Abstract:
A TFT array substrate includes a substrate, a patterned first metallic layer, a patterned stack layer, a patterned dielectric layer, a patterned transparent conductive layer, and a patterned third metallic layer. Elements of each TFT in the TFT array substrate are arranged vertically, so that the TFT array substrate has relatively small fabrication area and is operable with a high conducting current. Further, the storage capacitance can be enhanced by enclosing or sandwiching the second metallic layer with the common lines and the transparent electrodes. In such a way, pixel flashing caused by those coupled signals can be reduced, thus promoting displaying quality thereof.
Abstract:
A color filter having a bi-layer metal grating is formed by nanoimprint lithography. Nanoimprint lithography, a low cost technology, includes two alternatives, i.e., hot-embossing nanoimprint lithography and UV-curable nanoimprint lithography. Manufacture steps includes providing a substrate with a polymer material layer disposed thereon. A plurality of lands and grooves are formed in the polymer material layer, and a first metal layer and a second metal layer are disposed on the surfaces of the lands and grooves, respectively. Finally, a color filter having a bi-layer metal grating is obtained.
Abstract:
A method includes forming a first rectangular mesa from a layer of semiconducting material and forming a first dielectric layer around the first mesa. The method further includes forming a first rectangular mask over a first portion of the first mesa leaving an exposed second portion of the first mesa and etching the exposed second portion of the first mesa to produce a reversed T-shaped fin from the first mesa.
Abstract:
A method of manufacturing a semiconductor device includes forming a gate electrode over a substrate, implanting dopants into the substrate and activating the dopants using laser thermal annealing. During annealing, the laser and substrate are moved relative to one another, and the movement of the laser and the substrate relative to one another does not pause between and during activating one portion of the source/drain regions and activating another portion of the source/drain regions. Each pulse from the laser can respectively irradiate different portions of the source/drain regions, and a spot area of the laser is less than 50 millimeter2.
Abstract:
A method for implementing an IP Multimedia Subsystem (IMS) registration, includes: a Home Subscriber Server (HSS) recording a current registration state of a User Equipment (UE) in response to receiving a Multimedia Authentication Request (MAR) initiated by a Service Call Session Control Function (S-CSCF) selected for the UE when a first Register request is sent by the UE; in response to receiving a second Register request initiated by an Interrogating Call Session Control Function (I-CSCF), the HSS sends the S-CSCF Name to the I-CSCF when the current registration state of the UE is an assigned S-CSCF state. By the scheme, a same S-CSCF is ensured to be used in the two User Authentication Request/User Authentication Answer (UAR/UAA) procedures of the initial IMS registration procedure, and the initial IMS registration of the UE is implemented successfully.
Abstract:
A memory device includes multiple fins formed adjacent to one another, a source region, a drain region, a gate, a wordline, and a bitline contact. At least one of the multiple fins is doped with a first type of impurities and at least one other one of the fins is doped with a second type of impurities. The source region is formed at one end of each of the fins and the drain region is formed at an opposite end of each of the fins. The gate is formed over two of the multiple fins, the wordline is formed over each of the multiple fins, and a bitline contact is formed adjacent at least one of the multiple fins.
Abstract:
Multiple semiconductor devices are formed with different threshold voltages. According to one exemplary implementation, first and second semiconductor devices are formed and doped differently, resulting in different threshold voltages for the first and second semiconductor devices.
Abstract:
A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.
Abstract:
A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.
Abstract:
A semiconductor device includes a substrate and an insulating layer on the substrate. The semiconductor device also includes a fin structure formed on the insulating layer, where the fin structure includes first and second side surfaces, a dielectric layer formed on the first and second side surfaces of the fin structure, a first gate electrode formed adjacent the dielectric layer on the first side surface of the fin structure, a second gate electrode formed adjacent the dielectric layer on the second side surface of the fin structure, and a doped structure formed on an upper surface of the fin structure in the channel region of the semiconductor device.