公开(公告)号：US20070052068A1

公开(公告)日：2007-03-08

申请号：US11511306

申请日：2006-08-29

申请人： Koji Takemura ,  Hiroshige Hirano ,  Masao Takahashi ,  Hikari Sano ,  Yutaka Itoh ,  Koji Koike

发明人： Koji Takemura ,  Hiroshige Hirano ,  Masao Takahashi ,  Hikari Sano ,  Yutaka Itoh ,  Koji Koike

IPC分类号： H01L23/58

CPC分类号： H01L24/05 ,  H01L22/32 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor substrate; a first interlayer insulating film formed over the semiconductor substrate; a pad formed above the first interlayer insulating film; and a plurality of first interconnects spaced apart from each other in a portion of the first interlayer insulating film located below the pad. Below the pad, the first interconnects are formed in quadrangular plan shapes.

摘要翻译： 半导体器件包括：半导体衬底; 形成在半导体衬底上的第一层间绝缘膜; 形成在第一层间绝缘膜上方的焊盘; 以及在位于所述垫下方的所述第一层间绝缘膜的部分中彼此间隔开的多个第一互连。 在焊盘下面，第一互连以四边形的平面形状形成。

公开(公告)号：US20060158501A1

公开(公告)日：2006-07-20

申请号：US11332174

申请日：2006-01-17

申请人： Yutaka Itoh

发明人： Yutaka Itoh

IPC分类号： B41J2/01

CPC分类号： B41J3/60 ,  B41J11/425

摘要： A duplex printing apparatus includes a conveying device that conveys the printing sheet at a prescribed average line speed, a comparison device that compares skip suppression information with a prescribed threshold, and a speed changing device that decreases the prescribed average line speed in accordance with a comparison result of the comparison device.

摘要翻译： 双面打印装置包括以预定的平均线速度传送打印纸的输送装置，将跳过抑制信息与规定的阈值进行比较的比较装置，以及根据比较降低规定的平均线速度的变速装置 比较装置的结果。

公开(公告)号：US08810039B2

公开(公告)日：2014-08-19

申请号：US13323454

申请日：2011-12-12

申请人： Koji Takemura ,  Hiroshige Hirano ,  Masao Takahashi ,  Hikari Sano ,  Yutaka Itoh ,  Koji Koike

发明人： Koji Takemura ,  Hiroshige Hirano ,  Masao Takahashi ,  Hikari Sano ,  Yutaka Itoh ,  Koji Koike

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L24/05 ,  H01L22/32 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor substrate; a first interlayer insulating film formed over the semiconductor substrate; a pad formed above the first interlayer insulating film; and a plurality of first interconnects spaced apart from each other in a portion of the first interlayer insulating film located below the pad. Below the pad, the first interconnects are formed in quadrangular plan shapes.

摘要翻译： 半导体器件包括：半导体衬底; 形成在半导体衬底上的第一层间绝缘膜; 形成在第一层间绝缘膜上方的焊盘; 以及在位于所述垫下方的所述第一层间绝缘膜的部分中彼此间隔开的多个第一互连。 在焊盘下面，第一互连以四边形的平面形状形成。

公开(公告)号：US08113644B2

公开(公告)日：2012-02-14

申请号：US12236876

申请日：2008-09-24

申请人： Kazuya Tashiro ,  Yutaka Itoh

发明人： Kazuya Tashiro ,  Yutaka Itoh

IPC分类号： B65H7/14

CPC分类号： G03G15/5095 ,  B41J11/003 ,  B41J11/007 ,  B41J11/008 ,  B41J11/009

摘要： A sensor reciprocates in a main scanning direction to detect lateral end portions of a sheet conveyed in a sub-scanning direction. A print head is mounted on a carriage reciprocating in the main scanning direction. A sheet-information acquiring unit acquires sheet information including a type and a size of the sheet. A positional-information storing unit stores positional information on lateral positions of the sheet on the conveying belt, corresponding to the size of the sheet. A control unit controls, when the type of the sheet is a pattern-printed sheet, a printing by the print head based on the positional information corresponding to the size of the sheet.

