Abstract:
Disclosed are quality control methods used in fabrication processes to make bulk-solidifying amorphous alloy parts. The quality control methods include forming a test plaque together with bulk-solidifying amorphous alloy part where the test plaque is formed on the alloy part at a location having a predetermined likelihood of failure, and testing the plaque to determine the quality of the product.
Abstract:
Provided in one embodiment is a method, comprising: forming a part comprising a bulk amorphous alloy, wherein the part comprises a sampling portion; determining a parameter related to the part by detecting by imaging on a surface of the sampling portion presence of crystals of the alloy; and evaluating the part based on the parameter.
Abstract:
An accessory may be provided with a button controller having a microphone and switches. Plastic structures for the accessory may be formed by injection molding. Plastic structures may be molded around switch terminals. Switches may be formed using dome switch members and the switch terminals. A printed circuit with components may be mounted in the plastic structures. Recesses in the structures may be configured to receive the dome switch members, components on the printed circuit board, and wires in a cable. A backplate may be used to cover the printed circuit. A layer of plastic may be molded over the backplate to seal an interface created by the backplate. Cable strain relief structures may be molded into the layer of plastic. A lip on the strain relief structures may prevent particles from entering the controller.
Abstract:
Described herein are methods of constructing a part using BMG layer by layer. In one embodiment, a layer of BMG powder is deposited to selected positions and then fused to a layer below by suitable methods such as laser heating or electron beam heating. The deposition and fusing are then repeated as need to construct the part layer by layer. One or more layers of non-BMG can be used as needed. In one embodiment, layers of BMG can be cut from one or more sheets of BMG to desired shapes, stacked and fused to form the part.
Abstract:
Described herein is a method of selectively depositing molten bulk metallic glass (BMG). In one embodiment, a continuous stream or discrete droplets of molten BMG is deposited to selected positions. The deposition can be repeated as needed layer by layer. One or more layers of non-BMG can be used as needed.
Abstract:
Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.
Abstract:
A display window assembly is mounted in the opening of a bezel of a housing, and a force is exerted against the assembly by a suitable resilient element urging it outward through the opening. The assembly may be mounted on a support or frame, from which depends one or more tabs extending inwardly of the housing. At least one of the tabs is fastened with a fastener that extends from the exterior of the housing, through a portion other than the bezel and through a surface not generally facing the user when the user is viewing the display. The advancement/withdrawal direction of the fastener is not substantially normal to the display window. However, advancement/withdrawal of the fastener causes movement of the tab, and therefore of the assembly, in an adjustment direction substantially normal to the display window to adjust the position of the display window relative to the bezel.
Abstract:
Various embodiments for magnetic detent assemblies provide for detent devices with improved performance and manufacturability. In one embodiment, magnetic detent assemblies provide for custom detent positions and custom force profiles by including a pair of unitary magnetic components each having a special geometry. In an embodiment, the changing area of overlap (and hence magnetic flux) between the magnetic components can give rise to the custom detent positions and custom force profiles. In a specific embodiment, the magnetic components can comprise an N-point star shaped geometry, where the number and distribution of the start wings can be varied to define customized detent positions and the contour of the star wings can be varied to create customized force profiles. In other embodiments, devices such as laptop computers and docking stations for handheld electronic devices can implement multi-position detent hinges with the magnetic detent assemblies.
Abstract:
An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.