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公开(公告)号：US20240312706A1
公开(公告)日：2024-09-19
申请号：US18530856
申请日：2023-12-06
发明人： Beomjoon Cho
CPC分类号： H01G2/065 , H01G4/012 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayered capacitor including a capacitor body and an external electrode disposed on one surface of the capacitor body, a frame terminal mounting the multilayered capacitor on a board, and a conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion including a second material, and a coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the conductive bonding portion.
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公开(公告)号：US20240310608A1
公开(公告)日：2024-09-19
申请号：US18671377
申请日：2024-05-22
发明人： Ho Sik YOO , Dong Shin YANG , Yong Joo JO , Sot Eum SEO
CPC分类号： G02B13/0045 , G02B9/64
摘要： An optical imaging system includes: a first lens having a concave image-side surface; a second lens having refractive power; a third lens having a concave image-side surface; a fourth lens having a concave object-side surface or a convex image-side surface; a fifth lens having refractive power; a sixth lens having a concave image-side surface; and a seventh lens having negative refractive power. The first to seventh lenses are sequentially disposed from an object side and 1.62
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公开(公告)号：US20240306292A1
公开(公告)日：2024-09-12
申请号：US18388302
申请日：2023-11-09
发明人： Kyehwan Lee
CPC分类号： H05K1/0306 , H05K1/056 , H05K1/111 , H05K3/244 , H05K3/287
摘要： A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
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公开(公告)号：US20240304391A1
公开(公告)日：2024-09-12
申请号：US18235065
申请日：2023-08-17
发明人： Myungwoo Lee , Haesol Jung , Wonsik Jeong , Sungsoo Choi , Won Woo Lee , Gunhwan Ryu
IPC分类号： H01G4/30 , C04B35/468 , C04B35/64 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , C04B35/4682 , C04B35/64 , H01G4/012 , H01G4/1227
摘要： A multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, the dielectric crystal grains include Bax(Ti1-yZry)O3 as a main component and satisfy 0
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公开(公告)号：US20240304385A1
公开(公告)日：2024-09-12
申请号：US18224670
申请日：2023-07-21
发明人： Sin Il GU , Jin Hyung LIM
摘要： A multilayer electronic component includes a body including first and second surfaces facing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and including a capacitance forming portion including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a lower cover portion disposed between the first surface and the capacitance forming portion, and an upper cover portion disposed between the second surface and the capacitance forming portion, a first external electrode disposed on the third surface, and a second external electrode disposed on the fourth surface, wherein, among the upper cover portion and the lower cover portion, only the upper cover portion includes a buffer electrode.
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公开(公告)号：US20240304382A1
公开(公告)日：2024-09-12
申请号：US18376102
申请日：2023-10-03
发明人： Sangyeop Kim , Kihun Jeon , Beomjoon Cho
摘要： An electronic component including: a ceramic main body; first and second external electrodes respectively provided on two opposite end surfaces spaced apart from each other in a longitudinal direction of the ceramic main body; a first metal frame including a first junction part joined to the first external electrode, a first support part extending from the first junction part in the longitudinal direction of the ceramic main body and configured to support the first external electrode, a first base part parallel to the first support part, and a first connection part configured to connect the first support part and the first base part, wherein the first connection part is connected to a point spaced apart from one end of the first support part along the longitudinal direction of the ceramic main body.
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公开(公告)号：US12089337B2
公开(公告)日：2024-09-10
申请号：US17683569
申请日：2022-03-01
发明人： Jun Oh Hwang
CPC分类号： H05K1/183 , H05K1/0298 , H05K1/115 , H05K1/185 , H05K2201/09036
摘要： A circuit board includes a core portion including a first cavity formed in one surface, and a second cavity formed in the other surface opposing the one surface and having a diameter different from a diameter of the first cavity; a first metal layer disposed on the one surface of the core portion; a second metal layer buried in the core portion; and a third metal layer disposed on the other surface of the core portion, wherein each of the first and second cavities of the core portion exposes at least a portion of the second metal layer.
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公开(公告)号：US12087509B2
公开(公告)日：2024-09-10
申请号：US17725246
申请日：2022-04-20
发明人： Gyu Ho Yeon , Won Kuen Oh , Seo Won Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes and external electrodes disposed on one surface of the body, wherein the external electrodes respectively include a first electrode layer connected to the internal electrodes and including copper (Cu); a second electrode layer disposed on the first electrode layer and including silver (Ag) and palladium (Pd); and a copper-palladium intermetallic compound formed at an interface between the first electrode layer and the second electrode layer, wherein the second electrode layer includes a first layer and a second layer formed to be sequentially adjacent to the first electrode layer, and the first layer has a content of palladium higher than a content of palladium of the second layer.
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39.发明公开公开(公告)号：US20240298409A1
公开(公告)日：2024-09-05
申请号：US18386963
申请日：2023-11-03
发明人： Jong-Seok Na , Yunje Ji , Yonghoon Kim , Seungeun Lee
CPC分类号： H05K1/181 , H05K1/185 , H05K3/4007 , H05K3/4697 , H05K3/0017
摘要： The present disclosure provides a circuit board including: an insulating layer; a circuit wire disposed in a first area inside the insulating layer, a first conductive pad connected to the circuit wire and having an upper surface protruding above an upper surface of the insulating layer and a lower surface embedded in the insulating layer; and a circuit element disposed to have a boundary surface parallel to the upper surface of the insulating layer in a second area different from the first area inside the insulating layer and including an element pad.
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公开(公告)号：US20240298407A1
公开(公告)日：2024-09-05
申请号：US18380906
申请日：2023-10-17
发明人： Gyumook Kim , Sanghoon Kim , Young Kuk Ko
CPC分类号： H05K1/145 , H05K1/112 , H05K1/117 , H05K1/144 , H05K3/301 , H05K3/36 , H05K2201/10689 , H05K2201/2009 , H05K2203/304
摘要： A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.
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