ACCURATE MEASUREMENT OF LAYER DIMENSIONS USING XRF
    41.
    发明申请
    ACCURATE MEASUREMENT OF LAYER DIMENSIONS USING XRF 有权
    使用XRF精确测量层数

    公开(公告)号:US20090074137A1

    公开(公告)日:2009-03-19

    申请号:US12272050

    申请日:2008-11-17

    CPC classification number: G01B15/02 G01N23/223 G01N2223/076 H01L22/12

    Abstract: A method for inspection of a sample includes directing an excitation beam to impinge on an area of a planar sample that includes a feature having sidewalls perpendicular to a plane of the sample, the sidewalls having a thin film thereon. An intensity of X-ray fluorescence (XRF) emitted from the sample responsively to the excitation beam is measured, and a thickness of the thin film on the sidewalls is assessed based on the intensity. In another method, the width of recesses in a surface layer of a sample and the thickness of a material deposited in the recesses after polishing are assessed using XRF.

    Abstract translation: 用于检查样品的方法包括引导激发光束撞击平面样品的区域,该平面样品的区域包括具有垂直于样品平面的侧壁的特征,该侧壁在其上具有薄膜。 测量响应于激发光束从样品发射的X射线荧光强度(XRF),并且基于强度来评估侧壁上的薄膜的厚度。 在另一种方法中,使用XRF来评估样品的表面层中的凹陷的宽度和抛光后沉积在凹部中的材料的厚度。

    Overlay metrology using X-rays
    42.
    发明授权
    Overlay metrology using X-rays 有权
    使用X射线覆盖测量

    公开(公告)号:US07481579B2

    公开(公告)日:2009-01-27

    申请号:US11389490

    申请日:2006-03-27

    CPC classification number: G03F7/70633

    Abstract: A method for inspection includes directing a beam of X-rays to impinge upon an area of a sample containing first and second features formed respectively in first and second thin film layers, which are overlaid on a surface of the sample. A pattern of the X-rays diffracted from the first and second features is detected and analyzed in order to assess an alignment of the first and second features.

    Abstract translation: 一种检查方法包括将X射线束引导到包含分别在第一和第二薄膜层上形成的第一和第二特征的样品的区域上,该第一和第二特征覆盖在样品的表面上。 检测和分析从第一和第二特征衍射的X射线的图案,以评估第一和第二特征的对准。

    Control of X-ray beam spot size
    43.
    发明授权
    Control of X-ray beam spot size 有权
    控制X射线束斑大小

    公开(公告)号:US07453985B2

    公开(公告)日:2008-11-18

    申请号:US11822231

    申请日:2007-07-03

    CPC classification number: G01N23/20

    Abstract: A method for analysis of a sample includes directing a beam of radiation to impinge on a target area on a surface of the sample along a beam axis at a plurality of different elevation angles. For each of the different angles, a respective offset of the beam in a direction transverse to the beam axis is determined. While sensing the radiation scattered from the sample at each of the different elevation angles in succession, a transverse correction is applied to at least one of the beam and the sample in order to compensate for the respective offset at each of the different elevation angles.

    Abstract translation: 用于分析样品的方法包括以多个不同的仰角沿着光束轴引导辐射束照射在样品的表面上的目标区域上。 对于每个不同的角度,确定在横向于光束轴线的方向上的光束的相应偏移。 在连续地感测在每个不同仰角处从样品散射的辐射的同时,对波束和样本中的至少一个施加横向校正,以补偿每个不同仰角处的相应偏移。

    Overlay metrology using X-rays
    44.
    发明申请
    Overlay metrology using X-rays 有权
    使用X射线覆盖测量

    公开(公告)号:US20070224518A1

    公开(公告)日:2007-09-27

    申请号:US11389490

    申请日:2006-03-27

    CPC classification number: G03F7/70633

    Abstract: A method for inspection includes directing a beam of X-rays to impinge upon an area of a sample containing first and second features formed respectively in first and second thin film layers, which are overlaid on a surface of the sample. A pattern of the X-rays diffracted from the first and second features is detected and analyzed in order to assess an alignment of the first and second features.

    Abstract translation: 一种检查方法包括将X射线束引导到包含分别在第一和第二薄膜层上形成的第一和第二特征的样品的区域上,该第一和第二特征覆盖在样品的表面上。 检测和分析从第一和第二特征衍射的X射线的图案,以评估第一和第二特征的对准。

    Detection of dishing and tilting using X-ray fluorescence
    45.
    发明授权
    Detection of dishing and tilting using X-ray fluorescence 有权
    使用X射线荧光检测凹陷和倾斜

    公开(公告)号:US07245695B2

    公开(公告)日:2007-07-17

    申请号:US11103071

    申请日:2005-04-11

    CPC classification number: G01N23/223 G01N2223/076

    Abstract: A method for testing a material applied to a surface of a sample includes directing an excitation beam, having a known beam-width and intensity cross-section, onto a region of the sample. An intensity of X-ray fluorescence emitted from the region responsively to the excitation beam is measured. A distribution of the material within the region is estimated, responsively to the measured intensity of the X-ray fluorescence and to the intensity cross-section of the excitation beam, with a spatial resolution that is finer than the beam-width.

