Methods of forming titanium nitride composite layers using composite gases having increasing TiCl4 to NH3 ratios

    公开(公告)号:US06291342B1

    公开(公告)日:2001-09-18

    申请号:US09767523

    申请日:2001-01-23

    Abstract: A method of forming a multilayer titanium nitride film hardly containing any Cl component by a multiple step chemical vapor deposition method, and a method of manufacturing a semiconductor device using the same are provided. In the present invention, a multilayer TiN film is formed by multiple step chemical vapor deposition (CVD) on a semiconductor substrate on which an underlayer is formed. In order to form the multilayer TiN film, an underlayer protective TiN film is formed by forming a first TiN film on the underlayer and NH3 annealing the first TiN film. A main TiN film is formed by forming a second TiN film on the underlayer protective TiN film and NH3 annealing the second TiN film. A source gas used in order to form the first TiN film has a smaller TiCl4 to NH3 gas flow ratio than a source gas for forming the second TiN film. In order to apply the multilayer TiN film to the fabrication of the semiconductor device, an insulating film having a contact hole is formed on a semiconductor substrate. A Ti film is formed on the inner wall of the contact hole. A multilayer TiN film is formed on the Ti film by the multiple step CVD method. A metal plug is formed on the multilayer TiN film.

    MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    46.
    发明申请
    MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    磁性装置及其制造方法

    公开(公告)号:US20130171743A1

    公开(公告)日:2013-07-04

    申请号:US13729147

    申请日:2012-12-28

    CPC classification number: H01L43/12 G11C11/161 H01L27/228

    Abstract: A magnetic device and a method of manufacturing the same. In the method, a lower magnetic layer, an insulation layer, and an upper magnetic layer are sequentially formed on a substrate. An upper magnetic layer pattern is formed by patterning the upper magnetic layer until an upper surface of the insulation layer is exposed. An isolation layer pattern is formed from portions of the insulation layer and the lower magnetic layer by performing an oxidation process on the exposed upper surface of the insulation layer, and an insulation layer pattern and a lower magnetic layer pattern are formed from portions of the insulation layer and the lower magnetic layer, where the isolation layer pattern is not formed.

    Abstract translation: 磁性装置及其制造方法。 在该方法中,在基板上依次形成下磁性层,绝缘层和上磁性层。 通过图案化上磁性层直到绝缘层的上表面露出来形成上部磁性层图案。 通过在绝缘层的暴露的上表面上进行氧化处理,从绝缘层和下部磁性层的部分形成隔离层图案,并且绝缘层图案和下部磁性层图案由绝缘体的一部分形成 层和下磁性层,其中不形成隔离层图案。

    MAGNETIC DEVICE
    47.
    发明申请
    MAGNETIC DEVICE 有权
    磁性装置

    公开(公告)号:US20120292724A1

    公开(公告)日:2012-11-22

    申请号:US13475520

    申请日:2012-05-18

    CPC classification number: H01L43/08

    Abstract: A magnetic tunnel junction element is provided. The magnetic tunnel junction element has first magnetic layer and second magnetic layer formed adjacent, e.g., on lower and upper portions of an insulating layer, respectively and each having a perpendicular magnetic anisotropy, a magnetic field adjustment layer formed on the second magnetic layer and having a perpendicular magnetic anisotropy, and a bather layer formed between the magnetic field adjustment layer and the second magnetic layer. The second magnetic layer and the magnetic field adjustment layer are magnetically decoupled from each other.

    Abstract translation: 提供磁性隧道结元件。 磁性隧道结元件分别具有第一磁性层和第二磁性层,该第一磁性层和第二磁性层分别形成在例如绝缘层的下部和上部上并且各自具有垂直的磁各向异性,磁场调节层形成在第二磁性层上并具有 垂直磁各向异性,以及形成在磁场调整层和第二磁性层之间的沐浴层。 第二磁性层和磁场调节层彼此磁耦合。

    Method For Forming Magnetic Tunnel Junction Structure And Method For Forming Magnetic Random Access Memory Using The Same
    49.
    发明申请
    Method For Forming Magnetic Tunnel Junction Structure And Method For Forming Magnetic Random Access Memory Using The Same 有权
    用于形成磁隧道结结构的方法和用于形成磁性随机存取存储器的方法

    公开(公告)号:US20120135543A1

    公开(公告)日:2012-05-31

    申请号:US13286630

    申请日:2011-11-01

    CPC classification number: H01L43/12 G11C11/161 H01L27/228

    Abstract: A method of fabricating a magnetic tunnel junction structure includes forming a magnetic tunnel junction layer on a substrate. A mask pattern is formed on a region of the second magnetic layer. A magnetic tunnel junction layer pattern and a sidewall dielectric layer pattern on at least one sidewall of the magnetic tunnel junction layer pattern are formed by performing at least one etch process and at least one oxidation process multiple times. The at least one etch process may include a first etch process to etch a portion of the magnetic tunnel junction layer using an inert gas and the mask pattern to form a first etch product. The at least one oxidation process may include a first oxidation process to oxidize the first etch product attached on an etched side of the magnetic tunnel junction layer.

    Abstract translation: 制造磁性隧道结结构的方法包括在衬底上形成磁性隧道结层。 在第二磁性层的区域上形成掩模图案。 通过多次执行至少一个蚀刻工艺和至少一个氧化工艺来形成在磁性隧道结层图案的至少一个侧壁上的磁性隧道结层图案和侧壁电介质层图案。 所述至少一个蚀刻工艺可以包括使用惰性气体蚀刻磁性隧道结层的一部分并且掩模图案以形成第一蚀刻产物的第一蚀刻工艺。 所述至少一个氧化工艺可以包括第一氧化工艺以氧化附着在磁性隧道结层的蚀刻侧上的第一蚀刻产物。

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