Abstract:
There is provided with a conductive film. The conductive film has a resin article having a modified portion on a surface thereof, the modified portion being formed by irradiation with an ultraviolet laser and an oxidation process after the irradiation with the ultraviolet laser. The conductive film also has a conductor provided by plating on the modified portion irradiated with the ultraviolet laser.
Abstract:
A configuration is adopted in which an image sensor unit includes: a sensor substrate on which a plurality of photoelectric conversion elements are mounted; a light source that includes light-emitting elements and is for illuminating a document; a light guide that guides light from the light source from one end face in a longitudinal direction and linearly illuminates the document; a rod lens array imaging reflected light from the document on the sensor substrate; and a frame attaching each of these, and in which the frame detachably includes a spacer provided in proximity to the light source, and the spacer includes a light shield roof elongated so as to cover the light source and the end of the light guide.
Abstract:
There is provided with a method of manufacturing an electrostatic adsorptive belt. A portion for forming an electrode pattern on a first resin layer is irradiated with an ultraviolet laser beam. A region including the portion for forming the electrode pattern on the first resin layer is oxidated. The electrode pattern if formed on the first region layer by plating. A second resin layer is formed on a surface of the first resin layer on which the electrode pattern is formed.
Abstract:
An FPC includes: a base film including a first metal sheet; a first adhesive layer laminated on one of surfaces of the base film; and a conductor pattern bonded by the first adhesive layer; wherein a plurality of planar portions held in a planar shape and bending portions to be bent provided between the planar portions are arranged in a longitudinal direction, and the conductor pattern is covered by a metal support cover film including a second metal sheet and a second adhesive layer at the planar portions and is covered by a solder resist at the bending portions.
Abstract:
A circuit board of an image sensor unit of this invention includes a substrate, a first circuit pattern portion formed on the substrate, and a second circuit pattern portion formed continuously from the first circuit pattern portion. A light source is connected to the second circuit pattern portion. The light source is arranged facing an incident surface by bending the second circuit pattern portion.
Abstract:
An image sensor unit includes a frame in which a light source and an image sensor are housed, and a cover member that is bonded to the frame. The cover member is bonded by means of a double-sided tape that includes a film-shaped substrate and adhesive layers formed on both sides of the substrate. Slits that extend from one outer edge in a width direction to an intermediate portion in the width direction and slits that extend from the other outer edge in the width direction to an intermediate portion in the width direction are formed in the double-sided tape. The respective slits that are adjacent include an overlapping portion when viewed in a long-side direction.
Abstract:
A sensor substrate unit is formed by connecting edges of a plurality of sensor substrates in a longitudinal direction. Sensor chips at the edges are mounted beyond the edges. The edges include convex portions and convex portions for connecting the sensor substrates. Farthest tips of the sensor chips are positioned inside of farthest edges of the convex portions and inside of farthest edges of the convex portions in the longitudinal direction.
Abstract:
An image sensor unit includes: a light source including a light emitting element on a light emitting surface; a light guide that causes light from the light source to be incident on a light incident surface facing to the light emitting surface, ejects the light from a light ejecting surface and illuminates a document; a rod lens array that images reflected light from the document; a sensor substrate on which a photoelectric conversion element is mounted, the photoelectric conversion element converting the reflected light imaged by the rod lens array into an electric signal; and a frame that supports the light source, the light guide, the rod lens array and the sensor substrate, wherein positioning sections are provided on an opposite side of the light emitting surface of the light source and at a part of the frame which is disposed at the opposite side of the light emitting surface.
Abstract:
In an image sensor unit including a plurality of sensor chips mounted in a line on a sensor substrate, image signals from the sensor chips are sequentially read according to a reading order among the sensor chips, a current consumption circuit that consumes set current is arranged, and the current consumption circuit starts consuming the set current in response to a signal indicating end of reading of the image signals by all of the sensor chips and ends consuming the set current in response to a signal indicating start of reading of the image signals first by the sensor chip after a start signal to thereby reduce variation in the current consumption of the image sensor unit.
Abstract:
An image sensor unit includes: a light source including a light emitting element on a light emitting surface; a light guide that causes light from the light source to be incident on a light incident surface facing to the light emitting surface, ejects the light from a light ejecting surface and illuminates a document; a rod lens array that images reflected light from the document; a sensor substrate on which a photoelectric conversion element is mounted, the photoelectric conversion element converting the reflected light imaged by the rod lens array into an electric signal; and a frame that supports the light source, the light guide, the rod lens array and the sensor substrate, wherein positioning sections are provided on an opposite side of the light emitting surface of the light source and at a part of the frame which is disposed at the opposite side of the light emitting surface.