摘要:
A multiple positioning assembly includes a housing having a cavity therein with a circumferential groove disposed proximate a cavity opening. A ball assembly including a ball portion forms a spheroidal joint with the cavity which enables conical movement of the ball assembly. A plunger is slidably disposed within a bore through the ball portion of the ball assembly and electrical connections enable lateral movement of the plunger to control power to a light bulb attached to the plunger.
摘要:
A holder for infrared heat source lamps and particularly a holder comprising a block structure having entry sections on both sides separated by a wall. The separating walls provide an entry section oversized and otherwise notched to dissipate heat. A port in each entry section leads to a separate conductive bar positioned on a stair-step surface. The energization protruding wires of the infrared lamps are secured through the ports to the conductive bars. The energization wire power source for the infrared lamps is also connected to the conductive bars. Detailed refinements for positioning the holder in a reflector are disclosed.
摘要:
A power terminal in a mount plate housing provides electrical power to an audiovisual device. A hot wire connected with the power terminal extends from the mount plate housing. The hot wire is configured to connect with a corresponding hot wire of the audiovisual device. A ground wire extending from the mount plate housing is configured to be connected with a corresponding ground wire of the audiovisual device. A first insulation piercing interconnect is connected with the hot wire. The first insulation piercing interconnect is configured to connect the hot wire with the corresponding hot wire of the audiovisual device to allow exchanging the battery mount interface. A second insulation piercing interconnect is connected with the ground wire. The second insulation piercing interconnect is configured to connect the ground wire with the corresponding ground wire of the audiovisual device to allow exchanging the battery mount interface.
摘要:
A combination outlet connector is disclosed. The combination outlet connector includes an outlet core having three T-shaped apertures. The outlet core has a core outer surface to mate with a first connector type, such as a C14 connector, and electrical terminals are positioned in corresponding apertures. A removable adapter sleeve is positionable around the outlet core and has a sleeve outer surface to mate with a second connector type, such as a C20 connector. The adapter sleeve includes a sleeve aperture at least partially congruent with the core outer surface. The electrical terminals are configured to connect with mating terminals of the first and second connector types. A removable adapter shroud can be positioned around the outlet core. The shroud includes a shroud inner surface to receive the first connector type and a shroud flange having a shroud aperture at least partially congruent with the core outer surface.
摘要:
A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.
摘要:
A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.
摘要:
The present invention relates to a hybrid socket for a single-filament or dual-filament bulb consisting of a body made of an insulating material, exhibiting a front cavity for introducing the bulb, of substantially rectangular shape, complementary to the exterior shape of the base. It comprises at least one stopper of complementary cross section to that of the cavity of circular cross section, each traversed by a supply wire crimped onto a metallic contact of a first type, and a third stopper of complementary cross section to that of the cavity of oblong cross section, crimped onto an earth metallic contact. The socket furthermore comprises a locking hook for the bulb. Application: socket for type T20 blinking indicator lights or side lights.
摘要:
A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.