摘要翻译： 传感器在主扫描方向上往复运动，以检测在副扫描方向上传送的纸张的侧端部。 打印头安装在沿主扫描方向往复运动的托架上。 纸张信息获取单元获取包括纸张的类型和尺寸的纸张信息。 位置信息存储单元根据纸张的尺寸存储关于纸张在输送带上的横向位置的位置信息。 当纸张的类型是图案印刷的纸张时，控制单元基于与纸张的尺寸对应的位置信息来控制打印头的打印。

公开(公告)号：US20110095430A1

公开(公告)日：2011-04-28

申请号：US12984142

申请日：2011-01-04

申请人： Koji TAKEMURA ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

发明人： Koji TAKEMURA ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

IPC分类号： H01L23/485

CPC分类号： H01L23/585 ,  H01L21/76832 ,  H01L23/522 ,  H01L23/53295 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.

摘要翻译： 一种半导体器件包括在半导体衬底上的层间绝缘膜中堆叠的至少三个或更多个布线层，设置在半导体衬底的芯片区域的外周处的密封环和在芯片区域的一部分中提供的芯片强度增强 靠近密封圈。 芯片强度加强件由多个虚拟布线结构构成，并且多个虚设布线结构中的每一个形成为跨越两个或更多个布线层中的两个或更多个布线层，包括最下面的布线层和最上面的布线层 使用通孔部分。

公开(公告)号：US07458674B2

公开(公告)日：2008-12-02

申请号：US11332174

申请日：2006-01-17

申请人： Yutaka Itoh

发明人： Yutaka Itoh

IPC分类号： B41J2/01 ,  B41J29/38 ,  B41J29/393

CPC分类号： B41J3/60 ,  B41J11/425

摘要： A duplex printing apparatus includes a conveying device that conveys the printing sheet at a prescribed average line speed, a comparison device that compares skip suppression information with a prescribed threshold, and a speed changing device that decreases the prescribed average line speed in accordance with a comparison result of the comparison device.

摘要翻译： 双面打印装置包括以预定的平均线速度传送打印纸的输送装置，将跳过抑制信息与规定的阈值进行比较的比较装置，以及根据比较降低规定的平均线速度的变速装置 比较装置的结果。

公开(公告)号：US20080232832A1

公开(公告)日：2008-09-25

申请号：US12035897

申请日：2008-02-22

申请人： Yutaka Itoh ,  Kazuya Tashiro

发明人： Yutaka Itoh ,  Kazuya Tashiro

IPC分类号： G03G21/00

CPC分类号： G03G15/161 ,  G03G15/55

摘要： An image forming apparatus includes a transport belt, a carriage, a reflection sensor, and a control unit. The transport belt transports a recording sheet in a sub-scanning direction. The carriage, mounting a recording head, reciprocally moves in a main scanning direction to record an image on the recording sheet. The reflection sensor, mounted on the carriage, receives light reflected from the transport belt to detect a leading edge of the recording sheet, and outputs a detection signal corresponding to the received light. The control unit controls a contamination check process. The control unit instructs the carriage to move to a given position over the transport belt and to drive the transport belt for one rotation while maintaining the carriage at the given position. The control unit determines whether contamination exists on the transport belt based on the detection signal output from the reflection sensor.

摘要翻译： 图像形成装置包括传送带，托架，反射传感器和控制单元。 传送带沿副扫描方向传送记录纸。 安装记录头的托架在主扫描方向上往复运动，以将图像记录在记录纸上。 安装在托架上的反射传感器接收从传送带反射的光以检测记录纸的前缘，并输出与接收到的光对应的检测信号。 控制单元控制污染检查过程。 控制单元指示滑架移动到传送带上方的给定位置，并将传送带驱动一圈，同时将滑架保持在给定位置。 控制单元基于从反射传感器输出的检测信号确定传送带上是否存在污染物。

