公开(公告)号：US08310132B2

公开(公告)日：2012-11-13

申请号：US12922966

申请日：2009-03-17

Applicant: Yves Martin ,  Mathieu Pernot

Inventor： Yves Martin ,  Mathieu Pernot

IPC: F25D31/00

CPC classification number: G10K11/004

Abstract: The invention relates to an insonification device (100) comprising a plurality of elementary ultrasonic transducers (110) each comprising at least one electro-acoustic element (111) and distributed on a chassis (120, 140) so that the electro-acoustic elements (111) are distributed on a so-called front surface (120′) of the device (100) intended to be placed facing the medium to be insonified. According to the invention, as each transducer (110) comprises a longitudinal body (113) made in a heat conducting material at the so-called front end of which the electro-acoustic element (111) is placed, the chassis (120, 140) comprises a sealed cooling chamber (130) placed behind the front surface (120′), crossed by the bodies of the transducers (113) and intended to be gone through by a coolant fluid flow.

Abstract translation: 本发明涉及一种包括多个基本超声换能器（110）的增音装置（100），每个基本超声波换能器包括至少一个电声元件（111）并分布在底架（120,140）上，使得电声元件 111）分布在设备（100）的所谓的正面（120'）上，用于面向要被增强的介质放置。 根据本发明，由于每个换能器（110）包括在导电材料制成的纵向本体（113），所述导体材料位于所述电声元件（111）的所谓前端，所述底架（120,140） ）包括放置在前表面（120'）后面的密封冷却室（130），其通过换能器（113）的主体穿过并且旨在通过冷却剂流体流动。

公开(公告)号：US20120075734A1

公开(公告)日：2012-03-29

申请号：US12890173

申请日：2010-09-24

Applicant: Yves Martin ,  Robert L. Sandstrom ,  Theodore G. van Kessel

Inventor： Yves Martin ,  Robert L. Sandstrom ,  Theodore G. van Kessel

IPC: G02B5/10 ,  G02B5/08 ,  B05D5/10

CPC classification number: G02B5/0808 ,  F24S23/71 ,  F24S23/74 ,  F24S23/82 ,  F24S2025/601 ,  F24S2080/015 ,  F24S2080/016 ,  Y02E10/42 ,  Y02E10/45

Abstract: A mirror is provided and includes a first layer including reflective material and an adhesive backing, a second layer including one or more layers of a cloth or a non woven fiber matrix and polymer composite and a third layer including polystyrene foam spheres in a polymer matrix.

Abstract translation: 提供了一种镜子，包括包括反射材料和粘合剂背衬的第一层，包括一层或多层布或非编织纤维基质和聚合物复合物的第二层和在聚合物基质中包括聚苯乙烯泡沫球的第三层。

公开(公告)号：US08053284B2

公开(公告)日：2011-11-08

申请号：US12540481

申请日：2009-08-13

Applicant: Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

Inventor： Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

IPC: H01L21/00

CPC classification number: H01L23/433 ,  H01L23/10 ,  H01L23/367 ,  H01L24/32 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/83385 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/3511 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/8381

Abstract: A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract translation: 一种组装弯曲电路芯片封装的方法和具有弯曲结构的电路芯片封装。 电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

公开(公告)号：US08012309B2

公开(公告)日：2011-09-06

申请号：US12551247

申请日：2009-08-31

Applicant: Éric Paré ,  Yves Martin ,  Matieu Jacques

Inventor： Éric Paré ,  Yves Martin ,  Matieu Jacques

IPC: D21H27/30 ,  B31F1/07 ,  D21F11/00

CPC classification number: B31F1/07 ,  B31F2201/0733 ,  B31F2201/0738 ,  B31F2201/0756 ,  D21F11/006 ,  D21H27/002 ,  D21H27/02 ,  D21H27/30 ,  Y10T156/1039

Abstract: A process for manufacturing an embossed paperboard comprising the steps of: forming a wet mat including more than 60 wt % of cellulose fibers; pressure molding, with at least one embossing roll, the wet mat having 20 to 70 wt % solid to create a nested surface texture thereon; and drying the embossed wet mat to obtain the embossed paperboard with a grammage ranging between 125 and 1500 grams per square meter.

Abstract translation: 一种用于制造压纹纸板的方法，包括以下步骤：形成包含大于60重量％的纤维素纤维的湿垫; 加压成型，使用至少一个压花辊，湿垫具有20至70重量％的固体以在其上产生嵌套表面纹理; 并干燥压花湿垫以获得压纹纸板，其克重范围在125至1500克/平方米之间。

公开(公告)号：US20110037167A1

公开(公告)日：2011-02-17

申请号：US12540481

申请日：2009-08-13

Applicant: Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

Inventor： Sushumna Iruvanti ,  Yves Martin ,  Theodore van Kessel ,  Xiaojin Wei

IPC: H01L23/36 ,  H01L21/58

CPC classification number: H01L23/433 ,  H01L23/10 ,  H01L23/367 ,  H01L24/32 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/83385 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/3511 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/8381

