公开(公告)号：US08093705B2

公开(公告)日：2012-01-10

申请号：US12320286

申请日：2009-01-22

Applicant: Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

Inventor： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

IPC: H01L23/50 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L21/481 ,  H01L23/3114 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dual face package includes a semiconductor substrate including a through-electrode connected to a die pad disposed on one side of the semiconductor substrate, and a lower redistribution layer disposed on another side thereof and connected to the through-electrode, an insulating layer including a post electrode connected to the through-electrode, and an upper redistribution layer disposed on one side thereof and connected to the post electrode, and an adhesive layer disposed on the one side of the semiconductor substrate so as to attach the insulating layer to the semiconductor substrate such that the through-electrode is connected to the post electrode.

Abstract translation: 双面包装包括半导体衬底，其包括连接到设置在半导体衬底的一侧的管芯焊盘的通孔和设置在其另一侧并连接到通孔的下再分布层，绝缘层包括： 连接到所述贯通电极的后电极以及设置在其一侧并连接到所述柱电极的上再分配层，以及设置在所述半导体衬底的一侧上以将所述绝缘层附着到所述半导体衬底的粘合层 使得贯通电极连接到柱电极。

公开(公告)号：US20100096749A1

公开(公告)日：2010-04-22

申请号：US12405776

申请日：2009-03-17

Applicant: Woon-Chun KIM ,  Soon-Gyu YIM ,  Young-Do KWEON ,  Jae-Kwang LEE

Inventor： Woon-Chun KIM ,  Soon-Gyu YIM ,  Young-Do KWEON ,  Jae-Kwang LEE

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Abstract translation: 公开了半导体封装及其制造方法。 半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。 通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

公开(公告)号：US20090275575A1

公开(公告)日：2009-11-05

申请号：US12441601

申请日：2007-09-21

Applicant: Nam-Song Choi ,  Young-Mi Kim ,  Young-Hoon Kim ,  Jae-Kwang Lee ,  In-Taek Lim ,  Ho-Jin Choi ,  Hyun-Mo Yang ,  Seung-Kee Moon ,  Soo-Jin Kim ,  Hyun-Jung Yu ,  Jae-Su Shin ,  Young-Min Kwon ,  Sung-Sook Lee ,  Soon-Kil Ahn

Inventor： Nam-Song Choi ,  Young-Mi Kim ,  Young-Hoon Kim ,  Jae-Kwang Lee ,  In-Taek Lim ,  Ho-Jin Choi ,  Hyun-Mo Yang ,  Seung-Kee Moon ,  Soo-Jin Kim ,  Hyun-Jung Yu ,  Jae-Su Shin ,  Young-Min Kwon ,  Sung-Sook Lee ,  Soon-Kil Ahn

IPC: A61K31/5377 ,  C07D213/50 ,  A61K31/4406 ,  A61K31/12 ,  C07C49/255 ,  C07D413/10 ,  A61P35/00

CPC classification number: C07D207/333 ,  C07C49/84 ,  C07D207/335 ,  C07D213/50 ,  C07D213/64 ,  C07D231/12 ,  C07D233/54 ,  C07D233/64 ,  C07D239/26 ,  C07D249/08 ,  C07D261/08 ,  C07D263/32 ,  C07D277/24 ,  C07D277/28 ,  C07D277/30 ,  C07D277/40 ,  C07D307/46 ,  C07D307/52 ,  C07D333/20 ,  C07D333/22 ,  C07D401/10 ,  C07D403/10 ,  C07D405/10 ,  C07D405/12 ,  C07D407/10 ,  C07D409/10 ,  C07D413/10 ,  C07D417/04 ,  C07D417/10

Abstract: Disclosed herein are novel benzophenone derivatives represented by formula I, a pharmaceutically acceptable salt thereof, a hydrate thereof or a solvate thereof, a pharmacological composition containing the same, and a use of the composition as therapeutic drugs. The benzophenone derivatives have an inhibition activity of microtubule formation and can be used to treat a normal proliferative state of a malignant tumor by killing the actively proliferating cells.

Abstract translation: 本文公开了由式I表示的新型二苯甲酮衍生物，其药学上可接受的盐，其水合物或其溶剂合物，含有该二苯甲酮衍生物的药理学组合物，以及该组合物作为治疗药物的用途。 二苯甲酮衍生物具有微管形成的抑制活性，可用于通过杀死活性增殖细胞来治疗恶性肿瘤的正常增殖状态。

公开(公告)号：US07384567B2

公开(公告)日：2008-06-10

申请号：US11015422

申请日：2004-12-20

Applicant: Woo Seok Cheong ,  Yong Goo Yoo ,  Doo Hee Cho ,  Jae Kwang Lee ,  Ki Chul Kim ,  Jeong Dae Suh

Inventor： Woo Seok Cheong ,  Yong Goo Yoo ,  Doo Hee Cho ,  Jae Kwang Lee ,  Ki Chul Kim ,  Jeong Dae Suh

IPC: H01L21/00

CPC classification number: G11B5/3909 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  G01R33/093 ,  G11B5/3163 ,  G11B5/3929 ,  G11B2005/3996 ,  H01F10/3254 ,  H01F10/3268 ,  H01F41/18 ,  H01F41/20 ,  H01F41/308

Abstract: Provided is a method of manufacturing a thin film magnetic head. In particular, a method of manufacturing a thin film magnetic head is provided in which a flow process of a photoresist is applied to separate a hard magnetic layer and a metal multi-layer and a photoresist is used to insulate an upper electrode from a lower electrode in manufacturing a magnetic reproduction device, thereby simplifying and optimizing a manufacturing process and significantly reducing a manufacturing time.

Abstract translation: 提供一种制造薄膜磁头的方法。 特别地，提供一种制造薄膜磁头的方法，其中施加光致抗蚀剂的流动过程以分离硬磁性层和金属多层，并且使用光致抗蚀剂来使上电极与下电极绝缘 在制造磁再现装置中，从而简化和优化制造工艺并显着减少制造时间。