公开(公告)号：US20070209573A1

公开(公告)日：2007-09-13

申请号：US11712841

申请日：2007-03-01

申请人： Kazuhiko Kusunoki ,  Kazuhito Kamei ,  Nobuyoshi Yashiro ,  Akihiro Yauchi ,  Yoshihisa Ueda ,  Yutaka Itoh ,  Nobuhiro Okada

发明人： Kazuhiko Kusunoki ,  Kazuhito Kamei ,  Nobuyoshi Yashiro ,  Akihiro Yauchi ,  Yoshihisa Ueda ,  Yutaka Itoh ,  Nobuhiro Okada

IPC分类号： C30B15/00 ,  C30B19/00

CPC分类号： C30B9/06 ,  C30B9/10 ,  C30B15/305 ,  C30B17/00 ,  C30B19/02 ,  C30B19/04 ,  C30B29/36 ,  Y10T117/10 ,  Y10T117/1004 ,  Y10T117/1008 ,  Y10T117/1016 ,  Y10T117/1072

摘要： A SiC single crystal is produced by the solution growth method in which a seed crystal attached to a seed shaft is immersed in a solution of SiC dissolved in a melt of Si or a Si alloy and a SiC single crystal is allowed to grow on the seed crystal by gradually cooling the solution or by providing a temperature gradient therein. To this method, accelerated rotation of a crucible is applied by repeatedly accelerating to a prescribed rotational speed and holding at that speed and decelerating to a lower rotational speed or a 0 rotational speed. The rotational direction of the crucible may be reversed each acceleration. The seed shaft may also be rotated synchronously with the rotation of the crucible in the same or opposite rotational as the crucible. A large, good quality single crystal having no inclusions are produced with a high crystal growth rate.

摘要翻译： 通过溶液生长法生产SiC单晶，其中将种子轴附着的晶种浸入溶解在Si或Si合金熔体中的SiC溶液中，使SiC单晶在种子上生长 通过逐渐冷却溶液或通过在其中提供温度梯度来制备。 对于这种方法，通过反复加速到规定的转速并以该速度保持并且减速到较低的转速或0转速来施加坩埚的加速旋转。 坩埚的旋转方向可以反转每个加速度。 种子轴也可以与坩埚的旋转同步旋转，与坩埚相同或相反。 以高的晶体生长速率生产不含夹杂物的大质量好的单晶。

公开(公告)号：US4378384A

公开(公告)日：1983-03-29

申请号：US297565

申请日：1981-08-31

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  C23C3/02

CPC分类号： H05K3/381 ,  H05K3/387 ,  H05K2203/0793 ,  H05K2203/122 ,  H05K3/181 ,  H05K3/184 ,  H05K3/426

摘要： A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的整个暴露表面上形成镀膜形成粘合剂层，使所述粘合剂层表面粗糙化，在所述粘合剂层表面上从催化剂溶液沉积无电镀铜催化剂， 掩蔽除了形成电路的部分之外的如此处理的绝缘板表面，然后在板的催化剂上进行无电镀铜以在其上形成电路，其中改进包括用碱性处理粗糙化的粘合剂层表面 在将催化剂沉积在其上并在进行化学镀铜之前用含有表面活性剂的水溶液处理掩蔽的绝缘板。 上述方法确保了铜的铜利用率和电镀铜的较大的粘合强度。

公开(公告)号：US4346206A

公开(公告)日：1982-08-24

申请号：US176740

申请日：1980-08-11

申请人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

发明人： Akio Takahashi ,  Yutaka Itoh ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita ,  Yutaka Mizuno ,  Shunya Yokozawa ,  Kenji Tsukanishi

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G73/00 ,  C08G73/12 ,  C08G79/08 ,  C08L63/00 ,  H05K1/03 ,  C08G73/10

CPC分类号： C08G79/08 ,  C08G59/4042 ,  C08G73/121 ,  C08L63/00 ,  H05K1/0346

摘要： A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

摘要翻译： 一种制备热固性酰亚胺型预聚物的方法，其包括在沸点为70〜170℃的有机溶剂的存在下加热双酰亚胺（A）和二胺（B），并将反应混合物加热 与环氧化合物（C）。 根据本发明方法制备的酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。 因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。