    Abstract translation: 用于测试施加到样品表面的材料的方法包括将具有已知束宽度和强度横截面的激发束引导到样品的区域上。 测量从响应于激发光束的区域发射的X射线荧光的强度。 响应于X射线荧光的测量强度和激发光束的强度横截面,估计区域内材料的分布,其空间分辨率比光束宽度更精细。

    Measurement of properties of thin films on sidewalls

    公开(公告)号:US20060274886A1

    公开(公告)日:2006-12-07

    申请号:US11487433

    申请日:2006-07-17

    CPC classification number: G01N23/20

    Abstract: A method for X-ray analysis of a sample includes directing a beam of X-rays to impinge on an area of a periodic feature on a surface of the sample and receiving the X-rays scattered from the surface in a reflection mode so as to detect a spectrum of diffraction in the scattered X-rays as a function of azimuth. The spectrum of diffraction is analyzed in order to determine a dimension of the feature.

    Detection of dishing and tilting using x-ray fluorescence
    47.
    发明申请
    Detection of dishing and tilting using x-ray fluorescence 有权
    使用x射线荧光检测凹陷和倾斜

    公开(公告)号:US20060227931A1

    公开(公告)日:2006-10-12

    申请号:US11103071

    申请日:2005-04-11

    CPC classification number: G01N23/223 G01N2223/076

    Abstract: A method for testing a material applied to a surface of a sample includes directing an excitation beam, having a known beam-width and intensity cross-section, onto a region of the sample. An intensity of X-ray fluorescence emitted from the region responsively to the excitation beam is measured. A distribution of the material within the region is estimated, responsively to the measured intensity of the X-ray fluorescence and to the intensity cross-section of the excitation beam, with a spatial resolution that is finer than the beam-width.

    Abstract translation: 用于测试施加到样品表面的材料的方法包括将具有已知束宽度和强度横截面的激发束引导到样品的区域上。 测量从响应于激发光束的区域发射的X射线荧光的强度。 响应于X射线荧光的测量强度和激发光束的强度横截面,估计区域内材料的分布,其空间分辨率比光束宽度更精细。

    Enhancing resolution of X-ray measurements by sample motion
    48.
    发明授权
    Enhancing resolution of X-ray measurements by sample motion 有权
    通过样本运动提高X射线测量的分辨率

    公开(公告)号:US07113566B1

    公开(公告)日:2006-09-26

    申请号:US11181746

    申请日:2005-07-15

    CPC classification number: G01N23/20

    Abstract: A method for inspection of a sample includes directing a beam of X-rays toward a sample and configuring an array of detector elements to capture the X-rays scattered from the sample. The sample is shifted in a direction parallel to the axis of the array between at least first and second positions, which positions are separated one from another by an increment that is not an integer multiple of the pitch of the array. At least first and second signals are generated by the detector elements responsively to the X-rays captured thereby while the sample is in at least the first and second positions, respectively. The first and second signals are combined so as to determine an X-ray scattering profile of the sample as a function of position along the axis.

    Abstract translation: 用于检查样品的方法包括将X射线束朝向样品引导并且配置检测器元件的阵列以捕获从样品散射的X射线。 样本在至少第一和第二位置之间沿与阵列的轴平行的方向移位,这些位置彼此分开不是阵列的音调的整数倍的增量。 响应于由此捕获的X射线,检测器元件至少产生第一和第二信号,而样品分别处于至少第一和第二位置。 第一和第二信号被组合以确定样品的X射线散射分布作为沿轴的位置的函数。

    Process for measuring overlay misregistration during semiconductor wafer
fabrication
    49.
    发明授权
    Process for measuring overlay misregistration during semiconductor wafer fabrication 失效
    半导体晶片制造过程中测量重叠重合的过程

    公开(公告)号:US5438413A

    公开(公告)日:1995-08-01

    申请号:US25435

    申请日:1993-03-03

    CPC classification number: G03F7/70633

    Abstract: A process for measuring overlay misregistration during semiconductor wafer fabrication including the use of an interferometric microscope in combination with a camera, a wafer transport stage, and data processing electronics to form an inspection system which can utilize either broadband or narrowband light, and large or small numerical aperture (NA) to develop a series of interference images taken at different Z (vertical) planes relative to the surface under investigation or P (pathlength) positions relative to interferometer arm difference. The data in these planes is then used to calculate the magnitude and phase of the mutual coherence between the object wave and the reference wave for each pixel in the image planes, and synthetic images are formed, the brightness of which is proportional to either the complex magnitude (the Magnitude Contrast Image or MCI) or the phase of the mutual coherence as the optical pathlength (the Phase Contrast Image or PCI) is varied. The difference between synthetic images relating to target attribute position and bullet attribute position are then used as a means of detecting misregistration between the processing layer including the bullet attribute and the processing layer including the target attribute.

    Abstract translation: 一种用于测量半导体晶片制造期间的重叠配准的方法,包括使用干涉式显微镜与照相机,晶片传送台和数据处理电子装置组合,形成可利用宽带或窄带光以及大或小的光检测系统 数值孔径(NA)以相对于正在研究的表面或相对于干涉仪臂差的P(路径长度)位置在不同的Z(垂直)平面处拍摄的一系列干涉图像。 然后使用这些平面中的数据来计算像平面中每个像素的对象波和参考波之间的相互相干的幅度和相位,并且形成合成图像,其亮度与复合物 幅度(大小对比度图像或MCI)或作为光程长度(相位对比图像或PCI)的相互相干的相位发生变化。 然后,将与目标属性位置和子弹属性位置相关的合成图像之间的差异用作检测包括子弹属性的处理层和包括目标属性的处理层之间的重合失调的手段。

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