公开(公告)号：US20210118818A1

公开(公告)日：2021-04-22

申请号：US17137262

申请日：2020-12-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron Cadag ,  Lester Joseph Belalo ,  Ela Mia Cadag

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package formed utilizing multiple etching steps includes a lead frame, a die, and a molding compound. The lead frame includes leads and a die pad. The leads and the die pad are formed from a first conductive material by the multiple etching steps. More specifically, the leads and the die pad of the lead frame are formed by at least three etching steps. The at least three etching steps including a first etching step, a second undercut etching step, and a third backside etching step. The second undercut etching step forming interlocking portions at an end of each lead. The end of the lead is encased in the molding compound. This encasement of the end of the lead with the interlocking portion allows the interlocking portion to mechanically interlock with the molding compound to avoid lead pull out. In addition, by utilizing at least three etching steps the leads can be formed to have a height that is greater than the die pad of the lead frame. This differential in height reduces the span of wires used to form electrical connections within the semiconductor package. These reductions in the span of the wires reduces the chances of wire to wire and wire to die short circuiting because the wire sweep of the wires is reduced when the molding compound is placed.

公开(公告)号：US10979805B2

公开(公告)日：2021-04-13

申请号：US16235947

申请日：2018-12-28

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： Mahesh Chowdhary ,  Prasanth Logaraman ,  Arun Kumar ,  Rajendar Bahl

IPC: G10L21/0208 ,  H04R3/00 ,  H04R1/40 ,  H04R3/04 ,  G10L25/78 ,  G10L21/0216 ,  B81B7/00 ,  G01S3/80

Abstract: A method and apparatus for auto-directive adaptive beamforming for a microphone array using microelectromechanical systems (MEMS) sensor orientation information are provided. The microphone array captures audio and the MEMS sensor detects an orientation of the microphone array. A direction of arrival of a source signal is estimated based on the data representative of the audio. A change in an orientation of the microphone array is detected based on the orientation and the direction of arrival is compensates based on the change in the orientation of the microphone array. The apparatus pre-steers a beam of a beam pattern of the microphone array based on the compensated direction of arrival to retain the source signal in a broadside of the microphone array and performs adaptive wideband beamforming to null one or more interfering sources in the beam pattern while retaining the source signal in the broadside of the microphone array.

公开(公告)号：US10976337B2

公开(公告)日：2021-04-13

申请号：US16257694

申请日：2019-01-25

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Mahesh Chowdhary ,  Arun Kumar ,  Ghanapriya Singh ,  Rajendar Bahl

IPC: G01P15/00 ,  G06F1/16 ,  G01P15/18 ,  H04W4/029 ,  G06N20/10 ,  G10L21/10 ,  G06K9/62 ,  H04W4/50 ,  G06F3/0346 ,  G10L25/51 ,  G06F3/01 ,  H04M1/725 ,  G10L25/78 ,  H04W4/38 ,  H04L29/08

Abstract: A distributed computing system for artificial intelligence in autonomously appreciating a circumstance context of a smart device. Raw context data is detected by sensors associated with the smart device. The raw context data is pre-processed by the smart device and then provided to a cloud based server for further processing. At the cloud based server, various sets of feature data are obtained from the pre-processed context data. The various sets of feature data are compared with corresponding classification parameters to determine a classification of a continuous event and/or a classification of transient event, if any, which occur in the context. The determined classification of the continuous event and the transient event will be used to autonomously configure the smart device or another related smart device to fit the context.

公开(公告)号：US10943602B2

公开(公告)日：2021-03-09

申请号：US16696948

申请日：2019-11-26

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： Mahesh Chowdhary ,  Arun Kumar ,  Ghanapriya Singh ,  Rajendar Bahl

IPC: H04R3/00 ,  G10L25/51 ,  G10L25/21 ,  G10L25/24 ,  H04R1/40

Abstract: A method and apparatus for classifying a spatial environment as open or enclosed are provided. In the method and apparatus, one or more microphones detect ambient sound in a spatial environment and output an audio signal representative of the ambient sound. A processor determines a spatial environment impulse response (SEIR) for the audio signal and extracts one or more features of the SEIR. The processor classifies the spatial environment as open or enclosed based on the one or more features of the SEIR.

