximity correction system and then selectively processes difficult features using a model-based optical proximity correction system. In yet another embodiment, the system selectively processes the various features of a semiconductor layout using a rule-based optical proximity correction system or a model-based optical proximity correction system.
Abstract:
A method for manufacturing integrated circuits using opaque field, phase shift masking. One embodiment of the invention includes using a two mask process. The first mask is an opaque-field phase shift mask and the second mask is a single phase structure mask. A phase shift window is aligned with the opaque field using a phase shift overlap area on the opaque field. The phase shift mask primarily defines regions requiring phase shifting. The single phase structure mask primarily defines regions not requiring phase shifting. The single phase structure mask also prevents the erasure of the phase shifting regions and prevents the creation of undesirable artifact regions that would otherwise be created by the phase shift mask.