Abstract: A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract translation: 一种组装弯曲电路芯片封装的方法和具有弯曲结构的电路芯片封装。 电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

公开(公告)号：US20090203536A1

公开(公告)日：2009-08-13

申请号：US12308054

申请日：2007-06-06

Applicant: Patrick Vermette ,  Yves Martin ,  Emmanuelle Monchaux

Inventor： Patrick Vermette ,  Yves Martin ,  Emmanuelle Monchaux

IPC: C40B30/04 ,  C12Q1/02 ,  C12N11/08 ,  C12N5/02 ,  C12N5/00 ,  C12N11/02 ,  C40B40/04

CPC classification number: G01N33/54386 ,  C12N11/00 ,  G01N33/5008 ,  G01N33/54393

Abstract: Assay supports, such as microarrays and similar devices, and methods of use and manufacture thereof, are described. The assay support is capable of assaying binding and/or activity of a bioactive entity, such as a bioactive molecule or a cell. Analytical and diagnostic uses of the supports are also described.

Abstract translation: 描述了诸如微阵列和类似装置的分析支持及其使用和制造方法。 测定支持物能够测定生物活性实体如生物活性分子或细胞的结合和/或活性。 还描述了支撑体的分析和诊断用途。

公开(公告)号：US20080258068A1

公开(公告)日：2008-10-23

申请号：US12165500

申请日：2008-06-30

Applicant: Hendrik F. Hamann ,  Yves Martin ,  Theodore G. van Kessel ,  Hemantha K. Wickramasinghe

Inventor： Hendrik F. Hamann ,  Yves Martin ,  Theodore G. van Kessel ,  Hemantha K. Wickramasinghe

IPC: H01J37/06 ,  H01J35/02 ,  G01T1/24

CPC classification number: H01J35/08 ,  G21K7/00 ,  H01J2235/083 ,  H01J2235/086

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract translation: 用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。

公开(公告)号：US20080214964A1

公开(公告)日：2008-09-04

申请号：US11817277

申请日：2006-03-15

Applicant: Jean-Yves Chapelon ,  Laura Curiel ,  Yves Martin ,  Olivier Nallet

Inventor： Jean-Yves Chapelon ,  Laura Curiel ,  Yves Martin ,  Olivier Nallet

IPC: A61N7/00

CPC classification number: A61N7/022 ,  A61B2090/3784

Abstract: A therapeutic endocavity probe for treating tissues in particular of the prostate by emission of focused ultrasonic waves, including a support forming a guide tube extended by a mounting head for at least one therapy transducer component with an active surface emitting focused ultrasonic waves and having a spherical front of a total surface area in which a surface window is laid out for mounting an imaging transducer. According to the invention, the therapy transducer component has a front face having a total surface area equal to the sum of the active surface area equal to 1,500 mm2 ±200 mm2, and of the surface area of the window for letting through the imaging transducer, the ratio of the surface area of the window over the active surface area of the therapy transducer component being less than or equal to 0.45.

Abstract translation: 一种用于通过发射聚焦的超声波来治疗特定前列腺的组织的治疗性内腔探针，包括形成由用于至少一个治疗换能器组件的安装头延伸的导管的支撑件，其具有发射聚焦超声波的有源表面并具有球形 其中布置有用于安装成像换​​能器的表面窗的总表面积的前方。 根据本发明，治疗传感器部件具有正面，总面积等于等于1500mm 2±200mm 2 / 以及用于穿过成像换能器的窗口的表面积，窗口在治疗换能器组件的有效表面积上的表面积的比率小于或等于0.45。

公开(公告)号：US20060157898A1

公开(公告)日：2006-07-20

申请号：US11037890

申请日：2005-01-18

Applicant: Matthew Colburn ,  Yves Martin ,  Charles Rettner ,  Theodore van Kessel ,  Hematha Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Charles Rettner ,  Theodore van Kessel ,  Hematha Wickramasinghe

IPC: B29C35/08

CPC classification number: G03F7/0002 ,  B01D2239/045 ,  B82Y10/00 ,  B82Y40/00 ,  G03F9/7011 ,  G03F9/7019

Abstract: A method (and resultant structure) of forming a plurality of masks, includes creating a reference template, using imprint lithography to print at least one reference template alignment mark on all of a plurality of mask blanks for a given chip set, and printing sub-patterns on each of the plurality of mask blanks, and aligning the sub-patterns to the at least one reference template alignment mark.

Abstract translation: 一种形成多个掩模的方法（和结果）包括使用压印光刻法创建参考模板以在给定芯片组的所有多个掩模坯料上打印至少一个参考模板对准标记， 所述多个掩模坯料中的每一个上的图案，以及将所述子图案对准所述至少一个参考模板对准标记。

公开(公告)号：US20060110890A1

公开(公告)日：2006-05-25

申请号：US10992072

申请日：2004-11-19

Applicant: Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha K. Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha K. Wickramasinghe

IPC: H01L21/76

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

Abstract: A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.

Abstract translation: 在结构上复制图案的方法（和装置）包括使用压印光刻将形成在第一结构上的图案复制到第二结构的一部分上。