公开(公告)号：US10917087B2

公开(公告)日：2021-02-09

申请号：US16719053

申请日：2019-12-18

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS, INC ,  STMICROELECTRONICS (ALPS) SAS

Inventor： Vanni Poletto ,  David F. Swanson ,  Giovanni Luca Torrisi ,  Laurent Chevalier

IPC: H03K17/687 ,  G01R19/165 ,  G05B11/42 ,  G05F1/618 ,  G05F1/56 ,  H02J7/34

Abstract: A circuit for controlling a first plurality of transistors connected in parallel and a second plurality of transistors connected in parallel, includes: a first plurality of stages, a respective one of the first plurality of stages being configured to supply a first control signal to a respective one of the first plurality of transistors; and a second plurality of stages, a respective one of the second plurality of stages being configured to supply a second control signal to a respective one of the second plurality of transistors. An output current of the respective one of the first plurality of stages is regulated based on a difference between a first value representative of a sum of output currents of each stage of the first plurality of stages and a second value representative of a sum of set points assigned to the first plurality of stages.

公开(公告)号：US10892344B2

公开(公告)日：2021-01-12

申请号：US15981659

申请日：2018-05-16

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. Zhang

IPC: H01L21/8238 ,  H01L29/51 ,  H01L21/02 ,  H01L21/28 ,  H01L29/45 ,  H01L29/49 ,  H01L21/8234 ,  H01L21/285 ,  H01L21/768 ,  C23C14/04 ,  C23C14/22 ,  H01L29/66

Abstract: Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

公开(公告)号：US10859379B2

公开(公告)日：2020-12-08

申请号：US15683186

申请日：2017-08-22

Applicant: STMicroelectronics, Inc.

Inventor： Dominique Paul Barbier

IPC: G01C21/12 ,  G01C21/28

Abstract: In an embodiment, a method for determining a speed of a vehicle in a dead-reckoning system includes measuring a centripetal acceleration, using an accelerometer, of the vehicle traversing a curved path on a plane of travel. The method also includes measuring an angular velocity, using a gyroscope, of the vehicle. The speed of the vehicle is calculated from the centripetal acceleration and the angular velocity.

公开(公告)号：US20200380116A1

公开(公告)日：2020-12-03

申请号：US16994484

申请日：2020-08-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Maurizio Gentili ,  Massimo Panzica

IPC: G06F21/53 ,  G06F21/57 ,  G06F13/28 ,  H04L29/06 ,  G06F13/24 ,  G06F21/74 ,  G06F21/79

Abstract: A secure engine method includes providing an embedded microcontroller in an embedded device, the embedded microcontroller having internal memory. The method also includes providing a secure environment in the internal memory. The secure environment method recognizes a boot sequence and restricts user-level access to the secure environment by taking control over the secure environment memory. Taking such control may include disabling DMA controllers, configuring at least one memory controller for access to the secure environment, preventing the execution of instructions fetched from outside the secure environment, and only permitting execution of instructions fetched from within the secure environment. Secure engine program instructions are then executed to disable interrupts, perform at least one secure operation, and re-enable interrupts after performing the at least one secure operation. Control over the secure environment memory is released, which can include clearing memory, re-enabling DMA controllers, and restoring memory controller parameters.

公开(公告)号：US10759168B2

公开(公告)日：2020-09-01

申请号：US16357077

申请日：2019-03-18

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon Dodd ,  David S. Hunt ,  Joseph Edward Scheffelin ,  Dana Gruenbacher ,  Stefan H. Hollinger ,  Uwe Schober ,  Peter Janouch

IPC: B41J2/14 ,  B41J2/175

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

公开(公告)号：US10734504B2

公开(公告)日：2020-08-04

申请号：US16020475

申请日：2018-06-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  STMicroelectronics, Inc.

Inventor： Bruce B. Doris ,  Hong He ,  Nicolas J. Loubet ,  Junli Wang

IPC: H01L21/336 ,  H01L29/66 ,  H01L29/78 ,  H01L21/265 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/10 ,  H01L29/165 ,  H01L29/423

Abstract: A method of forming a finFET transistor device includes forming a crystalline, compressive strained silicon germanium (cSiGe) layer over a substrate; masking a first region of the cSiGe layer so as to expose a second region of the cSiGe layer; subjecting the exposed second region of the cSiGe layer to an implant process so as to amorphize a bottom portion thereof and transform the cSiGe layer in the second region to a relaxed SiGe (rSiGe) layer; performing an annealing process so as to recrystallize the rSiGe layer; epitaxially growing a tensile strained silicon layer on the rSiGe layer; and patterning fin structures in the tensile strained silicon layer and in the first region of the cSiGe layer.